摘要:
A piezoelectric inkjet die stack includes a circuit die stacked on a substrate die, a piezoelectric actuator die stacked on the circuit die, and a cap die stacked on the piezoelectric actuator die. Each die in succession from the circuit die to the cap die is narrower than the previous die.
摘要:
A piezoelectric inkjet die stack includes a circuit die stacked on a substrate die, a piezoelectric actuator die stacked on the circuit die, and a cap die stacked on the piezoelectric actuator die. Each die in succession from the circuit die to the cap die is narrower than the previous die.
摘要:
A fluid-ejection printhead die includes first fluid-ejection nozzles, second fluid-ejection nozzles, and a mixing barrier. The first fluid-ejection nozzles eject fluid of a first type, and are organized over a first row and a second row non-collinear to the first row. The second fluid-ejection nozzles eject fluid of a second type different than the first type, and are organized over a third row and a fourth row non-collinear to the third row. The fourth row is at least substantially collinear to the first row. The mixing barrier is at least substantially between the first row of the first fluid-ejection nozzles and the fourth row of the second fluid-ejection nozzles.
摘要:
The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.
摘要:
A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.
摘要:
A carrier adapted to receive a plurality of printhead dies includes a substructure having a fluid manifold defined therein and a substrate mounted on the substructure, wherein the substrate is adapted to support the printhead dies. The substructure includes a fluid port communicating with the fluid manifold and at least one flush port communicating with the fluid manifold separate from the fluid port, and the substrate has a plurality of fluid passages defined therein with each of the fluid passages communicating with the fluid manifold.
摘要:
A wide-array inkjet printhead assembly includes a carrier having a first side and a second side contiguous with the first side, and a plurality of printhead dies each mounted on the first side of the carrier. An electrical circuit is disposed on the first side and the second side of the carrier. As such, a plurality of electrical connectors are each electrically coupled to the electrical circuit and one of the printhead dies.
摘要:
An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.
摘要:
A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.
摘要:
Apparatus and method for refilling print cartridges for computer controlled printers. The apparatus creates a closed system that is isolated from ambient pressure. The apparatus utilizes both a vacuum in the ink reservoir in the print cartridge and vertical displacement of the refill reservoir with respect to the reservoir in the print cartridge to draw refill ink into the print cartridge to an operating level and to an operating pressure of less than ambient pressure. Within this closed system the apparatus dislodges the closure on the print cartridge and reseats a replacement closure during refilling.