摘要:
A backlight assembly includes a plurality of point light sources, a light guide plate (“LGP”) and a printed circuit board (“PCB”). The LGP has a light incident face in which light is incident, a side surface extending from an edge portion of the light incident face, and a fixing groove which is formed from the side surface toward an inner portion thereof. The PCB includes a point light source disposing portion in which the point light sources are disposed along a first direction, an extending portion extending from the point light disposing portion along a second direction substantially perpendicular to the first direction, and a protrusion which is fixed at an end portion of the extending portion. The protrusion of the PCB is coupled with the fixing groove of the LGP.
摘要:
A backlight assembly includes a plurality of point light sources, a light guide plate (“LGP”) and a printed circuit board (“PCB”). The LGP has a light incident face in which light is incident, a side surface extending from an edge portion of the light incident face, and a fixing groove which is formed from the side surface toward an inner portion thereof. The PCB includes a point light source disposing portion in which the point light sources are disposed along a first direction, an extending portion extending from the point light disposing portion along a second direction substantially perpendicular to the first direction, and a protrusion which is fixed at an end portion of the extending portion. The protrusion of the PCB is coupled with the fixing groove of the LGP.
摘要:
A light-emitting module includes a light guide plate and a light source unit in accordance with an embodiment. The light guide plate include an upper surface, a lower surface facing the upper surface, a plurality of side surfaces connecting the upper surface and the lower surface, and a cross-sectional surface connected to at least one of the side surfaces. The light source unit includes a substrate disposed in correspondence with the cross-sectional surface and a point light source mounted on the substrate to emit light to the cross-sectional surface. Thus, light-emitting efficiency may be enhanced and the arrangement of point light sources may be optimized, so that a required amount of emitted light may be obtained using a small number of the point light sources. In addition, uniformity of luminance and heat-radiating efficiency may also be enhanced.
摘要:
A light-emitting module includes a light guide plate and a light source unit in accordance with an embodiment. The light guide plate include an upper surface, a lower surface facing the upper surface, a plurality of side surfaces connecting the upper surface and the lower surface, and a cross-sectional surface connected to at least one of the side surfaces. The light source unit includes a substrate disposed in correspondence with the cross-sectional surface and a point light source mounted on the substrate to emit light to the cross-sectional surface. Thus, light-emitting efficiency may be enhanced and the arrangement of point light sources may be optimized, so that a required amount of emitted light may be obtained using a small number of the point light sources. In addition, uniformity of luminance and heat-radiating efficiency may also be enhanced.
摘要:
A backlight assembly includes a light guide plate, a light source, a mold and a main frame. The light guide plate includes a first surface and a second surface extending from the first surface. The light source is disposed adjacent to the first surface of the light guide plate. The mold includes an upper portion, a lower portion and a side portion. The side portion connects to the upper and lower portions to form a receiving space, and the receiving space receives the light source and the first surface of the light guide plate. The main frame includes side walls and an upper wall extending from an upper portion of the side walls, and the mold is disposed in an opening below the upper wall.
摘要:
A backlight assembly includes a light guide plate, a light source, a mold and a main frame. The light guide plate includes a first surface and a second surface extending from the first surface. The light source is disposed adjacent to the first surface of the light guide plate. The mold includes an upper portion, a lower portion and a side portion. The side portion connects to the upper and lower portions to form a receiving space, and the receiving space receives the light source and the first surface of the light guide plate. The main frame includes side walls and an upper wall extending from an upper portion of the side walls, and the mold is disposed in an opening below the upper wall.
摘要:
A light source module includes a power transmission substrate and a plurality of point light sources. The power transmission substrate has a plurality of dimming areas disposed along a first direction. The point light sources are spaced apart from each other in each dimming area along the first direction and receive driving power applied to each dimming area through the power transmission substrate and generate light. A spatial interval between the point light sources in the first direction is greater in dimming areas more distant from the center of the power transmission substrate than in dimming areas closer to the center of the power transmission substrate.
摘要:
The light sourcing module of a backlit LCD display apparatus includes a light sources and power sources supporting substrate. The supporting substrate supports plural light sources on a top major surface thereof and at least one heat generating and power supplying circuit element that protrudes from a bottom major surface of the supporting substrate. The supporting substrate integrally includes wiring that couples driving power output by power supplying circuit element to the plural light sources. A rear receiving frame includes an integral heat-sinking and dissipating recess or groove that is positioned and dimensioned to receive the power supplying circuit element when the supporting substrate is received by the rear receiving frame. The integral heat-sinking and dissipating recess or groove removes heat from the heat generating and power supplying circuit element so that such heat does not adversely affect performance of the light sources.
摘要:
A light source module includes a power transmission substrate and a plurality of point light sources. The power transmission substrate has a plurality of dimming areas disposed along a first direction. The point light sources are spaced apart from each other in each dimming area along the first direction and receive driving power applied to each dimming area through the power transmission substrate and generate light. A spatial interval between the point light sources in the first direction is greater in dimming areas more distant from the center of the power transmission substrate than in dimming areas closer to the center of the power transmission substrate.
摘要:
A backlight unit includes a mold frame, a metal core printed circuit board (“MCPCB”) on which at least one light emitting diode (“LED”) is mounted, a reflector, a light guide plate, and an optical sheet. The mold frame includes an MCPCB fixing portion, the MCPCB is directly and removably disposed on the MCPCB fixing portion, and a lower surface of the MCPCB is exposed to the outside of the mold frame. On the MCPCB, a reflector, a light guide plate, and an optical sheet are placed in the order named. The light guide plate has a light entering surface facing the LED.