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公开(公告)号：US20120106032A1
公开(公告)日：2012-05-03
申请号：US13345227
申请日：2012-01-06
CPC分类号： H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
摘要： A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
摘要翻译： 一种用于形成具有电容的叠层的方法和由此形成的层压体。 该方法包括以下步骤：提供衬底并将导电箔层压在衬底上，其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与另外的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电对，并且在导电箔和阳极迹线之间形成阳极导电耦合。
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公开(公告)号：US20100020473A1
公开(公告)日：2010-01-28
申请号：US12180768
申请日：2008-07-28
IPC分类号： H01G9/15
CPC分类号： H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
摘要： A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
摘要翻译： 一种用于形成具有电容的叠层的方法和由此形成的层压体。 该方法包括以下步骤：提供衬底并将导电箔层压在衬底上，其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与另外的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电对，并且在导电箔和阳极迹线之间形成阳极导电耦合。
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公开(公告)号：US08410536B2
公开(公告)日：2013-04-02
申请号：US13345227
申请日：2012-01-06
IPC分类号： H01L27/108 , H01G4/005
CPC分类号： H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
摘要： A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
摘要翻译： 一种用于形成具有电容的叠层的方法和由此形成的层压体。 该方法包括以下步骤：提供衬底并将导电箔层压在衬底上，其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与另外的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电对，并且在导电箔和阳极迹线之间形成阳极导电耦合。
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公开(公告)号：US08470680B2
公开(公告)日：2013-06-25
申请号：US12180768
申请日：2008-07-28
IPC分类号： H01G4/005
CPC分类号： H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
摘要： A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
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公开(公告)号：US20080216296A1
公开(公告)日：2008-09-11
申请号：US12031092
申请日：2008-02-14
申请人： John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
发明人： John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
IPC分类号： H01G4/002
CPC分类号： H01G9/0029 , H01G9/012 , H01G9/0425 , H01G9/055 , H01G9/15 , H05K1/185 , Y10T29/417
摘要： An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
摘要翻译： 一种形成电容器的改进方法。 该方法包括以下步骤：提供金属箔; 在金属箔上形成电介质; 将非导电聚合物坝施加在电介质上以隔离电介质的离散区域; 在电介质上的离散区域的至少一个离散区域中形成阴极; 并且在非导电聚合物阻挡件处切割金属箔以将包括一个阴极，电介质的一个离散区域和金属箔的一部分的至少一个电容器与电介质的离散区域隔离。
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公开(公告)号：US07745281B2
公开(公告)日：2010-06-29
申请号：US12031092
申请日：2008-02-14
申请人： John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
发明人： John D. Prymak , Chris Stolarski , David Jacobs , Chris Wayne , Philip Lessner , John T. Kinard , Alethia Melody , Gregory Dunn , Robert T. Croswell , Remy J. Chelini
IPC分类号： H01L21/8242
CPC分类号： H01G9/0029 , H01G9/012 , H01G9/0425 , H01G9/055 , H01G9/15 , H05K1/185 , Y10T29/417
摘要： An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
摘要翻译： 一种形成电容器的改进方法。 该方法包括以下步骤：提供金属箔; 在金属箔上形成电介质; 将非导电聚合物坝施加在电介质上以隔离电介质的离散区域; 在电介质上的离散区域的至少一个离散区域中形成阴极; 并且在非导电聚合物阻挡件处切割金属箔以将包括一个阴极，电介质的一个离散区域和金属箔的一部分的至少一个电容器与电介质的离散区域隔离。
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公开(公告)号：US20100177460A1
公开(公告)日：2010-07-15
申请号：US12726467
申请日：2010-03-18
申请人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell
发明人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell
CPC分类号： H01G9/15 , H01G9/0029
摘要： An improved method for forming a capacitor. The method includes: providing a carrier with a channel therein; providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil; securing the metal foil into the channel with the first dielectric away from a channel floor; inserting an insulative material between the metal foil and each side wall of the channel; forming a cathode layer on the first dielectric between the insulative material; forming a conductive layer on the cathode layer and in electrical contact with the carrier; lap cutting the carrier parallel to the metal foil such that the valve metal is exposed; and dice cutting to form singulated capacitors.
摘要翻译： 一种形成电容器的改进方法。 该方法包括：在其中提供具有通道的载体; 在所述金属箔的第一面上提供具有第一电介质的阀金属的金属箔; 将金属箔固定到通道中，使第一电介质远离通道底板; 在金属箔和通道的每个侧壁之间插入绝缘材料; 在绝缘材料之间的第一电介质上形成阴极层; 在阴极层上形成导电层并与载体电接触; 搭载平行于金属箔的载体，使得阀金属暴露; 和骰子切割以形成单个电容器。
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公开(公告)号：US20080273291A1
公开(公告)日：2008-11-06
申请号：US12098593
申请日：2008-04-07
申请人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chellni , Robert T. Croswell
发明人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chellni , Robert T. Croswell
IPC分类号： H01G9/00
CPC分类号： H01G9/15 , H01G9/0029 , Y10T29/417
摘要： An improved method for forming a capacitor. The method includes: providing a carrier with a channel therein; providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil; securing the metal foil into the channel with the first dielectric away from a channel floor; inserting an insulative material between the metal foil and each side wall of the channel; forming a cathode layer on the first dielectric between the insulative material; forming a conductive layer on the cathode layer and in electrical contact with the carrier; lap cutting the carrier parallel to the metal foil such that the valve metal is exposed; and dice cutting to form singulated capacitors.
摘要翻译： 一种形成电容器的改进方法。 该方法包括：在其中提供具有通道的载体; 在所述金属箔的第一面上提供具有第一电介质的阀金属的金属箔; 将金属箔固定到通道中，使第一电介质远离通道底板; 在金属箔和通道的每个侧壁之间插入绝缘材料; 在绝缘材料之间的第一电介质上形成阴极层; 在阴极层上形成导电层并与载体电接触; 搭载平行于金属箔的载体，使得阀金属暴露; 和骰子切割以形成单个电容器。
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公开(公告)号：US07833292B2
公开(公告)日：2010-11-16
申请号：US12098593
申请日：2008-04-07
申请人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell
发明人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell
IPC分类号： H01G9/00
CPC分类号： H01G9/15 , H01G9/0029 , Y10T29/417
摘要： An improved method for forming a capacitor. The method includes providing a carrier with a channel therein, providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil, securing the metal foil into the channel with the first dielectric away from a channel floor, inserting an insulative material between the metal foil and each side wall of the channel, forming a cathode layer on the first dielectric between the insulative material, forming a conductive layer on the cathode layer and in electrical contact with the carrier, lap cutting the carrier parallel to the metal foil such that the valve metal is exposed, and dice cutting to form singulated capacitors.
摘要翻译： 一种形成电容器的改进方法。 该方法包括在其中提供具有通道的载体，在金属箔的第一面上提供具有阀金属的金属箔，其具有第一电介质，将金属箔固定到通道中，使第一电介质远离通道底板，插入 在金属箔和通道的每个侧壁之间的绝缘材料，在绝缘材料之间的第一电介质上形成阴极层，在阴极层上形成导电层并与载体电接触，将载体平行于 金属箔使得金属金属暴露，并且切割切割以形成单个电容器。
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