公开(公告)号：US20120106032A1

公开(公告)日：2012-05-03

申请号：US13345227

申请日：2012-01-06

申请人： John D. Prymak ,  Chris Stolarski ,  Alethia Melody ,  Anthony P. Chacko ,  Gregory J. Dunn

发明人： John D. Prymak ,  Chris Stolarski ,  Alethia Melody ,  Anthony P. Chacko ,  Gregory J. Dunn

IPC分类号： H01G9/025 ,  H01G9/04 ,  H01G9/15 ,  H01G7/00

CPC分类号： H05K1/162 ,  H01G9/012 ,  H01G9/042 ,  H01G9/045 ,  H01G9/15 ,  H05K3/429 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09909 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/435

摘要： A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.

摘要翻译： 一种用于形成具有电容的叠层的方法和由此形成的层压体。 该方法包括以下步骤：提供衬底并将导电箔层压在衬底上，其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与另外的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电对，并且在导电箔和阳极迹线之间形成阳极导电耦合。