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公开(公告)号：US20180197714A1
公开(公告)日：2018-07-12
申请号：US15835399
申请日：2017-12-07
发明人： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Prasanti Uppaluri , Vijay Ramachandran
CPC分类号： H01J37/222 , G01N23/04 , G05B19/41875 , G05B2219/32186 , G05B2219/32196 , H01J37/28 , H01J2237/22 , H01J2237/2817 , H01L21/67288
摘要： Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.
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公开(公告)号：US08948494B2
公开(公告)日：2015-02-03
申请号：US13793709
申请日：2013-03-11
CPC分类号： G06T7/0008 , F04C2270/0421 , G06T5/50 , G06T7/0004 , G06T2207/30148
摘要： Methods and systems for generating unbiased wafer defect samples are provided. One method includes selecting the defects detected by each of multiple scans performed on a wafer that have the most diversity in one or more defect attributes such that a diverse set of defects are selected across each scan. In addition, the method may include selecting the defects such that any defect that is selected and is common to two or more of the scans is not selected twice and any defects that are selected are diverse with respect to the common, selected defect. Furthermore, no sampling, binning, or classifying of the defects may be performed prior to selection of the defects such that the sampled defects are unbiased by any sampling, binning, or classifying method.
摘要翻译： 提供了用于产生无偏置晶片缺陷样品的方法和系统。 一种方法包括选择通过在一个或多个缺陷属性中具有最多分集的晶片上执行的多次扫描中检测到的缺陷，从而跨越每个扫描选择不同的缺陷集。 此外，该方法可以包括选择缺陷，使得两个或更多个扫描选择并且是共同的任何缺陷不被选择两次，并且所选择的任何缺陷相对于共同的所选择的缺陷是多种多样的。 此外，在选择缺陷之前，可以不进行采样，分类或缺陷分类，以便通过任何采样，合并或分类方法对采样缺陷进行不偏见。
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公开(公告)号：US11237119B2
公开(公告)日：2022-02-01
申请号：US15835399
申请日：2017-12-07
发明人： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Prasanti Uppaluri , Vijay Ramachandran
IPC分类号： G01N21/95 , H01L21/67 , G05B19/418 , G01N21/88 , G06T7/00 , H01J37/22 , H01J37/28 , G01N23/04 , H01L21/66 , G06N7/00
摘要： Wafer inspection with stable nuisance rates and defect of interest capture rates are disclosed. This technique can be used for discovery of newly appearing defects that occur during the manufacturing process. Based on a first wafer, defects of interest are identified based on the classified filtered inspection results. For each remaining wafer, the defect classifier is updated and defects of interest in the next wafer are identified based on the classified filtered inspection results.
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4.发明授权公开(公告)号：US11151707B2
公开(公告)日：2021-10-19
申请号：US16277769
申请日：2019-02-15
IPC分类号： G06T7/00 , G06N3/08 , G06N3/04 , G06K9/62 , G01N23/2251
摘要： A system for defect review and classification is disclosed. The system may include a controller, wherein the controller may be configured to receive one or more training images of a specimen. The one or more training images including a plurality of training defects. The controller may be further configured to apply a plurality of difference filters to the one or more training images, and receive a signal indicative of a classification of a difference filter effectiveness metric for at least a portion of the plurality of difference filters. The controller may be further configured to generate a deep learning network classifier based on the received classification and the attributes of the plurality of training defects. The controller may be further configured to extract convolution layer filters of the deep learning network classifier, and generate one or more difference filter recipes based on the extracted convolution layer filters.
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公开(公告)号：US10692690B2
公开(公告)日：2020-06-23
申请号：US15639311
申请日：2017-06-30
IPC分类号： H01J37/00 , H01J37/244 , H01J37/28 , H01J37/20
摘要： Use of care areas in scanning electron microscopes or other review tools can provide improved sensitivity and throughput. A care area is received at a controller of a scanning electron microscope from, for example, an inspector tool. The inspector tool may be a broad band plasma tool. The care area is applied to a field of view of a scanning electron microscope image to identify at least one area of interest. Defects are detected only within the area of interest using the scanning electron microscope. The care areas can be design-based or some other type of care area. Use of care areas in SEM tools can provide improved sensitivity and throughput.
