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公开(公告)号:US11237119B2
公开(公告)日:2022-02-01
申请号:US15835399
申请日:2017-12-07
Applicant: KLA-Tencor Corporation
Inventor: Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Prasanti Uppaluri , Vijay Ramachandran
IPC: G01N21/95 , H01L21/67 , G05B19/418 , G01N21/88 , G06T7/00 , H01J37/22 , H01J37/28 , G01N23/04 , H01L21/66 , G06N7/00
Abstract: Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.
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公开(公告)号:US20180157933A1
公开(公告)日:2018-06-07
申请号:US15720272
申请日:2017-09-29
Applicant: KLA-Tencor Corporation
Inventor: Bjorn Brauer , Vijay Ramachandran , Richard Wallingford , Scott Allen Young
CPC classification number: G06K9/6255 , G06K9/6274 , G06K2209/19 , G06N3/0454 , G06N3/082 , G06T7/0004 , G06T7/0008 , G06T7/001 , G06T2207/20021 , G06T2207/20084 , G06T2207/30148
Abstract: Systems and methods for providing an augmented input data to a convolutional neural network (CNN) are disclosed. Wafer images are received at a processor. The wafer image is divided into a plurality of references images each associated with a die in the wafer image. Test images are received. A plurality of difference images are created by differences the test images with the reference images. The reference images and difference images are assembled into the augmented input data for the CNN and provided to the CNN.
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公开(公告)号:US10402688B2
公开(公告)日:2019-09-03
申请号:US15720272
申请日:2017-09-29
Applicant: KLA-Tencor Corporation
Inventor: Bjorn Brauer , Vijay Ramachandran , Richard Wallingford , Scott Allen Young
Abstract: Systems and methods for providing an augmented input data to a convolutional neural network (CNN) are disclosed. Wafer images are received at a processor. The wafer image is divided into a plurality of references images each associated with a die in the wafer image. Test images are received. A plurality of difference images are created by differences the test images with the reference images. The reference images and difference images are assembled into the augmented input data for the CNN and provided to the CNN.
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公开(公告)号:US20180197714A1
公开(公告)日:2018-07-12
申请号:US15835399
申请日:2017-12-07
Applicant: KLA-Tencor Corporation
Inventor: Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Prasanti Uppaluri , Vijay Ramachandran
CPC classification number: H01J37/222 , G01N23/04 , G05B19/41875 , G05B2219/32186 , G05B2219/32196 , H01J37/28 , H01J2237/22 , H01J2237/2817 , H01L21/67288
Abstract: Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.
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