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    RTV heat conductive silicone rubber compositions
    1.
    发明申请
    RTV heat conductive silicone rubber compositions 审中-公开
    RTV导热硅橡胶组合物

    公开(公告)号：US20060079634A1

    公开(公告)日：2006-04-13

    申请号：US11289448

    申请日：2005-11-30

    申请人： Jun Horikoshi ,  Tsuneo Kimura ,  Kei Miyoshi

    发明人： Jun Horikoshi ,  Tsuneo Kimura ,  Kei Miyoshi

    IPC分类号： C08L83/04 ,  C08L83/00

    CPC分类号： C08L83/14 ,  C08G77/045 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L23/3737 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/54 ,  C08L2666/44 ,  H01L2924/00

    摘要： A RTV heat conductive silicone rubber composition comprising (A) an organopolysiloxane having hydrolyzable groups at both ends, (B) an organopolysiloxane having at least one hydrolyzable group at one end, (C) a heat conductive filler, and (D) an organosilicon compound having a hydrolyzable group or a partial hydrolytic condensate thereof experiences a minimized viscosity increase even when loaded with a large amount of heat conductive filler (C), has good potting, coating and sealing properties, and is suited for use in one package form.

    摘要翻译： 一种RTV导热硅橡胶组合物，其包含（A）在两端具有可水解基团的有机聚硅氧烷，（B）在一端具有至少一个可水解基团的有机聚硅氧烷，（C）导热填料和（D）有机硅化合物 具有可水解基团或其部分水解缩合物即使在加载大量导热填料（C）时也具有最小的粘度增加，具有良好的灌封，涂层和密封性能，并且适用于一种包装形式。

    Room temperature quick curable organopolysiloxane composition excellent in water resistance
    2.
    发明授权
    Room temperature quick curable organopolysiloxane composition excellent in water resistance 失效
    室温快速固化有机聚硅氧烷组合物耐水性优良

    公开(公告)号：US5482992A

    公开(公告)日：1996-01-09

    申请号：US328515

    申请日：1994-10-25

    申请人： Tsuneo Kimura ,  Kei Miyoshi ,  Masatoshi Arai

    发明人： Tsuneo Kimura ,  Kei Miyoshi ,  Masatoshi Arai

    IPC分类号： C08K5/04 ,  C08G65/336 ,  C08K5/07 ,  C08K5/17 ,  C08L71/02 ,  C08L83/04 ,  C08L83/06 ,  C08J3/00 ,  C08K3/20 ,  C08L83/00 ,  C08G77/00

    CPC分类号： C08G65/336 ,  C08K5/07

    摘要： A room temperature curable rubber composition of a condensation curing type that comprises as a base polymer a diorganopolysiloxane or a polyoxyalkylene in which both ends of the molecular chain are blocked with a hydrolyzable silyl group, and a .beta.-dicarbonyl compound and an amino group containing organic compound that are blended with the base polymer. Since the room temperature curable rubber composition is cured with water in the air and at the same time the dehydration condensation of the .beta.-carbonyl group and the amino group produces water in the composition, the quick curability and deep curability are improved remarkably. In addition, since this dehydration condensation reaction is an irreversible reaction, the product produced by the condensation dehydration is hydrolyzed to prevent the amino group containing compound from being regenerated, and as a result the hydrophilic nature of the cured product is prevented from increasing not to damage the water resistance.

    摘要翻译： 一种缩合固化型室温可固化橡胶组合物，其包含作为基础聚合物的二有机聚硅氧烷或分子链两端用可水解甲硅烷基封端的聚氧化烯，以及β-二羰基化合物和含氨基的有机物 与基础聚合物共混的化合物。 由于室温固化橡胶组合物在空气中用水固化，同时β-羰基和氨基的脱水缩合在组合物中产生水，因此快速固化性和深度固化性显着提高。 此外，由于该脱水缩合反应是不可逆反应，所以通过缩合脱水生成的产物被水解以防止含氨基化合物再生，结果，防止了固化产物的亲水性增加，不会增加 损坏防水性。

