公开(公告)号：US06405429B1

公开(公告)日：2002-06-18

申请号：US09383720

申请日：1999-08-26

申请人： John Whittier Slemmons ,  Jay Arthur Messner ,  Frank John Woolston ,  Patrick Jordan Redmond ,  Pierino Italo Zappella ,  William Richard Fewer

发明人： John Whittier Slemmons ,  Jay Arthur Messner ,  Frank John Woolston ,  Patrick Jordan Redmond ,  Pierino Italo Zappella ,  William Richard Fewer

IPC分类号： H01R9300

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/75 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/13144 ,  H01L2224/45124 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49204 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/48

摘要： A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as electroplating or vacuum deposition, over a release layer deposited on a ceramic, glass or similar carrier. The microbeam material adheres only very weakly to the release layer. After the inner ends of the microbeams have been bonded to IC bond pads, such as by flip chip bump bonding, and the integrated circuit has been fully tested, the IC is lifted away from the carrier, causing the microbeams to peel away from the release layer. After straightening the microbeams against a flat surface, the outer ends of the microbeams may then be bonded to contacts on an MCM or other substrate. The method permits full electrical testing at speed and high speed bonding. The method significantly reduces mechanical stresses in interconnect bonds and thereby improves integrated circuit reliability.

摘要翻译： 提供微束互连方法以将集成电路接合焊盘连接到衬底触点。 导电引线（微束）通过诸如电镀或真空沉积的方法可释放地形成在沉积在陶瓷，玻璃或类似载体上的剥离层上。 微束材料仅粘附到释放层很弱。 在微束的内端已经结合到IC焊盘上，例如通过倒装芯片凸块接合，并且集成电路已经被充分测试，IC被从载体上提起，导致微束从释放中剥离 层。 在将微梁对准平坦表面之后，微束体的外端然后可以结合到MCM或其它基底上的接触。 该方法允许在速度和高速键合下进行全面的电气测试。 该方法显着降低了互连接合中的机械应力，从而提高了集成电路的可靠性。