Method for separating parts from a substrate
    3.
    发明申请
    Method for separating parts from a substrate 失效
    从基板上分离零件的方法

    公开(公告)号:US20070105347A1

    公开(公告)日:2007-05-10

    申请号:US11534863

    申请日:2006-09-25

    申请人: Jorn Besinger

    发明人: Jorn Besinger

    IPC分类号: H01L21/00

    摘要: An improved method for producing a plurality of parts (30) from a plate-type substrate (20) is disclosed, comprising the steps of: (a) laterally separating the parts (30) from a plate-type substrate (20) fixed on a first vacuum plate (3); (b) sucking the parts (30) on a first vacuum plate (3); and (c) detaching the separated parts (30) from the first vacuum plate (3).

    摘要翻译: 公开了一种用于从板式基板(20)制造多个部件(30)的改进方法,包括以下步骤:(a)将部件(30)与固定在板形基板(20)上的板型基板(20) 第一真空板(3); (b)将第一真空板(3)上的部件(30)吸入; 和(c)将分离的部件(30)从第一真空板(3)分离。