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公开(公告)号:US10318266B2
公开(公告)日:2019-06-11
申请号:US15360976
申请日:2016-11-23
Applicant: Johnson Controls Technology Company
Inventor: Joseph R. Ribbich , Jacob P. Hicks , Zachary N. Posten , Daniel R. Gottschalk , Michael L. Ribbich , Charles J. Gaidish
IPC: G06F8/61 , G05B19/048 , G06F8/65 , G05B19/042 , F24F11/30 , F24F11/62 , G05B15/02 , F24F110/10 , F24F11/63 , F24F11/56 , F24F11/59 , F24F11/52
Abstract: A thermostat includes a motherboard, a first modular board, and a display. The motherboard is configured to perform a thermostat function and generate a user interface a user interface including information relating to the thermostat function. The first modular board is configured to be added to the thermostat by coupling the first modular board to the motherboard and to be removed from the thermostat by decoupling the first modular board from the motherboard. The first modular board is configured to supplement the thermostat function performed by the motherboard when the first modular board is coupled to the motherboard. The display is communicably coupled to the motherboard. The display is configured to display the user interface. The motherboard is configured to adaptively reconfigure the user interface to include supplemental information provided by the first modular board in response to coupling of the first modular board to the motherboard.
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公开(公告)号:US20170146260A1
公开(公告)日:2017-05-25
申请号:US15360976
申请日:2016-11-23
Applicant: Johnson Controls Technology Company
Inventor: Joseph R. Ribbich , Jacob P. Hicks , Zachary N. Posten , Daniel R. Gottschalk , Michael L. Ribbich , Charles J. Gaidish
IPC: F24F11/00 , G05B19/048
CPC classification number: G05B19/048 , F24F11/30 , F24F11/52 , F24F11/56 , F24F11/59 , F24F11/62 , F24F11/63 , F24F2110/10 , G05B15/02 , G05B19/0426 , G05B2219/2614 , G05B2219/2642
Abstract: A thermostat includes a motherboard, a first modular board, and a display. The motherboard is configured to perform a thermostat function and generate a user interface a user interface including information relating to the thermostat function. The first modular board is configured to be added to the thermostat by coupling the first modular board to the motherboard and to be removed from the thermostat by decoupling the first modular board from the motherboard. The first modular board is configured to supplement the thermostat function performed by the motherboard when the first modular board is coupled to the motherboard. The display is communicably coupled to the motherboard. The display is configured to display the user interface. The motherboard is configured to adaptively reconfigure the user interface to include supplemental information provided by the first modular board in response to coupling of the first modular board to the motherboard.
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