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    HOUSING FOR HIGH-POWER LEDS
    3.
    发明申请
    HOUSING FOR HIGH-POWER LEDS 有权
    大功率LED外壳

    公开(公告)号：US20110108857A1

    公开(公告)日：2011-05-12

    申请号：US12990437

    申请日：2009-04-29

    申请人： Matthias Rindt ,  Josef Kiermeier ,  Thomas Zetterer ,  Robert Hettler ,  Shaifullah Bin Mohamed Kamari ,  Lea-Li Chew ,  Rohit Bhosale

    发明人： Matthias Rindt ,  Josef Kiermeier ,  Thomas Zetterer ,  Robert Hettler ,  Shaifullah Bin Mohamed Kamari ,  Lea-Li Chew ,  Rohit Bhosale

    IPC分类号： H01L31/12 ,  H01L33/48 ,  H01L31/00 ,  H05K7/20 ,  H01L31/18

    CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  Y10S362/80 ,  Y10T29/49826 ,  H01L2924/00014

    摘要： The present invention relates to a housing for radiation-emitting or radiation-receiving optoelectronic components, such as LEDs, and to a method for producing said housing. The housing comprises a composite assembly comprising a base pan (1) and a head pan (5) which are connected by means of a glass layer (2). One section of the top side of the base pan defines a mounting region (12) for an optoelectronic functional element (60) and is additionally a heal sink for the optoelectronic functional element. The head pan extends, at least in sections, over the periphery of the mounting region and forms, above the mounting region, a passage region (52, 61) for the radiation emitted by the optoelectronic functional element or the radiation to be received. When assembling the base part, the glass layer and the head part, the glass layer is heated to such an extent that the glass reaches a viscosity at which the glass adheres, and the base part and the bead part form a composite assembly by means or the first glass layer. Glass makes it possible to produce a hermetic encapsulation with increased thermal stability.

    摘要翻译： 本发明涉及用于辐射发射或辐射接收的光电子部件（例如LED）的外壳以及用于制造所述外壳的方法。 壳体包括复合组件，该复合组件包括通过玻璃层（2）连接的底盘（1）和头盘（5）。 底盘的顶侧的一个部分限定了用于光电子功能元件（60）的安装区域（12），并且另外还包括用于光电子功能元件的愈合槽。 头盘至少部分地在安装区域的周边上延伸，并在安装区域的上方形成用于由光电子功能元件发射的辐射或待接收的辐射的通道区域（52,61）。 当组装基底部分，玻璃层和头部时，将玻璃层加热到玻璃达到玻璃粘附的粘度的程度，并且基底部分和珠部分通过手段或方式形成复合组件 第一个玻璃层。 玻璃使得可以产生具有增加的热稳定性的气密封装。

    Electronic package incorporating electronic components generating and/or receiving light-based coded signals
    6.
    发明授权
    Electronic package incorporating electronic components generating and/or receiving light-based coded signals 有权
    电子组件包括产生和/或接收基于光的编码信号的电子部件

    公开(公告)号：US07638758B2

    公开(公告)日：2009-12-29

    申请号：US11188546

    申请日：2005-07-25

    申请人： Rohit Bhosale

    发明人： Rohit Bhosale

    IPC分类号： H01J5/02 ,  H01J40/14

    CPC分类号： G02B5/1876 ,  G02B5/1814 ,  G02B5/1885 ,  H01L31/0203 ,  H01L31/02325 ,  H01S5/005 ,  H01S5/02288 ,  H01S5/02296

    摘要： The electronic package contains an electronic component or components generating and/or receiving light-based signals, an optical element or elements for transceiving the signals and a housing encapsulating the electronic component or components. According to the invention the optical elements for transceiving the signals are diffractive/refractive optical elements (D/ROEs), which are also part of a sealing device for the housing. Accordingly, the diffractive/refractive optical elements (D/ROEs) have both optical and sealing functions.

    摘要翻译： 电子封装包含产生和/或接收基于光的信号的电子部件或组件，用于收发信号的光学元件或元件以及封装电子部件的壳体。 根据本发明，用于收发信号的光学元件是衍射/折射光学元件（D / ROE），它们也是用于外壳的密封装置的一部分。 因此，衍射/折射光学元件（D / ROE）具有光学和密封功能。