摘要:
An assembled honeycomb structure includes at least two prismatic honeycomb segments. An outer cross section of each of the at least two prismatic honeycomb segments perpendicular to a flow direction in an interior of the assembled honeycomb structure is a quadrangle with included angles of one of: (i) about 60° and about 120°, or (ii) about 60°, about 90° and about 120°.
摘要:
The invention relates to the field of materials science and to a device for reducing pressure in cavities in media at higher temperatures, such as those devices which can be used for devices for hot-dip coating metal materials in the metal processing industry for example. The aim of the invention is to provide a device by means of which pressure can be reduced in the cavity of the hollow bodies in a reliable and controlled manner and simultaneously the penetration of the media can be delayed or completely prevented at the higher temperatures. This is achieved by a device for reducing pressure in hollow bodies in media at higher temperatures, wherein at least one opening to the cavity of the hollow body is provided in hollow body regions which are not used for the intended application, said opening being closed from the medium surrounding the hollow body by at least one component made of a gas-permeable metal or ceramic material.
摘要:
A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.
摘要:
The invention relates to the field of mechanical engineering and refers to a radiation protective shield for vacuum furnaces and protective atmosphere furnaces, which shield is used for the best possible shielding from thermal radiation. The object of the present invention is to disclose thermal radiation protective shields of reduced weight with identical or lower effective emissivity. The object is attained by a thermal radiation protective shield for vacuum furnaces and protective atmosphere furnaces, composed of at least one porous ceramic and/or metallic material that has high thermal radiation-reflecting properties at least on a surface in the direction of the heat source.
摘要:
The invention relates to the field of materials science and to a device for reducing pressure in cavities in media at higher temperatures, such as those devices which can be used for devices for hot-dip coating metal materials in the metal processing industry for example. The aim of the invention is to provide a device by means of which pressure can be reduced in the cavity of the hollow bodies in a reliable and controlled manner and simultaneously the penetration of the media can be delayed or completely prevented at the higher temperatures. This is achieved by a device for reducing pressure in hollow bodies in media at higher temperatures, wherein at least one opening to the cavity of the hollow body is provided in hollow body regions which are not used for the intended application, said opening being closed from the medium surrounding the hollow body by at least one component made of a gas-permeable metal or ceramic material.
摘要:
A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.
摘要:
The disclosed invention relates to the field of ceramics and concerns an open-cell expanded ceramic which may be used in the form of a deep-bed filter, and a process for the production thereof. The primary object is to produce an open-cell expanded ceramic by a simple and economical process. This object is attained by an open-cell expanded ceramic in which the inner cavities, cracks and the porosity of the ceramic members are filled partially or completely by one or a plurality of metal and/or ceramic phases and/or glass phases. The open-cell expanded ceramic is also produced in that during or after sintering the cavities, cracks and the porosity of the ceramic members are partially or completely filled with a melt or a suspension which melt below the melting temperature of the expanded ceramic, have a coefficient of expansion similar to the coefficient of expansion of the expanded ceramic, and a very good wetting capacity, and only react partially or not at all with constituents of the expanded ceramic.