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    MEMS device package and method for manufacturing the same
    1.
    发明申请
    MEMS device package and method for manufacturing the same 有权
    MEMS器件封装及其制造方法

    公开(公告)号：US20060141650A1

    公开(公告)日：2006-06-29

    申请号：US11270482

    申请日：2005-11-10

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00269

    摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device to provide a space where the MEMS active device is positioned and an electrical path for the MEMS active device, each of the internal electrode pads, and comprises first and second pads arranged opposite to one another with a clearance therebetween; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; connection members each formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.

    摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 本发明的MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧，以提供MEMS有源器件所在的空间，以及用于MEMS有源器件的电气路径，每个内部电极焊盘，并且包括第一和 第二垫彼此相对布置，其间具有间隙; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 每个所述连接部件形成在所述通孔的内表面上，以在其一端与所述内部电极焊盘接触; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘与连接构件的另一端接触。

    Monolithic RF filter
    2.
    发明授权
    Monolithic RF filter 有权
    单片RF滤波器

    公开(公告)号：US07535322B2

    公开(公告)日：2009-05-19

    申请号：US11269844

    申请日：2005-11-09

    申请人： Yun-kwon Park ,  Duck-hwan Kim ,  Kuang-woo Nam ,  In-sang Song ,  Seok-chul Yun ,  Byeoung-ju Ha ,  Jong-seok Kim

    发明人： Yun-kwon Park ,  Duck-hwan Kim ,  Kuang-woo Nam ,  In-sang Song ,  Seok-chul Yun ,  Byeoung-ju Ha ,  Jong-seok Kim

    IPC分类号： H03H9/54 ,  H03H9/56

    CPC分类号： H03H9/0542 ,  H03H9/542 ,  H03H9/564 ,  H03H9/566

    摘要： A filter formed of film bulk acoustic resonators has a topology that enables a trimming inductor to be fabricated on the same substrate as the resonator arrays. The entire filter can be fabricated on a single chip, utilizing only integrated circuit processes. In an exemplary embodiment, a pair of shunt resonators each have one electrode connected to series-connected resonators. The other electrodes of the two shunt resonators are connected in common to one another. The trimming inductor is connected between the common electrode and ground potential. A third shunt resonator is connected between the series-connected resonators and ground potential.

    摘要翻译： 由膜体声波谐振器形成的滤波器具有能够将调谐电感器制造在与谐振器阵列相同的衬底上的拓扑结构。 整个滤波器可以在单个芯片上制造，仅利用集成电路工艺。 在示例性实施例中，一对并联谐振器各自具有连接到串联谐振器的一个电极。 两个并联谐振器的其他电极彼此共同连接。 微调电感连接在公共电极和地电位之间。 第三并联谐振器连接在串联谐振器和地电位之间。

    Method of manufacturing MEMS device package
    4.
    发明授权
    Method of manufacturing MEMS device package 有权
    制造MEMS器件封装的方法

    公开(公告)号：US07537952B2

    公开(公告)日：2009-05-26

    申请号：US11802231

    申请日：2007-05-21

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    IPC分类号： H01L21/00

    CPC分类号： B81B7/007

    摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.

    摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。 内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。

    MEMS switch and method for manufacturing the same
    5.
    发明申请
    MEMS switch and method for manufacturing the same 失效
    MEMS开关及其制造方法

    公开(公告)号：US20070012654A1

    公开(公告)日：2007-01-18

    申请号：US11472312

    申请日：2006-06-22

    申请人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    发明人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    IPC分类号： C23F1/00 ,  H01B13/00

    CPC分类号： H01H61/02 ,  H01H61/063 ,  H01H2061/006

    摘要： A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

    摘要翻译： MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板，与下基板的上表面隔开一段距离，并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。 接触构件可以与信号线接触或分离。 制造MEMS开关的方法包括制备上基板和下基板并将其组合，使得具有信号线的表面面向具有接触构件的表面，并且上下基板分开一定距离。

    MEMS switch and method for manufacturing the same
    6.
    发明授权
    MEMS switch and method for manufacturing the same 失效
    MEMS开关及其制造方法