    Organopolysiloxane composition and electronic part encapsulated therewith
    3.
    发明申请
    Organopolysiloxane composition and electronic part encapsulated therewith 有权
    有机聚硅氧烷组合物和封装的电子部件

    公开(公告)号：US20050059772A1

    公开(公告)日：2005-03-17

    申请号：US10941884

    申请日：2004-09-16

    申请人： Jun Horikoshi ,  Tsuneo Kimura

    发明人： Jun Horikoshi ,  Tsuneo Kimura

    IPC分类号： C08L83/04 ,  C08K3/08 ,  C09K3/10 ,  H01C1/02 ,  H01L23/29 ,  H01L23/31

    CPC分类号： C09D183/04 ,  C08L2666/54

    摘要： An organopolysiloxane composition comprising 0.01% to less than 0.5% by weight of a sulfidable metal powder is provided. When a silver-containing precision electronic part is encapsulated or sealed with the cured composition, the metal powder in the cured composition is sulfided with sulfur-containing gas for thereby preventing or retarding the corrosion of the electronic part with the sulfur-containing gas.

    摘要翻译： 提供了包含0.01重量％至小于0.5重量％的可硫化金属粉末的有机聚硅氧烷组合物。 当用固化的组合物包封或密封含银精密电子部件时，固化的组合物中的金属粉末被含硫气体硫化，从而防止或延缓含硫气体的电子部件的腐蚀。

    Room temperature curable organopolysiloxane compositions
    5.
    发明授权
    Room temperature curable organopolysiloxane compositions 失效
    室温可固化的有机聚硅氧烷组合物

    公开(公告)号：US06740725B2

    公开(公告)日：2004-05-25

    申请号：US10183419

    申请日：2002-06-28

    申请人： Jun Horikoshi ,  Tsuneo Kimura ,  Hironao Fujiki

    发明人： Jun Horikoshi ,  Tsuneo Kimura ,  Hironao Fujiki

    IPC分类号： C08G7726

    CPC分类号： C08L83/14 ,  C08K5/5465 ,  H05K3/285 ,  Y10S528/901 ,  C08L83/00

    摘要： A room temperature curable organopolysiloxane composition comprising (a) an organopolysiloxane having a specific structure, (b) a alkenoxysilane or substituted alkenoxysilane or a partial hydrolyzate thereof, and (c) a siloxane or a partial hydrolyzate thereof cures into a product which experiences no decline of insulation resistance upon application of voltage in a hot humid environment and is resistant to electrolytic corrosion.

    摘要翻译： 一种室温可固化的有机聚硅氧烷组合物，其包含（a）具有特定结构的有机聚硅氧烷，（b）烯氧基硅烷或取代的烯氧基硅烷或其部分水解产物，和（c）硅氧烷或其部分水解产物固化成不会下降的产物 的绝缘电阻，在耐潮湿环境下施加电压并且耐电解腐蚀。

    ROOM TEMPERATURE-CURABLE, HEAT-CONDUCTIVE SILICONE RUBBER COMPOSITION
    6.
    发明申请
    ROOM TEMPERATURE-CURABLE, HEAT-CONDUCTIVE SILICONE RUBBER COMPOSITION 失效
    室温可固化，导热硅橡胶组合物

    公开(公告)号：US20080096030A1

    公开(公告)日：2008-04-24

    申请号：US11873929

    申请日：2007-10-17

    申请人： Jun HORIKOSHI ,  Tsuneo Kimura

    发明人： Jun HORIKOSHI ,  Tsuneo Kimura

    IPC分类号： B32B27/28 ,  C08K3/08 ,  C08L43/04

    CPC分类号： C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08K3/08 ,  C08K3/22 ,  Y10T428/31663 ,  C08L83/00

    摘要： Provided is a room temperature-curable, heat-conductive silicone rubber composition, including: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups and/or organooxy groups, (B) a heat-conductive filler other than a palladium powder, (C) an organosilane containing two or more hydrolyzable groups, and/or a partial hydrolysis-condensation product thereof, and (D) a palladium powder. The composition improves on the drawbacks of the conventional technology, is able to suppress the quantity of hydrogen gas produced from the heat-conductive filler, exhibits superior storage properties, and yields a low-hardness cured product upon curing. The cured product is useful as a heat-conductive material for a heat-generating electronic component.

