Slotted substrate and method of making
    2.
    发明授权
    Slotted substrate and method of making 有权
    开槽底材和制作方法

    公开(公告)号:US07238293B2

    公开(公告)日:2007-07-03

    申请号:US10601148

    申请日:2003-06-20

    IPC分类号: B41J2/16

    摘要: The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling slot.

    摘要翻译: 所描述的实施例涉及开槽衬底及其形成方法。 一种示例性方法在第一衬底表面上形成足以暴露第一表面的第一区域的硬掩模,并且通过少于第一表面的第一区域的整体在衬底中形成狭缝部分。 狭槽部分在第一表面处具有小于第一区域的横截面面积的横截面积。 在形成狭缝部分之后,该方法蚀刻基板以从第一区域内移除材料以形成流体处理槽。

    Slotted substrate and method of making
    3.
    发明授权
    Slotted substrate and method of making 有权
    开槽底材和制作方法

    公开(公告)号:US06648454B1

    公开(公告)日:2003-11-18

    申请号:US10283767

    申请日:2002-10-30

    IPC分类号: B41J205

    摘要: The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling

    摘要翻译: 所描述的实施例涉及开槽衬底及其形成方法。 一种示例性方法在第一衬底表面上形成足以暴露第一表面的第一区域的硬掩模,并且通过少于第一表面的第一区域的整体在衬底中形成狭缝部分。 狭槽部分在第一表面处具有小于第一区域的横截面面积的横截面积。 在形成狭缝部分之后,该方法蚀刻基底以从第一区域内移除材料以形成流体处理