公开(公告)号：US20170070620A1

公开(公告)日：2017-03-09

申请号：US15016962

申请日：2016-02-05

Applicant: Kabushiki Kaisha Toshiba

Inventor： Shinya OHASHI ,  Junichi ASADA ,  ltaru MORI

IPC: H04N1/00 ,  G06Q30/00 ,  G06K15/02

CPC classification number: H04N1/0087 ,  G06K15/021 ,  G06Q30/0185

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a case, a memory in the case, a controller in the case. The controller controls the memory. First information including a determination code is printed on a surface of the case with invisible ink. Second information related to the nonvolatile semiconductor memory device is printed with visible ink which is visually recognizable in a visible light range.

Abstract translation: 根据一个实施例，非易失性半导体存储器件包括壳体，壳体中的存储器，壳体中的控制器。 控制器控制内存。 包含确定代码的第一信息被印刷在具有不可见墨水的壳体的表面上。 与非易失性半导体存储器件相关的第二信息被印刷在可见光范围内可视识别的可见墨。

公开(公告)号：US20150043228A1

公开(公告)日：2015-02-12

申请号：US14151192

申请日：2014-01-09

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hideyuki KOGURE ,  Yuuta YAMADA ,  Takeshi IKUTA ,  Toshiyuki HAYAKAWA ,  Junichi ASADA

IPC: F21K99/00 ,  H05K1/18 ,  H01L21/78

CPC classification number: F21K9/30 ,  F21K9/20 ,  F21Y2115/10 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L25/167 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15151 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/186 ,  H05K2201/10106 ,  H05K2201/10159 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract translation: 根据一个实施例，半导体器件包括板，控制器芯片，半导体芯片，密封部分和部件。 板包括与第一表面相对的第一表面和第二表面，第一表面包括端子。 控制器芯片位于电路板的第二个表面上。 半导体芯片位于板的第二表面上。 密封部一体地覆盖控制器芯片和半导体芯片，并且不覆盖板的第二表面的区域。 该部件位于板的第二表面的区域上，以对半导体器件的外部进行操作。

公开(公告)号：US20160077555A1

公开(公告)日：2016-03-17

申请号：US14844511

申请日：2015-09-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yuuta YAMADA ,  Takeshi MITSUHASHI ,  Junichi ASADA

IPC: G06F1/18 ,  G11C16/04

CPC classification number: G06K19/07732 ,  H05K5/0278

Abstract: According to one embodiment, a USB memory device includes: a substrate including a semiconductor chip, a plurality of operating terminals, a reference potential terminal and a reference potential wiring; and a housing holding the substrate inside, being electrically connected to the reference potential terminal, and having electric conductivity. The reference potential wiring electrically connects the operating terminal with the reference potential terminal.

Abstract translation: 根据一个实施例，USB存储器件包括：衬底，其包括半导体芯片，多个操作终端，参考电位端子和参考电位布线; 以及将基板保持在内部的壳体，其电连接到基准电位端子并具有导电性。 参考电位布线将操作端子与参考电位端子电连接。

公开(公告)号：US20150254545A1

公开(公告)日：2015-09-10

申请号：US14468454

申请日：2014-08-26

Applicant: Kabushiki Kaisha Toshiba

Inventor： Hironari UEHARA ,  Akihiro IIDA ,  Junichi ASADA

IPC: G06K19/073 ,  G11C7/24

CPC classification number: G06K19/07345 ,  G11C7/24

Abstract: According to one embodiment, a memory card includes a housing and a switch. The housing includes a first surface and a second surface. The second surface is opposite to the first surface. The switch includes a first part, a second part, and a third part. The first part is disposed outside from the housing. The third part is disposed in the housing. The second part is connected to both the first part and the third part. The third part is in contact with both the first surface and the second surface.

Abstract translation: 根据一个实施例，存储卡包括壳体和开关。 壳体包括第一表面和第二表面。 第二表面与第一表面相对。 开关包括第一部分，第二部分和第三部分。 第一部分设置在外壳外面。 第三部分设置在外壳中。 第二部分连接到第一部分和第三部分。 第三部分与第一表面和第二表面接触。