    公开(公告)号：US07619289B2

    公开(公告)日：2009-11-17

    申请号：US11472312

    申请日：2006-06-22

    申请人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    发明人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    IPC分类号： H01L29/78

    CPC分类号： H01H61/02 ,  H01H61/063 ,  H01H2061/006

    摘要： A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

    摘要翻译： MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板，与下基板的上表面隔开一段距离，并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。 接触构件可以与信号线接触或分离。 制造MEMS开关的方法包括制备上基板和下基板并将其组合，使得具有信号线的表面面向具有接触构件的表面，并且上下基板分开一定距离。

    MEMS device package and method for manufacturing the same
    8.
    发明授权
    MEMS device package and method for manufacturing the same 有权
    MEMS器件封装及其制造方法

    公开(公告)号：US07772026B2

    公开(公告)日：2010-08-10

    申请号：US11270482

    申请日：2005-11-10

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    IPC分类号： H01L21/00 ,  H01L21/30 ,  H01L21/461

    CPC分类号： B81C1/00269

    摘要： A micro electro-mechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device to provide a space where the MEMS active device is positioned and an electrical path for the MEMS active device, each of the internal electrode pads, and comprises first and second pads arranged opposite to one another with a clearance therebetween; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; connection members each formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.

    摘要翻译： 提供了一种微机电系统（MEMS）器件封装及其制造方法。 本发明的MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧，以提供MEMS有源器件所在的空间，以及用于MEMS有源器件的电气路径，每个内部电极焊盘，并且包括第一和 第二垫彼此相对布置，其间具有间隙; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 每个所述连接部件形成在所述通孔的内表面上，以在其一端与所述内部电极焊盘接触; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘与连接构件的另一端接触。

    MEMS device package and method of manufacturing the same
    9.
    发明授权
    MEMS device package and method of manufacturing the same 有权
    MEMS器件封装及其制造方法

    公开(公告)号：US07719742B2

    公开(公告)日：2010-05-18

    申请号：US11368626

    申请日：2006-03-07

    申请人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

    发明人： Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Yun-kwon Park ,  Seok-chul Yun ,  Sung-hoon Choa ,  In-sang Song

    IPC分类号： G02B26/00 ,  G02B26/08

    CPC分类号： B81B7/0051 ,  B81B7/007

    摘要： A MEMS device package and a method of manufacturing the same. The MEMS device package includes a device substrate having a surface on which a MEMS active device is formed, and multiple sealing pads arranged around the MEMS active device so that the sealing pads provide electric paths for the MEMS active device. In addition, the MEMS device package may include a cap substrate bonded to the device substrate through the multiple sealing pads, the cap substrate including a trench, within which the MEMS active device is positioned, and via holes. One or more outer electrode pads may be formed on one surface of the cap substrate to be electrically connected with the multiple sealing pads through the via holes. Because there are several bonding and sealing areas between the device substrate and the cap substrate, the sealing intensity is strengthened.

    摘要翻译： 一种MEMS器件封装及其制造方法。 MEMS器件封装包括具有其上形成有MEMS器件的表面的器件衬底以及围绕MEMS有源器件布置的多个密封焊盘，使得密封垫为MEMS有源器件提供电路径。 此外，MEMS器件封装可以包括通过多个密封焊盘结合到器件衬底的帽衬底，帽衬底包括其中定位MEMS有源器件的沟槽和通孔。 可以在盖基板的一个表面上形成一个或多个外电极焊盘，以通过通孔与多个密封垫电连接。 由于在器件基板和盖基板之间存在多个接合和密封区域，所以密封强度得以加强。

    Method of manufacturing MEMS device package
    10.
    发明申请
    Method of manufacturing MEMS device package 有权
    制造MEMS器件封装的方法

    公开(公告)号：US20070224719A1

    公开(公告)日：2007-09-27

    申请号：US11802231

    申请日：2007-05-21

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    IPC分类号： H01L21/00

    CPC分类号： B81B7/007

    摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.

    摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。 内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。