公开(公告)号：US5763950A

公开(公告)日：1998-06-09

申请号：US598331

申请日：1996-02-08

申请人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

发明人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L29/06 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068

摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。

公开(公告)号：US5586006A

公开(公告)日：1996-12-17

申请号：US573577

申请日：1995-12-15

申请人： Kiyotaka Seyama ,  Shunichi Kikuchi ,  Makoto Sumiyoshi ,  Naoki Yasuda ,  Minoru Hirano ,  Hitoshi Nori

发明人： Kiyotaka Seyama ,  Shunichi Kikuchi ,  Makoto Sumiyoshi ,  Naoki Yasuda ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L25/04 ,  H01L25/065 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46 ,  H05K7/20

CPC分类号： H01L25/0657 ,  H01L23/49811 ,  H05K1/141 ,  H01L2224/16 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/19041 ,  H05K2201/0317 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/467 ,  Y02P70/611

摘要： A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.

摘要翻译： 多芯片模块包括基板，薄膜多层电路板，其设置在基板的第一表面上，并且具有层叠绝缘层和布线导体的多层结构，安装有电路元件 在薄膜多层电路板的主表面上，以及端子，其安装在薄膜多层电路板的主表面上，并将布线导体电连接到形成在其上的电路板上的电路 安装了多芯片模块。

公开(公告)号：US5894882A

公开(公告)日：1999-04-20

申请号：US650029

申请日：1996-05-17

申请人： Shunichi Kikuchi ,  Minoru Hirano ,  Kiyotaka Seyama ,  Hideaki Yoshimura ,  Takashi Kanda ,  Hitoshi Nori

发明人： Shunichi Kikuchi ,  Minoru Hirano ,  Kiyotaka Seyama ,  Hideaki Yoshimura ,  Takashi Kanda ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  F28F7/00 ,  H01L23/46

CPC分类号： H01L23/3672 ,  F28F3/027 ,  H01L23/467 ,  H01L2924/0002

摘要： A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

摘要翻译： 模块基板的散热结构包括沿着纵向方向延伸并且以预定间距在横向上重复的多个条状底部区域，沿着所述纵向方向延伸并在所述纵向方向上重复的多个条状顶部区域 横向具有所述预定间距，使得条状底部区域和条状顶部区域在横向方向上交替重复，其中条状顶部区域和条形底部区域具有相应的横向边缘， 通过散热片相互连接。

公开(公告)号：US07428154B2

公开(公告)日：2008-09-23

申请号：US10662815

申请日：2003-09-16

申请人： Junichi Ishimine ,  Tsuyoshi So ,  Hitoshi Nori

发明人： Junichi Ishimine ,  Tsuyoshi So ,  Hitoshi Nori

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2224/0401

摘要： A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.

摘要翻译： 要安装的封装结构是外部印刷电路板，包括安装有散热电路元件的封装板和从散热电路元件辐射热量的散热器，其中用于将散热器连接到封装板的第一压力 与第二压力分离，用于将封装板压靠印刷电路板。

公开(公告)号：US08611087B2

公开(公告)日：2013-12-17

申请号：US13183769

申请日：2011-07-15

申请人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

发明人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

IPC分类号： H05K7/20 ,  H05K5/00 ,  F16M11/24 ,  H01L23/467

CPC分类号： H05K7/20745 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20754 ,  H01L2924/00

摘要： To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

摘要翻译： 为了冷却设置在空调房间中的刀片式服务器，进行以下配置。 第一个是至少一个壳体，其具有设置在空调房间中的通风通道。 第二是将以下装置放置在通风通道中：其中堆叠有容纳有细长板的壳体的叶片式服务器的机架; 每个冷却盘管均具有冷却剂通道和冷却翅片并冷却通过的空气; 以及至少一个具有放置在其中并具有一个方向产生气流的风扇单元的风扇单元。 第三是风扇单元迫使冷却空气在通风通道中沿一个方向流动，从而冷却机架中的服务器。 冷却盘管和齿条交替布置，使得通过齿条之后的加热的冷却空气被冷却盘管冷却，然后冷却下一个齿条。

公开(公告)号：US08004839B2

公开(公告)日：2011-08-23

申请号：US12040037

申请日：2008-02-29

申请人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

发明人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20745 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20754 ,  H01L2924/00

