公开(公告)号：US11923335B2

公开(公告)日：2024-03-05

申请号：US17472883

申请日：2021-09-13

申请人： DEXERIALS CORPORATION

发明人： Seiichiro Shinohara

IPC分类号： H01L23/00 ,  C08K3/08 ,  C09J7/20 ,  C09J9/02 ,  H05K3/32

CPC分类号： H01L24/83 ,  C09J7/20 ,  C09J9/02 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  C08K3/08 ,  C08K2201/001 ,  C09J2203/326 ,  C09J2301/314 ,  C09J2301/408 ,  C09J2463/00 ,  C09J2467/006 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13144 ,  H01L2224/271 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H05K3/323 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29357 ,  H01L2924/00014 ,  H01L2224/29339 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/00014 ,  H01L2224/29344 ,  H01L2924/00014 ,  H01L2224/29364 ,  H01L2924/00014 ,  H01L2224/294 ,  H01L2924/00014 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/0635 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/29387 ,  H01L2924/05442 ,  H01L2224/29387 ,  H01L2924/05432 ,  H01L2224/29387 ,  H01L2924/05432 ,  H01L2924/01001 ,  H01L2224/271 ,  H01L2924/00012 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2224/83101 ,  H01L2924/00012 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83

摘要： Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.

公开(公告)号：US11710716B2

公开(公告)日：2023-07-25

申请号：US17738655

申请日：2022-05-06

申请人： DEXERIALS CORPORATION

发明人： Seiichiro Shinohara

IPC分类号： B32B37/06 ,  B32B37/10 ,  B32B37/24 ,  B32B38/00 ,  C08G59/68 ,  H01L23/00 ,  H05K3/32 ,  C09J4/00 ,  H05K1/03 ,  B32B3/26 ,  B32B37/00

CPC分类号： H01L24/29 ,  B32B3/263 ,  B32B37/025 ,  B32B37/06 ,  B32B37/10 ,  B32B37/24 ,  B32B38/0008 ,  C08G59/68 ,  H01L24/27 ,  H01L24/83 ,  H05K3/323 ,  B32B2037/243 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2457/00 ,  C09J4/00 ,  H01L2224/27003 ,  H01L2224/27005 ,  H01L2224/294 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29499 ,  H01L2224/83851 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0373 ,  H05K2201/0215 ,  Y10T428/24521 ,  H01L2224/29339 ,  H01L2924/00014 ,  H01L2224/29357 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/00014 ,  H01L2224/29344 ,  H01L2924/00014 ,  H01L2224/29364 ,  H01L2924/00014 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/294 ,  H01L2924/00014 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00

摘要： An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

公开(公告)号：US09960139B2

公开(公告)日：2018-05-01

申请号：US14428582

申请日：2013-09-17

申请人： DEXERIALS CORPORATION

发明人： Kouichi Sato ,  Yasushi Akutsu

IPC分类号： H01L23/00 ,  B29C71/04 ,  G02F1/1345 ,  B23B3/30 ,  C09J9/02 ,  B29C59/02 ,  B32B33/00 ,  C09J7/00 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B3/08 ,  C08K3/08 ,  B29K63/00 ,  B29L9/00 ,  B29L31/34 ,  B29C35/08

CPC分类号： H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

摘要： To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US09777197B2

公开(公告)日：2017-10-03

申请号：US14512535

申请日：2014-10-13

申请人： SunRay Scientific LLC

发明人： S. Kumar Khanna

IPC分类号： C09J9/02 ,  C09J9/00 ,  H05K13/04 ,  H05K3/30 ,  H05K3/32 ,  H01L23/00 ,  C08K9/02

CPC分类号： C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

摘要： Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

公开(公告)号：US20170077390A1

公开(公告)日：2017-03-16

申请号：US15233650

申请日：2016-08-10

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Masashi OTSUKA

IPC分类号： H01L43/02 ,  H01L27/22 ,  H01L43/12 ,  H01L43/08

CPC分类号： H01L43/10 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/82 ,  H01L2224/04042 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06562 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K9/0075 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a substrate, a magnetoresistive memory chip disposed on the substrate, and a sealing resin layer that seals the magnetoresistive memory chip. The magnetoresistive memory chip includes a magnetoresistive memory element layer and an organic resin layer that covers at least a portion of the magnetoresistive memory element layer and contains magnetic particles.

摘要翻译： 半导体器件包括衬底，设置在衬底上的磁阻存储器芯片以及密封磁阻存储器芯片的密封树脂层。 磁阻存储器芯片包括磁阻存储元件层和覆盖磁阻存储元件层的至少一部分并且包含磁性颗粒的有机树脂层。

公开(公告)号：US20160368103A1

公开(公告)日：2016-12-22

申请号：US15109115

申请日：2014-01-16

申请人： Ormet Circuitd, Inc.

发明人： Catherine A Shearer

IPC分类号： B23K35/26 ,  B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  B23K35/30

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/264 ,  B23K35/266 ,  B23K35/268 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3033 ,  B23K35/3612 ,  B23K35/362 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29314 ,  H01L2224/29316 ,  H01L2224/29317 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29386 ,  H01L2224/29411 ,  H01L2224/29424 ,  H01L2224/29438 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29449 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/29473 ,  H01L2224/2948 ,  H01L2224/29484 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83825 ,  H01L2224/8384 ,  H05K3/3463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01052 ,  H01L2924/0108 ,  H01L2924/01034 ,  H01L2924/01084 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00012

摘要： Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.

