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公开(公告)号：US10014205B2
公开(公告)日：2018-07-03
申请号：US14968148
申请日：2015-12-14
发明人： Masaya Yoshida , Takao Yamaguchi , Yuji Tanaka , Hajime Nakahara , Avish Ashok Bharwani , Ming Zeng , Hui Kuen Chan
IPC分类号： H01L21/683 , H01L21/67 , H01L21/687 , H01L21/677
CPC分类号： H01L21/6838 , H01L21/67253 , H01L21/67259 , H01L21/67706 , H01L21/68707
摘要： A substrate conveyance robot has an end effector provided to a robot arm and including a substrate holding unit configured to hold a substrate, arm drive unit configured to drive the robot arm, a robot control unit configured to control the arm drive unit, and a holding force detection unit configured to detect a substrate holding force exerted by the substrate holding unit. The robot control unit controls the arm drive unit based on an upper limit value of at least one of acceleration and speed of the end effector which are determined in accordance with the substrate holding force detected by the holding force detection unit.
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公开(公告)号：US10953539B2
公开(公告)日：2021-03-23
申请号：US16233314
申请日：2018-12-27
发明人： Masaya Yoshida , Hajime Nakahara , Mark Tang
IPC分类号： B25J9/16 , H01L21/67 , H01L21/68 , H01L21/677 , H01L21/687 , B65G47/90 , G05B19/425
摘要： A substrate transfer robot, first and second sensors are provided in a hand such that a planar-view intersection point of optical axes is located on a center of a substrate when the hand holds the substrate in planar view, and a control device operates an arm, scans a target placed at a teaching position with the first and second sensors, and acquires the teaching position when the target is located at the planar-view intersection point of the optical axes.
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公开(公告)号：US11554498B2
公开(公告)日：2023-01-17
申请号：US17067423
申请日：2020-10-09
发明人： Masaya Yoshida , Hajime Nakahara
摘要： A wafer jig according to an embodiment may be used for a robot having a hand including a light emitting part and a light receiving part. The light receiving part detects detection light emitted from the light emitting part. The wafer jig includes a light source for emitting the notification light toward the light receiving part. The wafer jig outputs information to a hand side by emitting the notification light from the light source to the light receiving part.
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公开(公告)号：US11862507B2
公开(公告)日：2024-01-02
申请号：US17105479
申请日：2020-11-25
IPC分类号： H01L21/687 , H01L21/67
CPC分类号： H01L21/68707 , H01L21/67259 , H01L21/67265 , G05B2219/41136
摘要： A robot system according to one or more embodiments may include a robot, and a control part. The robot may include one or more joints driven by an electric motor, and can hold a wafer by a holding part. The control part gives commands to the robot for control. When the robot holds and transports the wafer with the holding part, the control part performs, based on information about the electric motor, at least one of the following: determining whether slippage has occurred between the holding part and the wafer; and estimating an amount of slippage of the wafer relative to the holding part.
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公开(公告)号：US11335578B2
公开(公告)日：2022-05-17
申请号：US16789814
申请日：2020-02-13
IPC分类号： H01L21/68 , H01L21/67 , G01N21/95 , H01L21/677
摘要： A substrate transfer apparatus of the present invention includes: a robot including a hand configured to hold a substrate, and an arm configured to move the hand; a robot control device configured to set a moving path for the hand and control the arm such that the hand moves on the moving path toward a target position; and a camera disposed so as to be able to capture an image of the substrate held by the hand located at a predetermined confirmation position. The robot control device sets the moving path so as to pass through the confirmation position, obtains an image captured by the camera when the hand is located at the confirmation position, calculates a distance between a predetermined environment and the substrate which are taken in the image, and calculates a positional deviation amount from a reference position of the substrate on the basis of the distance.
