公开(公告)号：US07428154B2

公开(公告)日：2008-09-23

申请号：US10662815

申请日：2003-09-16

申请人： Junichi Ishimine ,  Tsuyoshi So ,  Hitoshi Nori

发明人： Junichi Ishimine ,  Tsuyoshi So ,  Hitoshi Nori

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2224/0401

摘要： A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.

摘要翻译： 要安装的封装结构是外部印刷电路板，包括安装有散热电路元件的封装板和从散热电路元件辐射热量的散热器，其中用于将散热器连接到封装板的第一压力 与第二压力分离，用于将封装板压靠印刷电路板。

公开(公告)号：US5763950A

公开(公告)日：1998-06-09

申请号：US598331

申请日：1996-02-08

申请人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

发明人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L29/06 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068

摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。

公开(公告)号：US09113582B2

公开(公告)日：2015-08-18

申请号：US12781258

申请日：2010-05-17

申请人： Yuji Ohba ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki ,  Seiichi Saito

发明人： Yuji Ohba ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki ,  Seiichi Saito

IPC分类号： H05K7/20 ,  G05D23/19

CPC分类号： H05K7/20836 ,  G05D23/19 ,  G05D23/1917

摘要： An air conditioning control apparatus for controlling an air conditioner in a room which accommodates a computer, includes obtaining repetitively a detected value of a total power consumption of the computer and the air conditioner and a detected value of a air temperature at the air inlet, storing the obtained values into a memory, determining an approximate expression representing a relation between the total power consumption and the air temperature on the basis of the values stored into the memory, determining a value of the air temperature corresponding to the lowest value of the total power consumption, by using the calculated approximate expression, and controlling the air conditioner so that the air temperature become equal the calculated air temperature.

摘要翻译： 一种用于控制容纳计算机的房间中的空调的空调控制装置，包括重复地获得计算机和空调的总功耗的检测值和检测到的空气入口温度的值，存储 将获得的值存储到存储器中，基于存储在存储器中的值来确定表示总功耗和空气温度之间的关系的近似表达式，确定与总功率的最低值相对应的空气温度值 消耗，通过使用计算的近似表达式，并且控制空调，使得空气温度变得等于计算出的空气温度。

公开(公告)号：US20110060571A1

公开(公告)日：2011-03-10

申请号：US12805591

申请日：2010-08-06

申请人： Akira Ueda ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Nobuyoshi Yamaoka ,  Yasushi Uraki

发明人： Akira Ueda ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Seiichi Saito ,  Nobuyoshi Yamaoka ,  Yasushi Uraki

IPC分类号： G06G7/48

CPC分类号： G06F17/50 ,  G06F17/5004 ,  G06F17/5018 ,  G06F2217/16 ,  G06F2217/80 ,  H05K7/20609 ,  H05K7/20836

摘要： A thermal-fluid-simulation analyzing apparatus includes an execution unit that generates an analysis model using analysis conditions to conduct a first thermal fluid simulation analysis based on the generated analysis model, an analysis-condition collecting unit that collects analysis conditions when a predetermined period passes after the first thermal fluid simulation analysis, a condition extracting unit that extracts a boundary condition from the analysis conditions collected by the analysis-condition collecting unit, and a re-execution unit that selects a region corresponding to the boundary condition extracted by the condition extracting unit from regions of the analysis model generated by the execution unit, updates the selected region with the boundary condition, and conducts a second thermal fluid simulation analysis for the updated analysis model.

摘要翻译： 热流体模拟分析装置包括执行单元，其使用分析条件生成分析模型，以基于所生成的分析模型进行第一热流体模拟分析;分析条件收集单元，其在预定时间段通过时收集分析条件 在第一热流体模拟分析之后，条件提取单元从分析条件收集单元收集的分析条件中提取边界条件，以及重新执行单元，其选择与条件提取所提取的边界条件相对应的区域 由执行单元生成的分析模型的区域的单位，更新所选择的区域与边界条件，并对更新的分析模型进行第二热流体模拟分析。

公开(公告)号：US20110059687A1

公开(公告)日：2011-03-10

申请号：US12873909

申请日：2010-09-01

申请人： Tadashi Katsui ,  Junichi Ishimine ,  Seiichi Saito ,  Masahiro Suzuki ,  Ikuro Nagamatsu ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki

