公开(公告)号：US20190302031A1

公开(公告)日：2019-10-03

申请号：US16364098

申请日：2019-03-25

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Saravanan Paramasivam ,  Ankit Jain ,  Prasanti Uppaluri ,  Raghavan Konuru

IPC: G01N21/88 ,  G01N21/956 ,  G01N21/95

Abstract: Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.

公开(公告)号：US20180106732A1

公开(公告)日：2018-04-19

申请号：US15782820

申请日：2017-10-12

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Erfan Soltanmohammadi ,  Saravanan Paramasivam ,  Sairam Ravu ,  Ankit Jain ,  Sarath Shekkizhar ,  Prasanti Uppaluri

IPC: G01N21/95 ,  G01N21/88 ,  G01N21/55 ,  G06N99/00

CPC classification number: G01N21/9501 ,  G01N21/55 ,  G01N21/8803 ,  G01N21/8851 ,  G01N2021/8854 ,  G01N2021/95676 ,  G06N5/003 ,  G06N99/005

Abstract: Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.

公开(公告)号：US10796065B2

公开(公告)日：2020-10-06

申请号：US16200060

申请日：2018-11-26

Applicant: KLA-TENCOR CORPORATION

Inventor： Allen Park ,  Ankit Jain

IPC: G06F30/398 ,  G03F1/70 ,  G03F7/20 ,  G03F1/36

Abstract: Defects can be identified using a hybrid design layout that includes a printable layer and a non-printed layer. The hybrid design layout can be generated by incorporating at least a portion of the non-printable layer layout with the printable layer layout. Defects can be identified using optical or scanning electron beam images.

公开(公告)号：US20190392111A1

公开(公告)日：2019-12-26

申请号：US16200060

申请日：2018-11-26

Applicant: KLA-TENCOR CORPORATION

Inventor： Allen Park ,  Ankit Jain

IPC: G06F17/50 ,  G03F1/36 ,  G03F7/20 ,  G03F1/70

Abstract: Defects can be identified using a hybrid design layout that includes a printable layer and a non-printed layer. The hybrid design layout can be generated by incorporating at least a portion of the non-printable layer layout with the printable layer layout. Defects can be identified using optical or scanning electron beam images.

公开(公告)号：US10387601B2

公开(公告)日：2019-08-20

申请号：US15358888

申请日：2016-11-22

Applicant: KLA-Tencor Corporation

Inventor： Thirupurasundari Jayaraman ,  Srikanth Kandukuri ,  Gordon Rouse ,  Anil Raman ,  Kenong Wu ,  Praveen Gunasekaran ,  Aravindh Balaji ,  Ankit Jain

IPC: G06F17/50

Abstract: Systems and methods are disclosed for storing dynamic layer content in a design file. A design file is received having design data corresponding to a plurality of process layers. A geometric operation formula is also received. A processor generates a polygon having dynamic layer content that is formed by applying the geometric operation formula on two or more of the plurality of process layers. The updated design file is stored, the design file now having a polygon having dynamic layer content.

公开(公告)号：US10267748B2

公开(公告)日：2019-04-23

申请号：US15782820

申请日：2017-10-12

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Erfan Soltanmohammadi ,  Saravanan Paramasivam ,  Sairam Ravu ,  Ankit Jain ,  Sarath Shekkizhar ,  Prasanti Uppaluri

IPC: G06N5/00 ,  G01N21/55 ,  G01N21/88 ,  G01N21/95 ,  G06N99/00 ,  G01N21/956

Abstract: Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.

公开(公告)号：US20180204315A1

公开(公告)日：2018-07-19

申请号：US15863753

申请日：2018-01-05

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Ankit Jain

IPC: G06T7/00 ,  G06T7/70 ,  G06K9/62

CPC classification number: G06T7/001 ,  G06K9/20 ,  G06K9/6256 ,  G06K9/6267 ,  G06K9/627 ,  G06T7/0004 ,  G06T7/70 ,  G06T2200/04 ,  G06T2207/10016 ,  G06T2207/10148 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: A system, method, and non-transitory computer readable medium are provided for training and applying defect classifiers in wafers having deeply stacked layers. In use, a plurality of images generated by an inspection system for a location of a defect detected on a wafer by the inspection system are acquired. The location on the wafer is comprised of a plurality of stacked layers, and each image of the plurality of images is generated by the inspection system at the location using a different focus setting. Further, a classification of the defect is determined, utilizing the plurality of images.

公开(公告)号：US20180197714A1

公开(公告)日：2018-07-12

申请号：US15835399

申请日：2017-12-07

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Erfan Soltanmohammadi ,  Saravanan Paramasivam ,  Sairam Ravu ,  Ankit Jain ,  Prasanti Uppaluri ,  Vijay Ramachandran

IPC: H01J37/22 ,  G01N23/04 ,  H01J37/28 ,  H01L21/67

CPC classification number: H01J37/222 ,  G01N23/04 ,  G05B19/41875 ,  G05B2219/32186 ,  G05B2219/32196 ,  H01J37/28 ,  H01J2237/22 ,  H01J2237/2817 ,  H01L21/67288

Abstract: Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.

公开(公告)号：US11237119B2

公开(公告)日：2022-02-01

申请号：US15835399

申请日：2017-12-07

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Erfan Soltanmohammadi ,  Saravanan Paramasivam ,  Sairam Ravu ,  Ankit Jain ,  Prasanti Uppaluri ,  Vijay Ramachandran

IPC: G01N21/95 ,  H01L21/67 ,  G05B19/418 ,  G01N21/88 ,  G06T7/00 ,  H01J37/22 ,  H01J37/28 ,  G01N23/04 ,  H01L21/66 ,  G06N7/00

Abstract: Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.

公开(公告)号：US10964013B2

公开(公告)日：2021-03-30

申请号：US15863753

申请日：2018-01-05

Applicant: KLA-Tencor Corporation

Inventor： Martin Plihal ,  Ankit Jain

IPC: G06K9/00 ,  G06T7/00 ,  G06K9/20 ,  G06K9/62 ,  G06T7/70

Abstract: A system, method, and non-transitory computer readable medium are provided for training and applying defect classifiers in wafers having deeply stacked layers. In use, a plurality of images generated by an inspection system for a location of a defect detected on a wafer by the inspection system are acquired. The location on the wafer is comprised of a plurality of stacked layers, and each image of the plurality of images is generated by the inspection system at the location using a different focus setting. Further, a classification of the defect is determined, utilizing the plurality of images.