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公开(公告)号：US11315823B2
公开(公告)日：2022-04-26
申请号：US16728541
申请日：2019-12-27
发明人： Masaya Yoshida , Hajime Nakahara
IPC分类号： H01L21/68 , H01L21/683 , B25J15/06 , H01L21/687
摘要： A substrate suction-holding structure includes a conductive pad main body including an annular contact portion and a bottom wall portion closing a first vacuum chamber bottom surface surrounded by the contact portion, a conductive blade main body including an upper surface and a second vacuum chamber formed by depressing the upper surface, a conductive support column provided either on the second vacuum chamber or on the pad main body, causing the contact portion to be further on an upper side than the upper surface, and swingably supporting the pad main body with respect to the second vacuum chamber, a cover secured to the blade main body and covering the second vacuum chamber, and a suction path extending from the first vacuum chamber and passing through the bottom wall portion, the second vacuum chamber, and the blade main body in this order, the suction path connected to a vacuum source.
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公开(公告)号：US11059178B2
公开(公告)日：2021-07-13
申请号：US16234084
申请日：2018-12-27
发明人： Masaya Yoshida , Hajime Nakahara , Takao Yamaguchi , Daniel Chung
IPC分类号： B25J9/16
摘要： A position correction method includes: a step of opposing a hand to a target by moving the hand such that the hand becomes in a predetermined first initial posture; a first position detection step of detecting a position of the target from a rotation angle of a rotation axis when the target blocks a detection light by swinging the hand; a step of opposing the hand to the target by moving the hand such that the hand becomes a predetermined second initial posture different from the first initial posture; a second position detection step of detecting a position of the target from the rotation angle of the rotation axis when the target blocks the detection light by swinging the hand; and a correction amount arithmetic step of obtaining rotation angle correction amounts of the second axis and the third axis based on a difference between the position of the target acquired in the first initial posture and the position of the target acquired in the second initial posture.
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公开(公告)号：US09824908B2
公开(公告)日：2017-11-21
申请号：US14704536
申请日：2015-05-05
发明人： Hiroyuki Yoshida , Masaya Yoshida , Takao Yamaguchi , Daniel Chan
IPC分类号： G06F7/00 , H01L21/68 , H01L21/677
CPC分类号： H01L21/681 , B25J9/1664 , G05B2219/40519 , G05B2219/45031 , H01L21/67766 , Y10S901/03
摘要： In this system, regarding an conveyance object placed on a rotary table, based on positions temporarily set previously as a taking position of the disk-shaped conveyance object in a storing container and a reference position of the rotary table, information of the taking position of the conveyance object in the storing container and of the reference position of the rotary table is acquired based on information of the deviation of the conveyance object placed on the rotary table with respect to the reference position of the rotary table acquired by a sensor portion so as to teach a conveying operation of the conveyance object from the storing container to the rotary table by the robot based on the acquired position information.
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公开(公告)号：US11654578B2
公开(公告)日：2023-05-23
申请号：US17024543
申请日：2020-09-17
发明人： Masaya Yoshida , Hajime Nakahara , George Chin , Luc Nguyen
IPC分类号： B25J15/00 , B25J11/00 , H01L21/687 , B25J9/16 , B25J13/08
CPC分类号： B25J15/0014 , B25J9/1664 , B25J11/0095 , B25J13/088 , H01L21/68707
摘要： A robot system according to an embodiment may include a robot, a wafer jig that is held by the robot, a positioning base, a positional displacement detection device, a control part, and an offset acquisition part for acquiring an offset that occurs between a command position for the robot and an actual position. The positioning base includes contacting members. The wafer jig has a tapered surface. The tapered surface guides the wafer jig so that a center of the wafer jig approaches a predetermined position as a position where the taped surface contacts the contacting members is relatively higher. The robot places the wafer jig on the positioning base, then holds and conveys the wafer jig to the positional displacement detection device. The offset acquisition part acquires the offset based on a result in which the positional displacement detection device detects a positional displacement of the conveyed wafer jig.
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公开(公告)号：US11427412B2
公开(公告)日：2022-08-30
申请号：US16407601
申请日：2019-05-09
发明人： Masaya Yoshida , Avish Ashok Bharwani , Ming Zeng , Brandon Lee , Ryan Le
摘要： A robot control unit for a substrate conveying robot raises a hand from a first lower position below a first target position at which the hand picks up a substrate to a first upper position above the first target position, and displaces at least one of a plurality of joints in one direction, in a first interval from the first lower position to a first intermediate position between the first lower position and the first target position.
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