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    High density vertically mounted semiconductor package
    1.
    发明授权
    High density vertically mounted semiconductor package 失效
    高密度垂直安装的半导体封装

    公开(公告)号：US5349235A

    公开(公告)日：1994-09-20

    申请号：US111518

    申请日：1993-08-25

    申请人： Joon K. Lee ,  Hyeon J. Jeong ,  Kyung S. Kim ,  Oh-Sik Kwon

    发明人： Joon K. Lee ,  Hyeon J. Jeong ,  Kyung S. Kim ,  Oh-Sik Kwon

    IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/04 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05K1/18 ,  H05K3/30 ,  H01L23/16

    CPC分类号： H01L23/562 ,  H01L23/3107 ,  H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10696 ,  Y02P70/613

    摘要： A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package. Also, since the leads are alternately formed and the packages can be mounted near to each other, the package occupies only a small area of the PCB, thereby improving the packing density.

    摘要翻译： 半导体芯片封装包括从封装主体的一侧突出的引线，以及在引线的两侧形成在封装主体的两端的支撑部分，用于将封装牢固地安装在印刷电路板（PCB）上。 支撑部分由与包装体相同的材料制成。 在封装主体上，形成一个槽以进一步保护引线，并且引线交替地形成为将封装安装在靠近处。 因此，没有用于在PCB中形成孔以安装半导体封装的支撑部分的附加工艺步骤，因此封装的安装过程变得更简单。 从包装体突出的支撑部分使得包装件能够牢固地安装在PCB上。 槽和支撑部分保护引线并防止引线由于外力而变形，从而提高半导体封装的可靠性。 此外，由于引线交替形成并且封装可以彼此靠近地安装，所以封装仅占用PCB的小面积，从而提高封装密度。

    Lead frame having dummy leads
    2.
    发明授权
    Lead frame having dummy leads 失效
    具有虚拟引线的引线框架

    公开(公告)号：US5468991A

    公开(公告)日：1995-11-21

    申请号：US158740

    申请日：1993-11-30

    申请人： Joon K. Lee ,  Hyeon J. Jeong

    发明人： Joon K. Lee ,  Hyeon J. Jeong

    IPC分类号： H01L21/56 ,  H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L29/43 ,  H01L29/54

    CPC分类号： H01L23/4951 ,  H01L2924/0002

    摘要： A lead frame for a semiconductor device used in a vertically surface-mounted package which has internal leads gathered on one side thereof includes separately formed dummy leads attached to a semiconductor chip on the opposite side of the lead frame to avoid an inconsistent inflow pressure of a molding material during a package molding process caused by gathering of the internal leads on only one side, thereby enhancing reliability of the semiconductor package. There is also no need to separately form a heat sink structure for eliminating heat of the semiconductor chip since the dummy leads function as the heat sink.

    摘要翻译： 用于垂直表面安装封装的半导体器件的引线框架，其具有聚集在其一侧上的内部引线，包括附接到引线框架相对侧上的半导体芯片的单独形成的虚拟引线，以避免引线框架的不一致的流入压力 在封装成型过程中由内部引线聚集在一侧引起的成型材料，从而提高半导体封装的可靠性。 由于虚设引线用作散热器，因此也不需要分开形成用于消除半导体芯片的热量的散热器结构。

    Apparatus for detecting the open or closed condition of a microwave oven door
    5.
    发明授权
    Apparatus for detecting the open or closed condition of a microwave oven door 失效
    用于检测微波炉门的打开或关闭状态的装置

    公开(公告)号：US5132503A

    公开(公告)日：1992-07-21

    申请号：US635695

    申请日：1990-12-28

    申请人： Joon K. Lee

    发明人： Joon K. Lee

    IPC分类号： F24C15/02 ,  H05B6/66 ,  H05B6/76

    CPC分类号： H05B6/6417 ,  F24C15/02

    摘要： A door condition sensing apparatus for a microwave oven includes a mechanical switch and a photodetector, each of which is separately responsive to the closing of the door. A microprocessor receives signals from both the switch and the photo-detector to determine whether the door is closed. The photo-detector is actuated by a lever which is swung by the door as it closes. The lever comprises an actuator arm of a second switch connected to the microprocessor.

    摘要翻译： 用于微波炉的门状况检测装置包括机械开关和光电检测器，每个检测器分别响应于门的关闭。 微处理器从开关和光电检测器接收信号，以确定门是否关闭。 光检测器由一个杠杆驱动，当门关闭时，该杆被门摆动。 杠杆包括连接到微处理器的第二开关的致动器臂。