-
1.发明申请公开(公告)号：US20130182740A1
公开(公告)日：2013-07-18
申请号：US13823141
申请日：2010-09-27
申请人： Cheon-Woo Kim , Seok-Mo Choi , Hyun-Jun Jo , Jong-Kil Park , Young-Bu Choi
发明人： Cheon-Woo Kim , Seok-Mo Choi , Hyun-Jun Jo , Jong-Kil Park , Young-Bu Choi
CPC分类号： H05B6/36 , F23G5/10 , F23G2204/204 , F27B14/063 , F27B14/14 , H05B6/24
摘要： A cold crucible induction melter includes an induction coil and a melting furnace. The induction coil serves as a water cooled segment to directly transmit an induced current to a molten material in the cold crucible induction melter (CCIM), improving energy efficiency. Simultaneously, the structure of the CCIM is simplified and enables a smooth discharge even when the molten material consists of a ceramic or a metal material with a high melting point. The cold crucible induction melter heats and melts waste using an induced current which is generated in a water cooled segment by a high frequency current that is applied to the induction coil. The water cooled segment and the induction coil are disposed in a vertical direction so that the induced current that is generated by the induction coil is directly transmitted to the molten material.
摘要翻译： 冷坩埚感应胶机包括感应线圈和熔化炉。 感应线圈用作水冷段，以将感应电流直接传递到冷坩埚感应熔化器（CCIM）中的熔融材料，从而提高能量效率。 同时，即使熔融材料由具有高熔点的陶瓷或金属材料组成，CCIM的结构也被简化，并且能够平稳地放电。 冷坩埚感应熔化器使用施加到感应线圈的高频电流在水冷段中产生的感应电流来加热和熔化废物。 水冷段和感应线圈沿垂直方向设置，使得由感应线圈产生的感应电流直接传递到熔融材料。
-
2.发明申请公开(公告)号：US20130178685A1
公开(公告)日：2013-07-11
申请号：US13821031
申请日：2010-09-27
申请人： Hyun-je Cho , Deuk-man Kim , Cheon-woo Kim , Jong-kil Park , Young-bu Choi
发明人： Hyun-je Cho , Deuk-man Kim , Cheon-woo Kim , Jong-kil Park , Young-bu Choi
IPC分类号： G21F9/30
CPC分类号： G21F9/30 , B30B11/201 , B30B11/228 , G21F9/28 , G21F9/301 , G21F9/305 , Y10S422/903 , Y10S588/90
摘要： An apparatus and method for the granulation of radioactive waste in which a preprocessing method for the vitrification of radioactive waste is simplified to conform to onsite conditions of a nuclear power plant, additives are improved, and pellets suitable for vitrification are manufactured. The apparatus for the granulation of radioactive waste includes: a body frame having an inlet and an outlet; a hopper supplying the radioactive waste to be transferred and fed through the inlet; a feeder transferring/supplying the radioactive waste supplied to a specific position and in a certain quantity; a stirrer pulverizing/mixing lumps of the radioactive waste supplied; an additive supply part supplying a lubricant to the radioactive waste fed into the stirrer; and a pellet press pressing the radioactive waste fed through the feeder into a pellet shape and discharging the pellet through the outlet.
摘要翻译： 用于放射性废物造粒的装置和方法，其中放射性废物玻璃化的预处理方法被简化以符合核电厂的现场条件，添加剂得到改进，并且制造适于玻璃化的颗粒。 用于造粒放射性废物的装置包括：具有入口和出口的主体框架; 供给放射性废物的料斗通过入口供给; 供应商将供应的放射性废物转移/供应给特定位置和一定量; 搅拌器粉碎/混合供应的放射性废物块; 添加剂供给部，向供给到搅拌器的放射性废物供给润滑剂; 以及将通过进料器进料的放射性废料压成颗粒形状并通过出口排出颗粒的颗粒压块。
-
公开(公告)号：US20130032842A1
公开(公告)日：2013-02-07
申请号：US13563227
申请日：2012-07-31
申请人： Jong Kil PARK , Sung Uk Zhang , Jong Sup Song
发明人： Jong Kil PARK , Sung Uk Zhang , Jong Sup Song
CPC分类号： H01L33/486 , H01L24/97 , H01L25/075 , H01L33/505 , H01L33/60 , H01L2924/12041 , H01L2924/181 , H01L2924/00
摘要： There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a body part including a through hole formed in a thickness direction; at least one light emitting device disposed within the through hole; and a wavelength conversion part filling the through hole and supporting the light emitting device.