    摘要翻译： 本发明提供一种室温固化型导热性硅橡胶组合物，其包含：（A）分子链末端用羟基和/或有机氧基封端的二有机聚硅氧烷，（B）除钯粉末以外的导热性填料 ，（C）含有两个或更多个可水解基团的有机硅烷和/或其部分水解缩合产物，和（D）钯粉末。 组合物改善了传统技术的缺点，能够抑制由导热填料产生的氢气的量，显示出优异的储存性能，并且在固化时产生低硬度固化产物。 固化产物可用作发热电子部件的导热材料。

    Room temperature-curable, heat-conductive silicone rubber composition
    8.
    发明授权
    Room temperature-curable, heat-conductive silicone rubber composition 失效
    室温固化，导热硅橡胶组合物

    公开(公告)号：US07601773B2

    公开(公告)日：2009-10-13

    申请号：US11873929

    申请日：2007-10-17

    申请人： Jun Horikoshi ,  Tsuneo Kimura

    发明人： Jun Horikoshi ,  Tsuneo Kimura

    IPC分类号： C08K3/08

    CPC分类号： C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08K3/08 ,  C08K3/22 ,  Y10T428/31663 ,  C08L83/00

    摘要： Provided is a room temperature-curable, heat-conductive silicone rubber composition, including: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups and/or organooxy groups, (B) a heat-conductive filler other than a palladium powder, (C) an organosilane containing two or more hydrolyzable groups, and/or a partial hydrolysis-condensation product thereof, and (D) a palladium powder. The composition improves on the drawbacks of the conventional technology, is able to suppress the quantity of hydrogen gas produced from the heat-conductive filler, exhibits superior storage properties, and yields a low-hardness cured product upon curing. The cured product is useful as a heat-conductive material for a heat-generating electronic component.

    摘要翻译： 本发明提供一种室温固化型导热性硅橡胶组合物，其包含：（A）分子链末端用羟基和/或有机氧基封端的二有机聚硅氧烷，（B）除钯粉末以外的导热性填料 ，（C）含有两个或更多个可水解基团的有机硅烷和/或其部分水解缩合产物，和（D）钯粉末。 组合物改善了传统技术的缺点，能够抑制由导热填料产生的氢气的量，显示出优异的储存性能，并且在固化时产生低硬度固化产物。 固化产物可用作发热电子部件的导热材料。

    Organopolysiloxane composition and electronic part encapsulated therewith
    10.
    发明授权
    Organopolysiloxane composition and electronic part encapsulated therewith 有权
    有机聚硅氧烷组合物和封装的电子部件

    公开(公告)号：US07309733B2

    公开(公告)日：2007-12-18

    申请号：US10941884

    申请日：2004-09-16

    申请人： Jun Horikoshi ,  Tsuneo Kimura

    发明人： Jun Horikoshi ,  Tsuneo Kimura

    IPC分类号： C08L83/06

    CPC分类号： C09D183/04 ,  C08L2666/54

    摘要： An organopolysiloxane composition which contains from 0.01% to less than 0.5% by weight of a sulfidable metal powder is provided. When a silver-containing precision electronic part is encapsulated or sealed with the cured composition, the metal powder in the cured composition is sulfided with sulfur-containing gas, thereby preventing or retarding the corrosion of the encapsulated or sealed electronic part with the sulfur-containing gas.

    摘要翻译： 提供含有0.01重量％至小于0.5重量％的可硫化金属粉末的有机聚硅氧烷组合物。 当用固化的组合物包封或密封含银精密电子部件时，固化的组合物中的金属粉末被含硫气体硫化，从而防止或延缓含硫的包封或密封的电子部件的腐蚀 加油站。