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公开(公告)号：US5763950A
公开(公告)日：1998-06-09
申请号：US598331
申请日：1996-02-08
申请人： Akihiko Fujisaki , Junichi Ishimine , Masumi Suzuki , Masahiro Miyo , Shunichi Kikuchi , Minoru Hirano , Hitoshi Nori
发明人： Akihiko Fujisaki , Junichi Ishimine , Masumi Suzuki , Masahiro Miyo , Shunichi Kikuchi , Minoru Hirano , Hitoshi Nori
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H01L23/467 , H01L23/473 , H01L29/06 , H01L23/34
CPC分类号： H01L23/3672 , H01L23/3677 , H01L23/433 , H01L23/4336 , H01L23/467 , H01L23/473 , H01L2224/16 , H01L29/0657 , H01L2924/01004 , H01L2924/01019 , H01L2924/01068
摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.
摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。
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2.发明授权Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together 失效具有多层电路板的多芯片模块，绝缘层和布线导体堆叠在一起
公开(公告)号：US5586006A
公开(公告)日：1996-12-17
申请号：US573577
申请日：1995-12-15
申请人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
发明人： Kiyotaka Seyama , Shunichi Kikuchi , Makoto Sumiyoshi , Naoki Yasuda , Minoru Hirano , Hitoshi Nori
IPC分类号： H01L25/18 , H01L21/60 , H01L23/12 , H01L23/498 , H01L25/04 , H01L25/065 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/46 , H05K7/20
CPC分类号： H01L25/0657 , H01L23/49811 , H05K1/141 , H01L2224/16 , H01L2224/48225 , H01L2224/48227 , H01L2225/0651 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06589 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/10253 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041 , H05K2201/0317 , H05K2201/1031 , H05K2201/10318 , H05K2201/10477 , H05K3/3421 , H05K3/3426 , H05K3/3436 , H05K3/368 , H05K3/467 , Y02P70/611
摘要： A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
摘要翻译： 多芯片模块包括基板，薄膜多层电路板，其设置在基板的第一表面上，并且具有层叠绝缘层和布线导体的多层结构，安装有电路元件 在薄膜多层电路板的主表面上，以及端子，其安装在薄膜多层电路板的主表面上，并将布线导体电连接到形成在其上的电路板上的电路 安装了多芯片模块。
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3.发明授权Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure 失效用于冷却衬底的散热器结构和具有这种散热器结构的电子设备
公开(公告)号：US5894882A
公开(公告)日：1999-04-20
申请号：US650029
申请日：1996-05-17
申请人： Shunichi Kikuchi , Minoru Hirano , Kiyotaka Seyama , Hideaki Yoshimura , Takashi Kanda , Hitoshi Nori
发明人： Shunichi Kikuchi , Minoru Hirano , Kiyotaka Seyama , Hideaki Yoshimura , Takashi Kanda , Hitoshi Nori
IPC分类号： H01L23/36 , F28F3/02 , H01L23/367 , H01L23/467 , F28F7/00 , H01L23/46
CPC分类号： H01L23/3672 , F28F3/027 , H01L23/467 , H01L2924/0002
摘要： A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.
摘要翻译： 模块基板的散热结构包括沿着纵向方向延伸并且以预定间距在横向上重复的多个条状底部区域，沿着所述纵向方向延伸并在所述纵向方向上重复的多个条状顶部区域 横向具有所述预定间距，使得条状底部区域和条状顶部区域在横向方向上交替重复，其中条状顶部区域和条形底部区域具有相应的横向边缘， 通过散热片相互连接。
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公开(公告)号：US07828047B2
公开(公告)日：2010-11-09
申请号：US12003542
申请日：2007-12-28
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。
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公开(公告)号：US06507493B2
公开(公告)日：2003-01-14
申请号：US09791777
申请日：2001-02-26
IPC分类号： H05K720
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
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公开(公告)号：US06717808B2
公开(公告)日：2004-04-06
申请号：US09791838
申请日：2001-02-26
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US06385043B1
公开(公告)日：2002-05-07
申请号：US09688857
申请日：2000-10-17
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US06219236B1
公开(公告)日：2001-04-17
申请号：US09448496
申请日：1999-11-24
申请人： Minoru Hirano , Masumi Suzuki
发明人： Minoru Hirano , Masumi Suzuki
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/40 , H01L23/4006 , H01L2924/0002 , H05K7/20436 , H05K7/20472 , H05K7/20509 , H01L2924/00
摘要： It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body 1 capable of covering upper portions of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body 1 and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.
摘要翻译： 本发明的目的是提供一种冷却系统，其能够同时冷却多芯片模块上的电子部件，该多芯片模块被布置成提供预定功能，其中冷却系统可以容易且快速地附接到 模块必要时。 本发明提供一种用于冷却具有预定功能的多芯片模块MCM的冷却系统，该冷却系统在其上安装有包括发热部件P的多个电子部件的基板B上，用于冷却多芯片模块的冷却系统包括： 在辐射体1和电子部件P之间形成有规定的间隙的情况下，能够覆盖多个电子部件P的上部的散热体1; 布置在所述间隙中的由硅橡胶制成的片材S，用于热连接所述电子部件和所述散热构件的上表面; 以及用于将散热体与多芯片模块MCM的基板B可拆卸地连接的螺钉N.
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公开(公告)号：US07337829B2
公开(公告)日：2008-03-04
申请号：US10407464
申请日：2003-04-07
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
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公开(公告)号：US06781846B1
公开(公告)日：2004-08-24
申请号：US09482518
申请日：2000-01-14
申请人： Masumi Suzuki , Minoru Hirano
发明人： Masumi Suzuki , Minoru Hirano
IPC分类号： H05K114
CPC分类号： H05K5/0269 , G06F1/203 , G06F2200/201
摘要： An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.
摘要翻译： 一种适于可拆卸地插入到IC卡可安装装置的槽中的IC卡，包括形成为具有限定在其中的内部空间的大致矩形卡的卡壳体，卡壳体具有穿过卡壳体的壁的多个开口 ; 容纳在卡壳体中的印刷线路板; 以及安装在印刷电路板上的多个电子部件。
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