摘要翻译： 提供了一种发光器件封装及其制造方法。 发光器件封装包括：主体部，包括沿厚度方向形成的通孔; 设置在通孔内的至少一个发光器件; 以及波长转换部分，其填充所述通孔并支撑所述发光器件。
-
公开(公告)号：US08513680B2
公开(公告)日：2013-08-20
申请号：US13234971
申请日：2011-09-16
申请人： Daniel Kim , Jae-sung You , Jong-kil Park
发明人： Daniel Kim , Jae-sung You , Jong-kil Park
CPC分类号： H01L33/60 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.
-
公开(公告)号：US20120153327A1
公开(公告)日：2012-06-21
申请号：US13234971
申请日：2011-09-16
申请人： Daniel Kim , Jae-sung You , Jong-kil Park
发明人： Daniel Kim , Jae-sung You , Jong-kil Park
CPC分类号： H01L33/60 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.
摘要翻译： 一种发光器件封装，包括由金属形成的引线框架，其上安装有发光器件芯片; 以及通过注射成型联接到引线框架的模框。 引线框架包括：安装有发光器件芯片的安装部分; 以及第一和第二连接部分，其在第一方向上设置在安装部分的两侧，并且通过引线接合连接到发光器件芯片，其中第一连接部分相对于安装部分是阶梯状的，并且台阶 量小于引线框架的材料厚度。
-
6.发明授权公开(公告)号：US08946498B2
公开(公告)日：2015-02-03
申请号：US13821031
申请日：2010-09-27
申请人： Hyun-je Cho , Deuk-man Kim , Cheon-woo Kim , Jong-kil Park , Young-bu Choi
发明人： Hyun-je Cho , Deuk-man Kim , Cheon-woo Kim , Jong-kil Park , Young-bu Choi
CPC分类号： G21F9/30 , B30B11/201 , B30B11/228 , G21F9/28 , G21F9/301 , G21F9/305 , Y10S422/903 , Y10S588/90
摘要： An apparatus and method for the granulation of radioactive waste in which a preprocessing method for the vitrification of radioactive waste is simplified to conform to onsite conditions of a nuclear power plant, additives are improved, and pellets suitable for vitrification are manufactured. The apparatus for the granulation of radioactive waste includes: a body frame having an inlet and an outlet; a hopper supplying the radioactive waste to be transferred and fed through the inlet; a feeder transferring/supplying the radioactive waste supplied to a specific position and in a certain quantity; a stirrer pulverizing/mixing lumps of the radioactive waste supplied; an additive supply part supplying a lubricant to the radioactive waste fed into the stirrer; and a pellet press pressing the radioactive waste fed through the feeder into a pellet shape and discharging the pellet through the outlet.
