摘要:
The invention relates to a bonding system method and for the fabrication of a bonding system, as well as to a light device formed using the method of the invention. The bonding of the two components which are to be joined, whereby at least one of the two components consists at least partially, preferably completely of glass or glass-ceramics, in other words of a glass-based material, is achieved by way of the following methods on their own merit. Through material sealing when utilizing an inorganic glass-based solder material or through sealing mechanisms without solder material by utilizing tensile stress and/or compressive strain conditions, at least in a high temperature range.
摘要:
The invention is directed to a lighting device, particularly a high-pressure metal halide lamp, wherein a material combination of the body, frit and base materials is selected such that: a. the Coefficient of Thermal Expansion of the material of the frit material (CTEfrit) matches with the Coefficients of Thermal Expansion of the material of the lamp base (CTEbase) and the material of the body (CTEbody), respectively, or, b. the material of the frit (CTEfrit) bridges with the Coefficients of Thermal Expansion of the material of the lamp base (CTEbase) and the material of the body (CTEbody), respectively, at least at the joining surfaces of the body, frit and base materials, to sustain a hermetic bonding and withstand pressure and temperature conditions.
摘要:
An improved method for producing a plurality of parts (30) from a plate-type substrate (20) is disclosed, comprising the steps of: (a) laterally separating the parts (30) from a plate-type substrate (20) fixed on a first vacuum plate (3); (b) sucking the parts (30) on a first vacuum plate (3); and (c) detaching the separated parts (30) from the first vacuum plate (3).