公开(公告)号：US06405429B1

公开(公告)日：2002-06-18

申请号：US09383720

申请日：1999-08-26

申请人： John Whittier Slemmons ,  Jay Arthur Messner ,  Frank John Woolston ,  Patrick Jordan Redmond ,  Pierino Italo Zappella ,  William Richard Fewer

发明人： John Whittier Slemmons ,  Jay Arthur Messner ,  Frank John Woolston ,  Patrick Jordan Redmond ,  Pierino Italo Zappella ,  William Richard Fewer

IPC分类号： H01R9300

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/75 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/13144 ,  H01L2224/45124 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49204 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/48

摘要： A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as electroplating or vacuum deposition, over a release layer deposited on a ceramic, glass or similar carrier. The microbeam material adheres only very weakly to the release layer. After the inner ends of the microbeams have been bonded to IC bond pads, such as by flip chip bump bonding, and the integrated circuit has been fully tested, the IC is lifted away from the carrier, causing the microbeams to peel away from the release layer. After straightening the microbeams against a flat surface, the outer ends of the microbeams may then be bonded to contacts on an MCM or other substrate. The method permits full electrical testing at speed and high speed bonding. The method significantly reduces mechanical stresses in interconnect bonds and thereby improves integrated circuit reliability.

摘要翻译： 提供微束互连方法以将集成电路接合焊盘连接到衬底触点。 导电引线（微束）通过诸如电镀或真空沉积的方法可释放地形成在沉积在陶瓷，玻璃或类似载体上的剥离层上。 微束材料仅粘附到释放层很弱。 在微束的内端已经结合到IC焊盘上，例如通过倒装芯片凸块接合，并且集成电路已经被充分测试，IC被从载体上提起，导致微束从释放中剥离 层。 在将微梁对准平坦表面之后，微束体的外端然后可以结合到MCM或其它基底上的接触。 该方法允许在速度和高速键合下进行全面的电气测试。 该方法显着降低了互连接合中的机械应力，从而提高了集成电路的可靠性。

公开(公告)号：US06297069B1

公开(公告)日：2001-10-02

申请号：US09239469

申请日：1999-01-28

申请人： Pierino Italo Zappella ,  William Richard Fewer

发明人： Pierino Italo Zappella ,  William Richard Fewer

IPC分类号： H01L2156

CPC分类号： B81C1/00896

摘要： A method is provided for supporting the mechanical members of a micro-electronic substrate during the manufacture of the substrate into a micro-mechanical or micro-electromechanical device. The method provides supporting material that surrounds the various mechanical members of the micro-electronic substrate and stabilizes these mechanical members during manufacture. The method also facilitates precise photolithographic as well as other microfabrication techniques. Specifically, the method provides support material that surrounds the perimeter of the micro-electronic substrate and that has a surface that is coplanar with one surface of the micro-electronic substrate. Photoresist or other materials can then be deposited, such as by spinning, on the surface of the micro-electronic substrate such that the edges of the photoresist or other materials lie upon the supporting material. By placing the outer edges of the photoresist or other material on the surface of the support material, the surface of the micro-electronic substrate remains planar for subsequent photolithographic or other microfabrication procedures. An intermediate micro-electronic device assembly is also provided in which a mechanical member, such as a membrane, is supported by the supporting material.

摘要翻译： 提供了一种用于在将基板制造成微机电或微机电装置期间将微电子基板的机械构件支撑的方法。 该方法提供围绕微电子基板的各种机械构件的支撑材料，并且在制造期间使这些机械构件稳定。 该方法还有助于精确的光刻以及其他微细加工技术。 具体地，该方法提供围绕微电子基板的周边并且具有与微电子基板的一个表面共面的表面的支撑材料。 然后可以将光致抗蚀剂或其它材料例如通过旋转沉积在微电子基板的表面上，使得光致抗蚀剂或其它材料的边缘位于支撑材料上。 通过将光致抗蚀剂或其他材料的外边缘放置在支撑材料的表面上，微电子基板的表面保持平面以用于随后的光刻或其它微细加工步骤。 还提供了一种中间微电子器件组件，其中诸如膜的机械构件由支撑材料支撑。