LASER PROCESSING APPARATUS, PROBE CARD PRODUCTION METHOD, AND LASER PROCESSING METHOD

    公开(公告)号:US20250001519A1

    公开(公告)日:2025-01-02

    申请号:US18291456

    申请日:2022-08-30

    Abstract: A laser processing apparatus for processing a workpiece by applying laser beam to the workpiece, including: a laser oscillator capable of emitting laser beam; a beam rotator that converts the laser beam emitted from the laser oscillator into a circular beam having a predetermined diameter; a beam shaper on which the circular beam emitted from the beam rotator is incident and from which a polygonal beam is emitted; and a focusing optical system that focuses the polygonal beam emitted from the beam shaper on the workpiece, wherein the beam shaper is a DOE-type beam shaper, and the outer peripheral diameter of the circular beam incident on the DOE-type beam shaper is larger than a standard incident beam diameter preset for the DOE-type beam shaper.

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