发明人： Tadashi Katsui ,  Junichi Ishimine ,  Seiichi Saito ,  Masahiro Suzuki ,  Ikuro Nagamatsu ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Yasushi Uraki

IPC分类号： F24F7/00

CPC分类号： H05K7/20745

摘要： A data center includes a housing room that houses an information technology device; an air conditioning machine that cools air in the housing room and supplies the air under a floor of the housing room; a grille that allows the air supplied under the floor to circulate in the housing room; and a rack device that houses the information technology device. In the housing room in the data center, the rack device is arranged in such a way as to surround the grille. The information technology device is housed in the rack device in such a way as to take in air from a space surrounded by the rack device via the grille and discharge air to the housing room. The air conditioning machine is arranged at a side from which the information technology device discharges air.

摘要翻译： 数据中心包括一个容纳信息技术设备的房间; 空调机，其对所述收容室内的空气进行冷却，并将所述空气供给到所述收容室的地板下; 允许在地板下方供应的空气在容纳室中循环的格栅; 以及容纳信息技术装置的机架装置。 在数据中心的房屋中，机架装置以围绕格栅的方式布置。 信息技术装置被容纳在机架装置中，以便经由格栅从由机架装置包围的空间吸入空气，并将空气排出到容纳室。 空调机设置在信息技术装置排出空气的一侧。

公开(公告)号：US20090192959A1

公开(公告)日：2009-07-30

申请号：US12232754

申请日：2008-09-23

申请人： Akira Ueda ,  Hideharu Matsushita ,  Junichi Ishimine

发明人： Akira Ueda ,  Hideharu Matsushita ,  Junichi Ishimine

IPC分类号： G06N5/00

CPC分类号： G06F17/5009 ,  G06F2217/80

摘要： An analysis supporting apparatus that supports a product analyzing operation, includes a model-data generating unit that generates model data regarding an analysis model of an analysis target component in association with component hierarchy data representing a hierarchy of components forming an analysis target product, and a advice-data generating unit that generates, based on a logic registered in advance, advice data from the model data to improve design with respect to the analysis target product.

摘要翻译： 支持产品分析操作的分析支持装置包括：模型数据生成单元，其生成关于分析对象组件的分析模型的模型数据，所述模型数据与表示形成分析对象产品的组件的层次结构的组件层次数据相关联;以及 建议数据生成单元，其基于预先登记的逻辑生成来自模型数据的建议数据，以改善关于分析目标产品的设计。

公开(公告)号：US20080257639A1

公开(公告)日：2008-10-23

申请号：US12081498

申请日：2008-04-16

申请人： Atsushi Yamaguchi ,  Junichi Ishimine ,  Masahiro Suzuki ,  Tadashi Katsui ,  Shin-ichirou Kouno ,  Akira Takahashi ,  Akihiro Watanabe ,  Tomohiro Okazaki

发明人： Atsushi Yamaguchi ,  Junichi Ishimine ,  Masahiro Suzuki ,  Tadashi Katsui ,  Shin-ichirou Kouno ,  Akira Takahashi ,  Akihiro Watanabe ,  Tomohiro Okazaki

IPC分类号： A47B81/00

CPC分类号： H05K7/20736 ,  Y10T29/4913

摘要： A box-shaped enclosure of a storage box includes a deadening wall or walls defining a storage space between first and second planes. The storage space is open at the first and second planes. A deadening wall member extends along the first plane. An auxiliary box-shaped enclosure is connected to the box-shaped enclosure so as to close the first plane of the box-shaped enclosure. The auxiliary box-shaped enclosure defines an auxiliary space isolated from the storage space with a deadening wall member. The storage space is connected to the fresh air through the ventilation opening and the auxiliary space. The deadening wall or walls of the box-shaped enclosure and the deadening wall member serve to prevent the leakage of the operating sound.