摘要翻译： 本发明组合物是在高工作温度和步骤焊接应用中替代高熔点温度的焊膏和预制件。 在本发明的使用中，金属粉末的混合物在350摄氏度以下反应，形成不会在原始工艺温度下重熔的致密金属接头。

公开(公告)号：US09508680B1

公开(公告)日：2016-11-29

申请号：US14741757

申请日：2015-06-17

申请人： GLOBALFOUNDRIES INC.

发明人： Stephen P. Ayotte ,  Glen E. Richard ,  Timothy M. Sullivan

IPC分类号： H01L23/00 ,  C09K5/06 ,  H01L21/56

CPC分类号： H01L24/98 ,  C09K5/06 ,  H01L21/56 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/92125 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01074 ,  H01L2924/069 ,  H01L2924/05381 ,  H01L2924/0549 ,  H01L2924/054 ,  H01L2924/01028 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/0537 ,  H01L2924/01025 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05442

摘要： Underfill materials and methods for removing an underfill material from beneath a chip in relation to removal of the chip from a substrate. The underfill material may a plurality of particles dispersed in a bulk matrix. The material constituting the particles may be capable of generating heat energy when exposed to a time-varying magnetic field. The bulk matrix of the underfill material between the chip and a substrate may be heated with heat energy transferred from the particles. While heated, the underfill material is removed. The heating of the underfill material may also be used to heat solder bumps connecting the chip with the substrate so that the solder bumps are liquefied.

摘要翻译： 用于从芯片下面去除底部填充材料的底部填充材料和方法相对于从衬底移除芯片。 底部填充材料可以分散在块状基质中的多个颗粒。 构成颗粒的材料可以在暴露于时变磁场时能够产生热能。 芯片和衬底之间的底部填充材料的主体矩阵可以用从颗粒转移的热能来加热。 加热时，去除底部填充材料。 底部填充材料的加热也可以用于加热将芯片与衬底连接的焊料凸块，使得焊料凸块液化。

公开(公告)号：US09449938B2

公开(公告)日：2016-09-20

申请号：US15010531

申请日：2016-01-29

申请人： Henkel IP & Holding GmbH

发明人： Pukun Zhu ,  Gina V. Hoang ,  Shashi K. Gupta ,  Andrew Laib

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  C09J163/10 ,  C08L63/10 ,  H01B1/22

CPC分类号： H01L24/32 ,  C08G59/34 ,  C08K3/08 ,  C08K3/10 ,  C08K2003/0806 ,  C08K2201/001 ,  C08L63/00 ,  C08L63/10 ,  C08L79/08 ,  C08L79/085 ,  C08L2205/02 ,  C09J163/10 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2741 ,  H01L2224/27848 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83464 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2924/01051 ,  H01L2924/0132 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0645 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/0695 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/20103 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/2064 ,  H01L2924/3511 ,  H01L2924/07 ,  H01L2924/095 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/00012

摘要： Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In additional aspects, the invention further relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor.

摘要翻译： 本文提供了具有用于各种应用的有利性质的导电芯片附着膜，例如用于制备大型芯片半导体封装。 还提供了可用于制备这种膜的制剂，以及制备这种制剂的方法。 在本发明的另外的方面，提供了由根据本发明的组合物制备的导电网络。 在另外的方面，本发明还涉及包含粘附到合适的基底上的这种导电管芯附着膜的制品。

公开(公告)号：US20160155717A1

公开(公告)日：2016-06-02

申请号：US14904519

申请日：2014-07-29

申请人： DEXERIALS CORPORATION

发明人： Kenichi SARUYAMA ,  Yasushi AKUTSU

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  H01L24/27 ,  H01L2224/27005 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/29018 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01R4/04 ,  H05K3/323 ,  H01L2924/00014

摘要： An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.

摘要翻译： 各向异性导电膜包括其中多个导电颗粒以规定的方式排列并保持在绝缘树脂层中的导电粒子阵列层。 各向异性导电膜具有这样的方向，其中保持导电颗粒阵列的绝缘树脂层的单个导电颗粒周围的厚度分布相对于导电颗粒是不对称的。 厚度分布不对称的方向在多个导电颗粒中沿同一方向排列。 当使用这种各向异性导电膜安装电子部件时，可以减少短路和导电故障。

公开(公告)号：US20150214176A1

公开(公告)日：2015-07-30

申请号：US14422511

申请日：2013-08-23

申请人： DEXERIALS CORPORATION

发明人： Seiichiro Shinohara

IPC分类号： H01L23/00 ,  B32B38/00 ,  B32B37/10 ,  B32B37/06 ,  B32B37/24 ,  B32B37/00

CPC分类号： H01L24/29 ,  B32B37/025 ,  B32B37/06 ,  B32B37/10 ,  B32B37/24 ,  B32B38/0008 ,  B32B2037/243 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2457/00 ,  C08G59/68 ,  C09J4/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/27005 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/83851 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0373 ,  H05K3/323 ,  H05K2201/0215 ,  Y10T428/24521 ,  H01L2924/00014 ,  H01L2924/00

摘要： An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

摘要翻译： 各向异性导电膜具有三层结构，其中第一连接层夹在主要由绝缘树脂形成的第二连接层和第三连接层之间。 第一连接层具有导电粒子在第二连接层一侧的绝缘树脂层的平面方向上以单层布置的结构，并且在第二连接层的中间区域中的绝缘树脂层的厚度 在导电粒子附近的区域中，导电粒子小于绝缘树脂层的导电粒子。