公开(公告)号：US20130032842A1

公开(公告)日：2013-02-07

申请号：US13563227

申请日：2012-07-31

申请人： Jong Kil PARK ,  Sung Uk Zhang ,  Jong Sup Song

发明人： Jong Kil PARK ,  Sung Uk Zhang ,  Jong Sup Song

IPC分类号： H01L33/60 ,  H01L33/48

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/075 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00

摘要： There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a body part including a through hole formed in a thickness direction; at least one light emitting device disposed within the through hole; and a wavelength conversion part filling the through hole and supporting the light emitting device.

摘要翻译： 提供了一种发光器件封装及其制造方法。 发光器件封装包括：主体部，包括沿厚度方向形成的通孔; 设置在通孔内的至少一个发光器件; 以及波长转换部分，其填充所述通孔并支撑所述发光器件。