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公开(公告)号：US10670536B2
公开(公告)日：2020-06-02
申请号：US16364098
申请日：2019-03-25
IPC分类号： G01N21/88 , G01N21/95 , G01N21/956
摘要： Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
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公开(公告)号：US09983148B2
公开(公告)日：2018-05-29
申请号：US15166819
申请日：2016-05-27
CPC分类号： G01N21/9501 , G01N21/8851 , G01N2021/8858 , G05B19/00 , G05B23/0227 , G05B23/0275 , G05B2219/45031 , H01L21/67253 , H01L22/12 , H01L22/20
摘要： A method for production line monitoring during semiconductor device fabrication includes acquiring a plurality of inspection results from a plurality of reference samples with an inspection sub-system. The method includes storing the acquired inspection results and geometric pattern codes for each of the reference samples in a database. The method includes acquiring an additional inspection result from an additional sample, where the additional inspection result includes an additional set of geometric pattern codes for identifying each defect identified within the additional inspection result from the additional sample. The method also includes correlating the set of geometric pattern codes of the additional sample with the geometric pattern codes from the reference set of samples to identify at least one of one or more new patterns or one or more patterns displaying a frequency of occurrence above a selected threshold.
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8.发明申请公开(公告)号：US20200184628A1
公开(公告)日：2020-06-11
申请号：US16277769
申请日：2019-02-15
IPC分类号： G06T7/00 , G06N3/08 , G06N3/04 , G06K9/62 , G01N23/2251
摘要： A system for defect review and classification is disclosed. The system may include a controller, wherein the controller may be configured to receive one or more training images of a specimen. The one or more training images including a plurality of training defects. The controller may be further configured to apply a plurality of difference filters to the one or more training images, and receive a signal indicative of a classification of a difference filter effectiveness metric for at least a portion of the plurality of difference filters. The controller may be further configured to generate a deep learning network classifier based on the received classification and the attributes of the plurality of training defects. The controller may be further configured to extract convolution layer filters of the deep learning network classifier, and generate one or more difference filter recipes based on the extracted convolution layer filters.
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公开(公告)号：US20190302031A1
公开(公告)日：2019-10-03
申请号：US16364098
申请日：2019-03-25
IPC分类号： G01N21/88 , G01N21/956 , G01N21/95
摘要： Methods and systems for selecting a mode for inspection of a specimen are provided. One method includes determining how separable defects of interest (DOIs) and nuisances detected on a specimen are in one or more modes of an inspection subsystem. The separability of the modes for the Dais and nuisances is used to select a subset of the modes for inspection of other specimens of the same type. Other characteristics of the performance of the modes may be used in combination with the separability to select the modes. The subset of modes selected based on the separability may also be an initial subset of modes for which additional analysis is performed to determine the final subset of the modes.
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公开(公告)号：US20180106732A1
公开(公告)日：2018-04-19
申请号：US15782820
申请日：2017-10-12
发明人： Martin Plihal , Erfan Soltanmohammadi , Saravanan Paramasivam , Sairam Ravu , Ankit Jain , Sarath Shekkizhar , Prasanti Uppaluri
CPC分类号： G01N21/9501 , G01N21/55 , G01N21/8803 , G01N21/8851 , G01N2021/8854 , G01N2021/95676 , G06N5/003 , G06N99/005
摘要： Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the inspection-related algorithm to an unlabeled set of defects. The computer subsystem(s) are also configured for altering the labeled set of defects based on results of the applying. The computer subsystem(s) may then iteratively re-train the inspection-related algorithm and alter the labeled set of defects until one or more differences between results produced by a most recent version and a previous version of the algorithm meet one or more criteria. When the one or more differences meet the one or more criteria, the most recent version of the inspection-related algorithm is outputted as the trained algorithm.
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