公开(公告)号：US20140361324A1

公开(公告)日：2014-12-11

申请号：US14194602

申请日：2014-02-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Naoya USHIYAMA ,  Kazuhiro INOUE ,  Kenji SHIMOMURA ,  Tetsuro KOMATSU ,  Toshihiro KUROKI ,  Toshihiro KOMEYA ,  Kazuhiro TAMURA ,  Yoshiharu TSUBOI ,  Teruo TAKEUCHI ,  Kazuhisa IWASHITA

IPC: H01L33/60 ,  H01L33/56

CPC classification number: H01L33/56 ,  H01L25/167 ,  H01L33/50 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A light emitting device includes a light emitting element disposed on a portion of a first lead frame element, a first resin including a fluorescent material, and a second resin. The first resin is above the light emitting element. The second resin is between the first resin and the first lead frame element. In some embodiments, the second resin includes a filler material that reflects light emitted by the light emitting element. In some embodiments, the light emitting device includes a protective diode connected in reverse parallel with the light emitting element. In some embodiments, a transparent resin may be disposed first and second resins.

Abstract translation: 发光装置包括设置在第一引线框架元件的一部分上的发光元件，包括荧光材料的第一树脂和第二树脂。 第一树脂在发光元件之上。 第二树脂在第一树脂和第一引线框架元件之间。 在一些实施例中，第二树脂包括反射由发光元件发射的光的填充材料。 在一些实施例中，发光器件包括与发光元件反向并联连接的保护二极管。 在一些实施例中，透明树脂可以首先设置和第二树脂。

公开(公告)号：US20160308099A1

公开(公告)日：2016-10-20

申请号：US15060534

申请日：2016-03-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yuki AKAMATSU ,  Yoshio NOGUCHI ,  Masahiro OGUSHI ,  Teruo TAKEUCHI ,  Toshihiro KUROKI ,  Hidenori EGOSHI ,  Takashi ARAKAWA ,  Kazuhiro INOUE ,  Toshihiro KOMEYA

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.

Abstract translation: 发光器件包括半导体发光元件，例如发光二极管。 第一金属构件包括第一金属板和半导体发光元件与第一金属板的第一表面之间的第一金属层。 绝缘层接触第一金属板的第二表面。 第二表面在与第一表面的第一平面相交的第二平面中。