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    Robotic die sorter with optical inspection system
    1.
    发明授权
    Robotic die sorter with optical inspection system 失效
    机器人分拣机配有光学检测系统

    公开(公告)号：US07764366B2

    公开(公告)日：2010-07-27

    申请号：US11485193

    申请日：2006-07-11

    申请人： John D. Moore ,  Lawrence F. Roberts ,  Miroslaw Sokol

    发明人： John D. Moore ,  Lawrence F. Roberts ,  Miroslaw Sokol

    IPC分类号： G01N21/00

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/67271 ,  H01L21/67288

    摘要： A robotic die sorter having pick and place arm assemblies and a multi-camera optical inspection system is disclosed. A pick arm of the pick arm assembly picks a die from a semiconductor wafer, and a place arm of the place arm assembly receives the die from the pick arm and places same in a reel of pocketed tape. After picking, the pick arm and the place arm are rotated into facing arrangement, whereupon the die is transferred to the place head of the place arm and a camera of the optical inspection system to detect defects in the die. After inspection, the place arm rotates toward the pocketed tape and places the die into the pocketed tape. Additional cameras of the optical inspection system allow for calibration of the pick and place arms, as well as monitoring of the die transfer process.

    摘要翻译： 公开了具有拾取和放置臂组件的机器人模具分拣机和多相机光学检查系统。 拾取臂组件的拾取臂从半导体晶片拾取模具，并且放置臂组件的放置臂从拾取臂接收模具并将其放置在带状的卷带中。 拾取后，拾取臂和放置臂旋转成面对的布置，然后将模具转移到位置臂的位置头部和光学检查系统的照相机，以检测模具中的缺陷。 检查后，位置臂朝向袋状胶带旋转，并将模具放入袋状胶带中。 光学检查系统的其他相机允许校准拾取和放置臂，以及监测模具转移过程。

    Robotic die sorter with optical inspection system
    2.
    发明申请
    Robotic die sorter with optical inspection system 失效
    机器人分拣机配有光学检测系统

    公开(公告)号：US20080014073A1

    公开(公告)日：2008-01-17

    申请号：US11485193

    申请日：2006-07-11

    申请人： John D. Moore ,  Lawrence F. Roberts ,  Miroslaw Sokol

    发明人： John D. Moore ,  Lawrence F. Roberts ,  Miroslaw Sokol

    IPC分类号： B65G59/00

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/67271 ,  H01L21/67288

    摘要： A robotic die sorter having pick and place arm assemblies and a mutli-camera optical inspection system is disclosed. A pick arm of the pick arm assembly picks a die from a semiconductor wafer, and a place arm of the place arm assembly receives the die from the pick arm and places same in a reel of pocketed tape. After picking, the pick arm and the place arm are rotated into facing arrangement, whereupon the die is transferred to the place head of the place arm and a camera of the optical inspection system to detect defects in the die. After inspection, the place arm rotates toward the pocketed tape and places the die into the pocketed tape. Additional cameras of the optical inspection system allow for calibration of the pick and place arms, as well as monitoring of the die transfer process.

    摘要翻译： 公开了具有拾取和放置臂组件的机器人模具分拣机和多相机光学检查系统。 拾取臂组件的拾取臂从半导体晶片拾取模具，并且放置臂组件的放置臂从拾取臂接收模具并将其放置在带状的卷带中。 拾取后，拾取臂和放置臂旋转成面对的布置，然后将模具转移到位置臂的位置头部和光学检查系统的照相机，以检测模具中的缺陷。 检查后，放置臂朝向袋状胶带旋转，将模具放入袋状胶带中。 光学检查系统的其他相机允许校准拾取和放置臂，以及监测模具转移过程。

    Mounting apparatus for electronic parts
    3.
    发明授权
    Mounting apparatus for electronic parts 失效
    电子零件安装装置

    公开(公告)号：US06474710B2

    公开(公告)日：2002-11-05

    申请号：US10044189

    申请日：2002-01-11

    申请人： Zvi Bendat ,  Miroslaw Sokol

    发明人： Zvi Bendat ,  Miroslaw Sokol

    IPC分类号： B25J1506

    CPC分类号： B25J19/023 ,  B25J15/0616 ,  H05K13/0812 ,  Y10T29/53091 ,  Y10T29/53191

    摘要： Mounting apparatus for electronic parts includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.

    摘要翻译： 用于电子部件的安装装置包括安装头和用于选择性地夹持位于夹持机构的一侧附近的物体的抽吸操作夹持机构。 还提供一种吸入操作的附接机构，用于选择性地和可移除地将夹持机构附接到安装头，由此夹持机构可从安装头移除，因此是可更换的。 安装装置还具有观察机构，包括相机，用于观察由夹持机构夹持的物体。 观察机构位于夹持机构的相对侧。 夹持机构具有透光部，该透光部以这样的方式定位，使得由夹持机构夹持的物体可以通过相机通过夹持机构观看。

    Optical system for aligning a pair of objects
    4.
    发明授权
    Optical system for aligning a pair of objects 失效
    用于对准一对物体的光学系统

    公开(公告)号：US06781775B2

    公开(公告)日：2004-08-24

    申请号：US10272526

    申请日：2002-10-16

    申请人： Zvi Bendat ,  Miroslaw Sokol

    发明人： Zvi Bendat ,  Miroslaw Sokol

    IPC分类号： G02B504

    CPC分类号： G02B27/144 ,  G02B5/04 ,  H05K13/0812

    摘要： An optical probe for use in accurately aligning the surfaces of microelectronic components that are to be joined together includes an optical device adapted to superimpose the images of a pair of components positioned on either side of the device. The optical device comprises an optical beam-splitter and plurality of prisms having mirror surfaces arranged so that the superposition of images takes place at the partially reflective interface within the beam-splitter. The resulting superimposed image of the die and substrate is displaced laterally from the microelectronic components so that the image is not projected onto either component.

    摘要翻译： 用于精确对准要接合在一起的微电子部件的表面的光学探针包括适于叠加位于设备的任一侧上的一对部件的图像的光学装置。 光学装置包括光束分离器和多个棱镜，其具有布置成使得图像的叠加在分束器内的部分反射界面处发生的镜面。 所得到的模具和衬底的叠加图像从微电子部件横向移位，使得图像不会投影到任一部件上。

    Mounting apparatus for electronic parts
    5.
    发明授权
    Mounting apparatus for electronic parts 失效
    电子零件安装装置

    公开(公告)号：US06203082B1

    公开(公告)日：2001-03-20

    申请号：US09351946

    申请日：1999-07-12

    申请人： Zvi Bendat ,  Miroslaw Sokol

    发明人： Zvi Bendat ,  Miroslaw Sokol

    IPC分类号： B25J1506

    CPC分类号： B25J19/023 ,  B25J15/0616 ,  H05K13/0812 ,  Y10T29/53091 ,  Y10T29/53191

    摘要： Mounting apparatus for electronic parts is disclosed. More particularly, the mounting apparatus includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.

    摘要翻译： 公开了用于电子部件的安装装置。 更具体地，安装装置包括安装头和用于选择性地夹持位于夹持机构的一侧附近的物体的抽吸操作夹持机构。 还提供一种吸入操作的附接机构，用于选择性地和可移除地将夹持机构附接到安装头，由此夹持机构可从安装头移除，因此是可更换的。 安装装置还具有观察机构，包括相机，用于观察由夹持机构夹持的物体。 观察机构位于夹持机构的相对侧。 夹持机构具有透光部，该透光部以这样的方式定位，使得由夹持机构夹持的物体可以通过相机通过夹持机构观看。