摘要： To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

摘要翻译： 为了冷却设置在空调房间中的刀片式服务器，进行以下配置。 第一个是至少一个壳体，其具有设置在空调房间中的通风通道。 第二是将以下装置放置在通风通道中：其中堆叠有容纳有细长板的壳体的叶片式服务器的机架; 每个冷却盘管均具有冷却剂通道和冷却翅片并冷却通过的空气; 以及至少一个具有放置在其中并具有一个方向产生气流的风扇单元的风扇单元。 第三是风扇单元迫使冷却空气在通风通道中沿一个方向流动，从而冷却机架中的服务器。 冷却盘管和齿条交替布置，使得通过齿条之后的加热的冷却空气被冷却盘管冷却，然后冷却下一个齿条。

公开(公告)号：US20080232064A1

公开(公告)日：2008-09-25

申请号：US12040037

申请日：2008-02-29

申请人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

发明人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

IPC分类号： H05K7/20

CPC分类号： H05K7/20745 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20754 ,  H01L2924/00

摘要： To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

摘要翻译： 为了冷却设置在空调房间中的刀片式服务器，进行以下配置。 第一个是至少一个壳体，其具有设置在空调房间中的通风通道。 第二是将以下装置放置在通风通道中：其中堆叠有容纳有细长板的壳体的叶片式服务器的机架; 每个冷却盘管均具有冷却剂通道和冷却翅片并冷却通过的空气; 以及至少一个具有放置在其中并具有一个方向产生气流的风扇单元的风扇单元。 第三是风扇单元迫使冷却空气在通风通道中沿一个方向流动，从而冷却机架中的服务器。 冷却盘管和齿条交替布置，使得通过齿条之后的加热的冷却空气被冷却盘管冷却，然后冷却下一个齿条。

公开(公告)号：US07055341B2

公开(公告)日：2006-06-06

申请号：US10452631

申请日：2003-06-03

申请人： Hitoshi Nori ,  Jie Wei

发明人： Hitoshi Nori ,  Jie Wei

IPC分类号： F28F7/00

CPC分类号： H01L23/427 ,  F28D2015/0225 ,  H01L2224/16

摘要： The cooling system allows the liquid coolant discharged from the pump to flow into the evaporation chamber. The liquid coolant passes through the atomizer. Minute droplets of the atomized coolant is discharged from the atomizer into the evaporation chamber. The minute droplets serve to form a uniform thin liquid film over the surface of the fin. Heat conducting from a target heat generating object to the fin promotes the evaporation of the liquid coolant over the surface of the fin, for example. The coolant absorbs a large amount of heat from the fin based on the evaporation. The target heat generating object can thus efficiently be cooled.

公开(公告)号：US20110317357A1

公开(公告)日：2011-12-29

申请号：US13183769

申请日：2011-07-15

申请人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

发明人： Yoichi Sato ,  Kenji Tosaka ,  Mitsuo Hayashi ,  Akihiro Yasuo ,  Hideki Kimura ,  Kengo Ueda ,  Katsuhiko Nakata ,  Yoshihisa Iwakiri ,  Hitoshi Nori ,  Tomoaki Haneda ,  Mika Tokumitsu ,  Naoki Shinjo ,  Kouji Kuroda ,  Yoshihiro Kusano

IPC分类号： H05K7/20

CPC分类号： H05K7/20745 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20754 ,  H01L2924/00

摘要： To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers earch composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air curents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are dispossed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

摘要翻译： 为了冷却设置在空调房间中的刀片式服务器，进行以下配置。 第一个是至少一个壳体，其具有设置在空调房间中的通风通道。 第二个是将通风通道设置在下面的位置上：堆叠由容纳有薄板的壳体构成的叶片式服务器的架子; 每个冷却盘管均具有冷却剂通道和冷却翅片并冷却通过的空气; 以及至少一个风扇单元，其具有放置在其中的轴流风扇，并在一个方向上产生空气挡板。 第三是风扇单元迫使冷却空气在通风通道中沿一个方向流动，从而冷却机架中的服务器。 冷却盘管和机架被交替地置换，使得通过机架的温暖的冷却空气被冷却盘管冷却，然后冷却下一个机架。