摘要翻译： 用于放射性废物造粒的装置和方法，其中放射性废物玻璃化的预处理方法被简化以符合核电厂的现场条件，添加剂得到改进，并且制造适于玻璃化的颗粒。 用于造粒放射性废物的装置包括：具有入口和出口的主体框架; 供给放射性废物的料斗通过入口供给; 供应商将供应的放射性废物转移/供应给特定位置和一定量; 搅拌器粉碎/混合供应的放射性废物块; 添加剂供给部，向供给到搅拌器的放射性废物供给润滑剂; 以及将通过进料器进料的放射性废料压成颗粒形状并通过出口排出颗粒的颗粒压块。
-
7.发明申请Apparatus and method for vitrification of spent resin containing transition metals 审中-公开含有过渡金属的废树脂玻璃化装置和方法公开(公告)号：US20060122450A1
公开(公告)日：2006-06-08
申请号：US11284229
申请日：2005-11-22
申请人： Cheon-Woo Kim , Jong-Kil Park , Sang-Woon Shin , Jong-Hyun Ha , Myung-Jae Song
发明人： Cheon-Woo Kim , Jong-Kil Park , Sang-Woon Shin , Jong-Hyun Ha , Myung-Jae Song
摘要： An apparatus for vitrification of a spent resin containing transition metals, and a method thereof are disclosed. The apparatus includes a crucible melter comprising upper and lower chamber, a wastes-frit input port positioned at a center of the upper chamber, a plurality of oxygen injectors slantly protruding from the upper and lower surfaces of the upper chamber, and being uniformly spaced a predetermined distance from each other, an ozone sparger penetrating the lower chamber toward an upper center in the lower chamber, an ozone generator positioned at a lower end of the ozone sparger to supply ozone to the ozone sparger, and an oxygen tank connected to the ozone generator. With this construction, it is possible to prevent generation or deposition of metallic alloys and sulfides not in a glass state during vitrification of the spent resin produced from a water purification system of a nuclear power plant.
摘要翻译： 公开了一种含有过渡金属的废树脂玻璃化装置及其方法。 该装置包括坩埚熔化器，其包括上室和下室，位于上室的中心的废料玻璃料输入端口，从上室的上表面和下表面倾斜地突出的多个氧气喷射器，并均匀间隔开 预定距离彼此，臭氧喷雾器穿透下室朝向下腔室的上中心;臭氧发生器，位于臭氧喷雾器的下端以向臭氧喷射器供应臭氧;以及与臭氧连接的氧气罐 发电机。 利用这种结构，可以防止由核电站的水净化系统产生的废树脂玻璃化期间不处于玻璃状态的金属合金和硫化物的产生或沉积。
-
8.发明授权公开(公告)号：US09288847B2
公开(公告)日：2016-03-15
申请号：US13823141
申请日：2010-09-27
申请人： Cheon-Woo Kim , Seok-Mo Choi , Hyun-Jun Jo , Jong-Kil Park , Young-Bu Choi
发明人： Cheon-Woo Kim , Seok-Mo Choi , Hyun-Jun Jo , Jong-Kil Park , Young-Bu Choi
CPC分类号： H05B6/36 , F23G5/10 , F23G2204/204 , F27B14/063 , F27B14/14 , H05B6/24
摘要： A cold crucible induction melter includes an induction coil and a melting furnace. The induction coil serves as a water cooled segment to directly transmit an induced current to a molten material in the cold crucible induction melter (CCIM), improving energy efficiency. Simultaneously, the structure of the CCIM is simplified and enables a smooth discharge even when the molten material consists of a ceramic or a metal material with a high melting point. The cold crucible induction melter heats and melts waste using an induced current which is generated in a water cooled segment by a high frequency current that is applied to the induction coil. The water cooled segment and the induction coil are disposed in a vertical direction so that the induced current that is generated by the induction coil is directly transmitted to the molten material.
摘要翻译： 冷坩埚感应胶机包括感应线圈和熔化炉。 感应线圈用作水冷段，以将感应电流直接传递到冷坩埚感应熔化器（CCIM）中的熔融材料，从而提高能量效率。 同时，即使熔融材料由具有高熔点的陶瓷或金属材料组成，CCIM的结构也被简化，并且能够平稳地放电。 冷坩埚感应熔化器使用施加到感应线圈的高频电流在水冷段中产生的感应电流来加热和熔化废物。 水冷段和感应线圈沿垂直方向设置，使得由感应线圈产生的感应电流直接传递到熔融材料。
-
公开(公告)号：US20120181559A1
公开(公告)日：2012-07-19
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。
-
公开(公告)号：US08564005B2
公开(公告)日：2013-10-22
申请号：US13347163
申请日：2012-01-10
申请人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
发明人： Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
IPC分类号： H01L33/50
CPC分类号： H01L33/58 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12044 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.01 秒)
