Methods for performing plasma etching operations on microelectronic
structures
    6.
    发明授权
    Methods for performing plasma etching operations on microelectronic structures 失效
    在微电子结构上执行等离子体蚀刻操作的方法

    公开(公告)号:US5900163A

    公开(公告)日:1999-05-04

    申请号:US784958

    申请日:1997-01-16

    CPC分类号: H01L21/32137

    摘要: A method for etching a layer of a microelectronic structure includes the steps of masking the layer to be etched so that predetermined portions of the layer are exposed, and providing an etching gas. An additional gas is also provided wherein the additional gas generates a compound having a carbene structure when exposed to a plasma discharge. A plasma of the etching gas and the additional gas is generated to thereby etch the exposed portions of the layer and to form the compound having a carbene structure. A polymer can thus be formed from the compound having the carbene structure on the sidewalls of the etched portions of the layer. Accordingly, the profile of the etched layer can be improved.

    摘要翻译: 用于蚀刻微电子结构层的方法包括以下步骤:掩蔽待蚀刻的层,使得层的预定部分暴露,并提供蚀刻气体。 还提供另外的气体,其中附加气体当暴露于等离子体放电时产生具有卡宾结构的化合物。 产生蚀刻气体和附加气体的等离子体,从而蚀刻该层的暴露部分并形成具有卡宾结构的化合物。 因此,可以在层的蚀刻部分的侧壁上由具有卡宾结构的化合物形成聚合物。 因此,可以提高蚀刻层的轮廓。