公开(公告)号：US20060054277A1

公开(公告)日：2006-03-16

申请号：US10538801

申请日：2003-07-29

Applicant: Jung_Il Byun ,  Kyung-Jun Lee ,  Jae-Yong Jung

Inventor： Jung_Il Byun ,  Kyung-Jun Lee ,  Jae-Yong Jung

IPC: B32B7/12

CPC classification number: C09J9/02 ,  C08L33/00 ,  H01B1/22 ,  H01B3/004 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2224/83101 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0224 ,  Y10T428/25 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Disclosed is an anisotropic-electroconductive adhesive, which includes an insulating adhesive component containing a radical polymerizable compound and a polymerization initiator; and a plurality of insulating coated electroconductive particles dispersed in the insulating adhesive component, the insulating coated electroconductive particle having a coating layer made of insulating thermoplastic resin on a surface of an electroconductive particle, wherein a softening point of the insulating thermoplastic resin is lower than an exothermic peak temperature of the insulating adhesive component. The anisotropic-electroconductive adhesive enables rapid curing of the insulating adhesive component at a low temperature and is very useful for making a circuit connection structure since it may prevent a short of circuit without connection failure even when the electroconductive particles are condensed.

Abstract translation: 公开了一种各向异性导电粘合剂，其包括含有自由基聚合性化合物和聚合引发剂的绝缘粘合剂成分; 以及分散在所述绝缘粘合剂组分中的多个绝缘涂覆的导电颗粒，所述绝缘涂覆的导电颗粒在导电颗粒的表面上具有由绝缘热塑性树脂制成的涂层，其中所述绝缘热塑性树脂的软化点低于 绝缘胶组件的放热峰值温度。 各向异性导电粘合剂能够在低温下快速固化绝缘粘合剂组分，并且对于制造电路连接结构非常有用，因为即使当导电颗粒被冷凝时，它也可以防止短路而没有连接故障。