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公开(公告)号:US20240071478A1
公开(公告)日:2024-02-29
申请号:US18504018
申请日:2023-11-07
Applicant: Kioxia Corporation
Inventor: Hideyuki KATAOKA , Yoshinao SUZUKI , Mai SHIMIZU , Kazuyoshi MURAOKA , Masami MASUDA , Yoshikazu HOSOMURA
IPC: G11C11/4096 , G11C5/06 , G11C11/4072 , G11C11/4076
CPC classification number: G11C11/4096 , G11C5/063 , G11C11/4072 , G11C11/4076
Abstract: A semiconductor memory device comprises a first memory cell and a second memory cell. The semiconductor memory device is configured to be able to perform: a first operation which is a read operation or the like to the first memory cell; and a second operation which is a read operation or the like to the second memory cell. The semiconductor memory device transitions to a standby mode after performing the first operation in response to an input of a first command set and a second command set. The semiconductor memory device performs a charge share operation after the standby mode is released in response to an input of a third command set and a fourth command set during the standby mode. The semiconductor memory device performs the second operation using at least a part of an electric charge generated when the first operation is performed.
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公开(公告)号:US20230083392A1
公开(公告)日:2023-03-16
申请号:US17680144
申请日:2022-02-24
Applicant: KIOXIA CORPORATION
Inventor: Yoshikazu HOSOMURA , Hideyuki KATAOKA , Yoshinao SUZUKI , Mai SHIMIZU , Kazuyoshi MURAOKA , Masami MASUDA
IPC: H01L27/11524 , G11C16/04 , G11C5/06 , H01L27/11519 , H01L27/11551 , H01L27/11565 , H01L27/1157 , H01L27/11578
Abstract: A semiconductor storage device includes a memory cell array having a plurality of first conductive layers stacked in a first direction and a plurality of memory cells connected to the plurality of first conductive layers, a wiring layer, and an insulating layer between the memory cell array and the wiring layer and separating the memory cell array and the wiring layer in a second direction intersecting the first direction. The wiring layer includes a plurality of second conductive layers stacked in the first direction, each of the second conductive layers having a corresponding first conductive layer at a same layer, and a contact connected to at least a part of the plurality of second conductive layers and extending in the first direction.
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