公开(公告)号：US12091636B2

公开(公告)日：2024-09-17

申请号：US17516668

申请日：2021-11-01

Applicant: KCTECH CO., LTD.

Inventor： Kyong Jin Jung ,  Ga Young Jung ,  Young Ho Yun ,  Kun Hee Park ,  Young Gon Kim ,  Yong Ho Jeong

IPC: C11D1/00 ,  C09G1/02 ,  C09K3/14 ,  C11D1/14 ,  H01L21/304

CPC classification number: C11D1/143 ,  C09G1/02 ,  C09K3/1409 ,  C11D1/004 ,  C11D2111/22 ,  H01L21/304

Abstract: A composition for dissolving abrasive particles, and a cleaning method using the composition are provided. The composition includes a sulfur-containing organic acid, a fluorine ion-containing compound, and a solvent, and a turbidity change rate (%) measured at 60° C. for 15 minutes may be in a range of −80 to −99.

公开(公告)号：US11845912B2

公开(公告)日：2023-12-19

申请号：US17416420

申请日：2019-08-07

Applicant: KCTECH CO., LTD.

Inventor： Ga Young Jung ,  Yong Ho Jeong ,  Kun Hee Park ,  Young Gon Kim ,  Young Ho Yoon ,  Young Lok Yoon

IPC: C11D1/37 ,  C11D3/20 ,  C11D1/14 ,  C11D1/34 ,  C11D3/34 ,  C11D3/36 ,  C11D11/00

CPC classification number: C11D3/2075 ,  C11D1/146 ,  C11D1/345 ,  C11D3/2093 ,  C11D3/3409 ,  C11D3/36 ,  C11D11/0047

Abstract: The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.