Positive Type Photosensitive Resin Composition
    5.
    发明申请
    Positive Type Photosensitive Resin Composition 有权
    正型感光树脂组合物

    公开(公告)号:US20110159428A1

    公开(公告)日:2011-06-30

    申请号:US12964010

    申请日:2010-12-09

    IPC分类号: G03C1/73

    CPC分类号: G03F7/039 G03F7/0755

    摘要: This disclosure relates to a positive photosensitive resin composition including (A) a resin precursor including a polybenzoxazole precursor, a polyamic acid, or a combination thereof, (B) a dissolution-controlling agent having a boiling point ranging from about 210° C. to about 400° C. and a polarity ranging from about 1D to about 4D, (C) an acid generator, (D) a silane-based compound, and (E) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical Formula 1, or both of repeating units represented by Chemical Formulae 1 and 2 and has a thermally polymerizable functional group at least one end. The polyamic acid includes a repeating unit of Chemical Formulae 50 and 51.

    摘要翻译: 本公开涉及包含(A)包含聚苯并恶唑前体,聚酰胺酸或其组合的树脂前体的正型感光性树脂组合物,(B)沸点为约210℃〜 约400℃,极性范围为约1D至约4D,(C)酸产生剂,(D)硅烷基化合物和(E)溶剂。 聚苯并恶唑前体包括由化学式1表示的重复单元或由化学式1和2表示的重复单元两者,并且在至少一端具有可热聚合的官能团。 聚酰胺酸包括化学式50和51的重复单元。