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公开(公告)号:US20240324250A1
公开(公告)日:2024-09-26
申请号:US18610282
申请日:2024-03-20
Applicant: Kioxia Corporation
Inventor: Kosuke YANAGIDAIRA , Yoshikazu HOSOMURA , Shouichi OZAKI
IPC: H10B80/00 , G11C16/04 , G11C16/10 , G11C16/16 , G11C16/26 , G11C16/34 , H01L23/00 , H01L23/522 , H01L25/065 , H01L25/18
CPC classification number: H10B80/00 , G11C16/0483 , G11C16/10 , G11C16/16 , G11C16/26 , G11C16/3445 , G11C16/3459 , H01L23/5225 , H01L24/08 , H01L25/0657 , H01L25/18 , H01L2224/08145 , H01L2924/1431 , H01L2924/14511
Abstract: According to one embodiment, a semiconductor memory includes a first chip including a substrate and a second chip bonded to the first chip. The second chip includes a first region including the memory cell array and the first shield line, and a second region including a second shield line. The first shield line is provided between the first chip and a memory cell array. The second shield line is provided in a same layer as the first shield line, and is not electrically coupled to the first shield line.
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公开(公告)号:US20210057028A1
公开(公告)日:2021-02-25
申请号:US16810910
申请日:2020-03-06
Applicant: Kioxia Corporation
Inventor: Yoshikazu HOSOMURA
IPC: G11C16/04 , G11C16/08 , G11C16/24 , H01L27/11582 , H01L27/11565
Abstract: According to the present embodiment, a semiconductor memory device includes a first memory bunch including a first source line, a first source side selecting gate transistor, a first source side selecting gate line, a plurality of first non-volatile memory cells, a plurality of first word lines, a first drain side selecting gate transistor, a first drain side selecting gate line, and a first bit line; a second memory bunch including, a second source line, a second source side selecting gate transistor, a second source side selecting gate line, a plurality of second non-volatile memory cells, a plurality of second word lines, a second drain side selecting gate transistor, a second drain side selecting gate line, and a second bit line; a common bit line; a first bit line transfer transistor; and a second bit line transfer transistor.
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公开(公告)号:US20240071478A1
公开(公告)日:2024-02-29
申请号:US18504018
申请日:2023-11-07
Applicant: Kioxia Corporation
Inventor: Hideyuki KATAOKA , Yoshinao SUZUKI , Mai SHIMIZU , Kazuyoshi MURAOKA , Masami MASUDA , Yoshikazu HOSOMURA
IPC: G11C11/4096 , G11C5/06 , G11C11/4072 , G11C11/4076
CPC classification number: G11C11/4096 , G11C5/063 , G11C11/4072 , G11C11/4076
Abstract: A semiconductor memory device comprises a first memory cell and a second memory cell. The semiconductor memory device is configured to be able to perform: a first operation which is a read operation or the like to the first memory cell; and a second operation which is a read operation or the like to the second memory cell. The semiconductor memory device transitions to a standby mode after performing the first operation in response to an input of a first command set and a second command set. The semiconductor memory device performs a charge share operation after the standby mode is released in response to an input of a third command set and a fourth command set during the standby mode. The semiconductor memory device performs the second operation using at least a part of an electric charge generated when the first operation is performed.
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公开(公告)号:US20230083392A1
公开(公告)日:2023-03-16
申请号:US17680144
申请日:2022-02-24
Applicant: KIOXIA CORPORATION
Inventor: Yoshikazu HOSOMURA , Hideyuki KATAOKA , Yoshinao SUZUKI , Mai SHIMIZU , Kazuyoshi MURAOKA , Masami MASUDA
IPC: H01L27/11524 , G11C16/04 , G11C5/06 , H01L27/11519 , H01L27/11551 , H01L27/11565 , H01L27/1157 , H01L27/11578
Abstract: A semiconductor storage device includes a memory cell array having a plurality of first conductive layers stacked in a first direction and a plurality of memory cells connected to the plurality of first conductive layers, a wiring layer, and an insulating layer between the memory cell array and the wiring layer and separating the memory cell array and the wiring layer in a second direction intersecting the first direction. The wiring layer includes a plurality of second conductive layers stacked in the first direction, each of the second conductive layers having a corresponding first conductive layer at a same layer, and a contact connected to at least a part of the plurality of second conductive layers and extending in the first direction.
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公开(公告)号:US20240324220A1
公开(公告)日:2024-09-26
申请号:US18604848
申请日:2024-03-14
Applicant: KIOXIA CORPORATION
Inventor: Yoshikazu HOSOMURA , Go OIKE , Yutaka SHIMIZU , Masaki NAKAMURA , Hironobu HAMANAKA , Hideo WADA
IPC: H10B43/27 , H01L23/00 , H01L25/065 , H01L25/18 , H10B80/00
CPC classification number: H10B43/27 , H01L24/08 , H01L25/0657 , H01L25/18 , H10B80/00 , H01L2224/08145 , H01L2924/1431 , H01L2924/14511
Abstract: A semiconductor memory device comprises: a substrate; a first wiring layer; a second wiring layer provided between the substrate and the first wiring layer; and a memory cell array layer provided between the substrate and the second wiring layer. The memory cell array layer comprises a contact extending in a first direction intersecting with a surface of the substrate. The first wiring layer has a second conductive layer that includes a connecting portion, a pad electrode portion, and a peripheral edge portion. The connecting portion is connected to one end in the first direction of the contact. The second wiring layer has: a first opening which is provided in a region including the connecting portion and the pad electrode portion of the second conductive layer; and a ring-shaped first slit which surrounds the peripheral edge portion of the second conductive layer.
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公开(公告)号:US20240090239A1
公开(公告)日:2024-03-14
申请号:US18176557
申请日:2023-03-01
Applicant: Kioxia Corporation
Inventor: Kiichi TACHI , Ryota NIHEI , Yoshikazu HOSOMURA
CPC classification number: H10B80/00 , H01L23/50 , H01L24/05 , H01L24/08 , H01L24/48 , H01L24/80 , H01L24/06 , H01L2224/05548 , H01L2224/05567 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/06181 , H01L2224/08145 , H01L2224/48463 , H01L2224/80201 , H01L2224/80357 , H01L2224/80379 , H01L2224/80895 , H01L2224/80896 , H01L2924/05442 , H01L2924/1431 , H01L2924/14511
Abstract: A semiconductor device includes a metal layer disposed above a transistor on a first substrate. The metal layer includes a first region extending in a first direction and a second region that has a width in the first direction smaller than the first region and protrudes from the first region in a second direction, and has a first corner portion having an angle larger than 180° as viewed in a third direction between a proximal end portion of the second region and the first region. The metal layer includes a first portion that is disposed within the first region and has a lower surface at a first height, and a second portion that is disposed within the second region and has a lower surface at a second height lower than the first height. A step present at a boundary between the first portion and the second portion is disposed away from an edge of the second region at a first position near the first corner portion in the second direction and adjacent to the edge of the second region at a second position away from the first corner portion than the first position.
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