摘要翻译： 存储箱的箱形外壳包括限定第一和第二平面之间的存储空间的消音壁或壁。 存储空间在第一和第二平面处打开。 一个消音壁构件沿第一平面延伸。 辅助箱形外壳连接到箱形外壳，以封闭箱形外壳的第一平面。 辅助箱形外壳限定了与储存空间隔离的辅助空间和消音壁构件。 存储空间通过通风口和辅助空间连接到新鲜空气。 箱状外壳和防静电壁构件的致密壁或壁用于防止操作声音的泄漏。

公开(公告)号：US06618251B2

公开(公告)日：2003-09-09

申请号：US10073005

申请日：2002-02-12

申请人： Junichi Ishimine

发明人： Junichi Ishimine

IPC分类号： H05H720

CPC分类号： H01L23/42 ,  H01L23/373 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01046

摘要： A heat conductive fluid is interposed between an electronic component and a heat sink. The heat conductive fluid serves to enhance the contact between the surface of the electronic component and the opposed surface of the heat sink. The heat conductive fluid also exhibits the property of adsorption between a pair of surfaces based on the fluidity of the heat conductive fluid itself. Although the adsorption allows the slippage of the heat sink along the surface of the electronic component, the adsorption reliably restrains the heat sink from moving in the perpendicular direction perpendicular to the surface of the electronic component. The atmospheric pressure solely acts on the heat sink so as to urge the heat sink against the surface of the electronic component. No excessive urging force is applied to the electronic component. Since the slippage of the heat sink is restrained, the heat conductive fluid can be maintained enough between the heat sink and the electronic component over an enough extent, irrespective of inclination of the surface or vibration of the electronic component. The heat conductive fluid keeps the adsorption acting between the surface of the electronic component and the opposed surface of the heat sink.

摘要翻译： 导电流体介于电子部件和散热器之间。 导热流体用于增强电子部件的表面与散热器的相对表面之间的接触。 基于导热流体本身的流动性，导热流体还表现出一对表面之间的吸附性能。 尽管吸附允许散热器沿着电子部件的表面滑动，但吸附可靠地限制散热器沿垂直于电子部件表面的垂直方向移动。 大气压力仅作用于散热器，以便将散热器推向电子部件的表面。 电子部件不施加过大的推压力。 由于抑制了散热器的滑动，所以不管表面的倾斜或电子部件的振动如何，热传导流体可以在散热器和电子部件之间足够大的程度保持足够的程度。 导热流体保持吸附作用在电子部件的表面和散热片的相对表面之间。

公开(公告)号：US5640046A

公开(公告)日：1997-06-17

申请号：US431978

申请日：1995-05-01

申请人： Masahiro Suzuki ,  Akihiko Fujisaki ,  Junichi Ishimine

发明人： Masahiro Suzuki ,  Akihiko Fujisaki ,  Junichi Ishimine

IPC分类号： H05K7/20 ,  H01L23/433 ,  H01L23/467 ,  H01L23/34

CPC分类号： H01L23/467 ,  H01L23/4332 ,  H01L2924/0002

摘要： In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the main duct and supplies a coolant to the main duct.

摘要翻译： 在安装在电路板上并具有散热器的冷却电路元件模块的冷却结构中，设置有连接电路元件模块的主导管和连接到主管道并供应的冷却剂供应装置 一个冷却剂到主管道。

公开(公告)号：US08515585B2

公开(公告)日：2013-08-20

申请号：US12878385

申请日：2010-09-09

申请人： Yasushi Uraki ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Seiichi Saito

发明人： Yasushi Uraki ,  Junichi Ishimine ,  Ikuro Nagamatsu ,  Masahiro Suzuki ,  Tadashi Katsui ,  Yuji Ohba ,  Nobuyoshi Yamaoka ,  Akira Ueda ,  Seiichi Saito

IPC分类号： G06F19/00

CPC分类号： H05K7/20836 ,  F24F11/77

摘要： An air condition control device for controlling a plurality of air conditioners which cool a plurality of electronic apparatuses respectively, the air condition control device includes a storage section for storing a heating value information related to respective heating values of the electronic apparatuses, and a controller for detecting that a fault has occurred in one of the air conditioners, specifying any of the electronic apparatuses which has been cooled by the one of the air conditioners having occurred the fault when the fault in the one of the air conditioners is detected, determining a heating value of each of the specified electronic apparatuses on the basis of the heating value information, and setting the air flow rate for at least one of the other air conditioners in accordance with the heating values of the specified electronic apparatuses.

摘要翻译： 一种用于控制分别冷却多个电子设备的多个空调的空调控制装置，所述空调控制装置包括用于存储与所述电子设备的各个发热值相关的发热值信息的存储部，以及用于 检测其中一个空调器发生故障，指定在检测到一个空调器中的故障时已经发生故障的空调中的一个已冷却的任何电子设备，确定加热 根据所述发热值信息，指定电子设备中的每一个的值，并且根据所述指定的电子设备的发热值来设定所述其它空调中的至少一个的空气流量。