公开(公告)号：US20140361324A1

公开(公告)日：2014-12-11

申请号：US14194602

申请日：2014-02-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Naoya USHIYAMA ,  Kazuhiro INOUE ,  Kenji SHIMOMURA ,  Tetsuro KOMATSU ,  Toshihiro KUROKI ,  Toshihiro KOMEYA ,  Kazuhiro TAMURA ,  Yoshiharu TSUBOI ,  Teruo TAKEUCHI ,  Kazuhisa IWASHITA

IPC: H01L33/60 ,  H01L33/56

CPC classification number: H01L33/56 ,  H01L25/167 ,  H01L33/50 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A light emitting device includes a light emitting element disposed on a portion of a first lead frame element, a first resin including a fluorescent material, and a second resin. The first resin is above the light emitting element. The second resin is between the first resin and the first lead frame element. In some embodiments, the second resin includes a filler material that reflects light emitted by the light emitting element. In some embodiments, the light emitting device includes a protective diode connected in reverse parallel with the light emitting element. In some embodiments, a transparent resin may be disposed first and second resins.

Abstract translation: 发光装置包括设置在第一引线框架元件的一部分上的发光元件，包括荧光材料的第一树脂和第二树脂。 第一树脂在发光元件之上。 第二树脂在第一树脂和第一引线框架元件之间。 在一些实施例中，第二树脂包括反射由发光元件发射的光的填充材料。 在一些实施例中，发光器件包括与发光元件反向并联连接的保护二极管。 在一些实施例中，透明树脂可以首先设置和第二树脂。