公开(公告)号：US20180062057A1

公开(公告)日：2018-03-01

申请号：US15557087

申请日：2016-03-03

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Norbertus Antonius Maria SWEEGERS ,  Marc Andre DE SAMBER ,  Patrick ZUIDEMA

IPC: H01L33/64 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/644 ,  F21K9/232 ,  F21V19/0015 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallisations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.