公开(公告)号：US20220025299A1

公开(公告)日：2022-01-27

申请号：US17381211

申请日：2021-07-21

Applicant: KCTECH CO., LTD.

Inventor： Kun Hee PARK ,  Yong Ho JEONG ,  Kyong Jin JUNG ,  Young Ho YUN

IPC: C11D3/24 ,  C11D3/00 ,  C11D1/40 ,  C11D3/37 ,  C11D11/00 ,  H01L21/306 ,  H01L21/321 ,  H01L21/304

Abstract: A cleaning solution composition and a cleaning method using the cleaning solution composition are provided. The cleaning solution composition includes a chelating agent including a first organic acid and a second organic acid, and an etching agent including a fluoride compound.

公开(公告)号：US20220145216A1

公开(公告)日：2022-05-12

申请号：US17516668

申请日：2021-11-01

Applicant: KCTECH CO., LTD.

Inventor： Kyong Jin JUNG ,  Ga Young JUNG ,  Young Ho YUN ,  Kun Hee PARK ,  Young Gon KIM ,  Yong Ho JEONG

IPC: C11D1/14 ,  C09K3/14 ,  C09G1/02 ,  C11D11/00 ,  C11D1/00

Abstract: A composition for dissolving abrasive particles, and a cleaning method using the composition are provided. The composition includes a sulfur-containing organic acid, a fluorine ion-containing compound, and a solvent, and a turbidity change rate (%) measured at 60° C. for 15 minutes may be in a range of −80 to −99.

公开(公告)号：US20220056373A1

公开(公告)日：2022-02-24

申请号：US17416420

申请日：2019-08-07

Applicant: KCTECH CO., LTD.

Inventor： Ga Young JUNG ,  Yong Ho JEONG ,  Kun Hee PARK ,  Young Gon KIM ,  Young Ho YOON ,  Young Lok YOON

IPC: C11D3/20 ,  C11D11/00 ,  C11D3/34 ,  C11D3/36 ,  C11D1/14 ,  C11D1/34

Abstract: The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.