Abstract:
A semiconductor device includes a substrate, a light-receiving element, a switching element, a light-emitting element on the switching element, first and second conductive members. The substrate includes first to third metal pads on a front-side thereof. The light-receiving element includes first and second bonding pads on a front-surface thereof. A back-surface of the light-receiving element is connected to the first and second metal pads. The first and second bonding pads each overlap one of the first and second metal pads. The switching element includes front-side and backside electrodes and a control pad. The backside electrode is connected to the third metal pad. The first conductive member is connected to the front-side electrode of the switching element and the first bonding pad of the light-receiving element. The second conductive member is connected to the control pad of the switching element and the second bonding pad of the light-receiving element.
Abstract:
A wireless communication system includes a first tag installed on a ground outside a track for a running train, the first tag being driven by wirelessly received power, a second tag installed outside a side face of the train and above the first tag, the side face extending in a running direction, the second tag being driven by wirelessly received power, a wireless communicator which is installed in the train and performs wireless communication with the first tag and the second tag, and an antenna which is installed in the train and has a gain in directions of the first tag and the second tag.
Abstract:
An antenna device includes a substrate, and a linear conductive element disposed on the substrate, the linear conductive element having a loop shape in line symmetry with respect to a first straight line and a second straight line perpendicular to the first straight line, respectively, an electrical length between intersection points of the linear conductive element and the first straight line is an integer multiple of a wavelength in a resonance frequency.
Abstract:
A light emitting device includes a light emitting element disposed on a portion of a first lead frame element, a first resin including a fluorescent material, and a second resin. The first resin is above the light emitting element. The second resin is between the first resin and the first lead frame element. In some embodiments, the second resin includes a filler material that reflects light emitted by the light emitting element. In some embodiments, the light emitting device includes a protective diode connected in reverse parallel with the light emitting element. In some embodiments, a transparent resin may be disposed first and second resins.
Abstract:
A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.
Abstract:
A light emitting device includes a first light emitting element on a substrate and a second light emitting element spaced from the first light emitting. A resin body is disposed between the first and second light emitting elements so as to surround the first and second light emitting elements in a plane parallel to the substrate. The resin body has a thickness in a direction orthogonal to the substrate that is greater than a thickness of each of the first and second light emitting elements. A translucent resin element is disposed on the resin body and the first and second light emitting elements. The resin body and the first and second light emitting elements are between the translucent resin element and the substrate in the first direction.
Abstract:
A communication device includes a ground unit, a dielectric plate, a communication circuit, a conductor, and a capacitance element. The ground unit has a reference potential applied to the ground unit. The dielectric plate is provided on the ground unit. The communication circuit is provided on the dielectric plate and performs a transmission and a reception of a signal. The conductor is connected to the communication circuit. An end of the capacitance element is connected to the conductor. An another end of the capacitance element is connected to the ground unit. A capacitance of the capacitance element is smaller than a capacitance formed between the conductor and the ground unit. The capacitance of the capacitance element is bigger than a capacitance formed between the conductor and the ground unit being caused by a human body touching or approximating to the conductor.
Abstract:
According to one embodiment, a detection apparatus includes a pair of conductors configured to detect an electromagnetic wave occurring due to a discharge phenomenon in a target apparatus, wherein the pair of conductors are arranged in a near field region of the target apparatus in which the electromagnetic wave occurs.
Abstract:
An antenna device includes a finite ground plane that includes a linear side, a first conductor plate that faces the finite ground plane and includes a side corresponding to the side of the finite ground plane and having a length of substantially a ⅛ wavelength or less, and a conductor line that includes one end connected to the side of the first conductor plate and the other end short-circuited to one end portion of the side of the finite ground plane. The antenna device further includes a second conductor plate that faces the finite ground plane, includes a side corresponding to the side of the finite ground plane and having a length of substantially a ⅛ wavelength or less, and is arranged to be adjacent to the first conductor plate to perform capacitive coupling with the first conductor plate and a feed line that includes one end connected to the side of the second conductor plate and the other end connected to the other end portion of the side of the finite ground plane.
Abstract:
According to one embodiment, a communication apparatus includes a substrate, a communication circuit, a first signal line, an insulator, and a first conductor. The substrate includes a ground. The communication circuit is provided on the substrate. The first signal line is connected to the communication circuit and is electrically connected to the outer surface of the first conductor. The insulator surrounds the substrate. The first conductor surrounds the insulator.