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公开(公告)号：US20090162928A1
公开(公告)日：2009-06-25
申请号：US12396504
申请日：2009-03-03
IPC分类号： C12M1/00
CPC分类号： G01N21/0332 , B01L3/5025 , B01L3/502738 , B01L3/50851 , B01L7/52 , B01L2200/0642 , B01L2200/0689 , B01L2300/0829 , B01L2300/1805 , Y10T436/111666 , Y10T436/2575
摘要： Sample processing devices may include compression structures that provide for the transfer of force from a platen to a platform such as a thermal block on which the sample processing device is located during processing. The sample processing devices may include a fill reservoir structure with various features such as arcuate edges, radially aligned exit channels, support structures, and selectively variable heights with a corresponding variable volume distribution.
摘要翻译： 样品处理装置可以包括压缩结构，其提供将压力从压板传递到诸如加工过程中样品处理装置所处的热块的平台。 样品处理装置可以包括具有各种特征的填充储存器结构，例如弓形边缘，径向对准的出口通道，支撑结构以及具有相应的可变体积分布的选择性可变高度。
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公开(公告)号：US07507376B2
公开(公告)日：2009-03-24
申请号：US10325723
申请日：2002-12-19
IPC分类号： B01L3/00
CPC分类号： G01N21/0332 , B01L3/5025 , B01L3/502738 , B01L3/50851 , B01L7/52 , B01L2200/0642 , B01L2200/0689 , B01L2300/0829 , B01L2300/1805 , Y10T436/111666 , Y10T436/2575
摘要： Sample processing devices may include compression structures that provide for the transfer of force from a platen to a platform such as a thermal block on which the sample processing device is located during processing. The sample processing devices may include a fill reservoir structure with various features such as arcuate edges, radially aligned exit channels, support structures, and selectively variable heights with a corresponding variable volume distribution.
摘要翻译： 样品处理装置可以包括压缩结构，其提供将压力从压板传递到诸如加工过程中样品处理装置所处的热块的平台。 样品处理装置可以包括具有各种特征的填充储存器结构，例如弓形边缘，径向对准的出口通道，支撑结构以及具有相应的可变体积分布的选择性可变高度。
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公开(公告)号：USD492792S1
公开(公告)日：2004-07-06
申请号：US29172950
申请日：2002-12-19
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