摘要:
Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.
摘要:
An ultrasound transducer arrangement (100) is disclosed comprising a plurality of substrate islands (110, 120, 130) spatially separated and electrically interconnected by a flexible polymer assembly (150) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island (110) comprising a plurality of ultra sound transducer cells (112) and a second substrate island (120) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly (200) comprising a plurality of coaxial wires (220) each having a conductive core (228) covered by an electrically insulating sleeve (226); and an electrically insulating body (210) having a first main surface (211), a second main surface (213) and a plurality of through holes (212) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump (214) on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB.
摘要:
Disclosed are an imaging system (10) or an interventional tool, such as a catheter (20), having a first ultrasound transducer array (23) and a second ultrasound transducer array (21) spaced by a fixed distance (D) from each other; wherein both arrays may be used to generate diagnostic images; and a processing arrangement (31, 32) to process a first sensor signal indicative of the first array imaging a reference location (X) at a first point in time, and to process a second sensor signal indicative of the second array imaging the reference location at a second point in time; and determine a translation (pullback) speed of the catheter from the set distance and the difference between the first point in time and the second point in time. Alternatively, a catheter may be provided comprising an ultrasound transducer array at a distal end of the catheter, and two pressure sensors for determining the translation speed.
摘要:
A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.
摘要:
A CMUT transducer array comprising a first column (58) of spaced CMUT cells on at least one silicon island, a second column (58) of spaced CMUT cells on at least one further silicon island, the second column being staggered in alignment with the first column such that cells of the second column are partially located in spaces between successive cells of the first column, the first column and the second column being spaced apart by a gap, and a flexible foil retaining the respective silicon islands, the flexible foil comprising conductive interconnects.
摘要:
The present invention relates to an ultrasound transducer assembly (10), in particular for intra vascular ultrasound systems. The assembly (10) comprises a transducer array (12) including a plurality of transducer elements (14) for transmitting and receiving ultrasound waves. Two support elements (16, 18) are provided for supporting the transducer array (12) in a curved or polygonal shape. The support elements (16, 18) are connected via a flexible connection layer (20) to the transducer array (12) for flexibly connecting the support elements (16, 18) to the transducer array (12).
摘要:
The present invention relates to a minimally invasive medical instrument (100) having a proximal end (100b) and a distal end (100a) and comprising a sensor arrangement (10) arranged at the distal end (100b) of the medical instrument (100). The sensor arrangement (10) comprises a sensor (20) configured to generate sensor data in the form of an electrical sensor signal, and a data conversion device (40) configured to convert the electrical sensor signal into an optical signal and comprising an electrical input (41) for receiving the electrical sensor signal and an optical output (42) for transmitting the optical signal. The sensor arrangement (10) further comprises an optical fiber (50) configured to transmit the optical signal from the distal end (100a) to the proximal end (100b), the optical fiber (50) coupled to the output of the data conversion device (40) for receiving the optical signal, the optical fiber (50) extending from the distal end (100a) to the proximal end (100b) of the instrument (100). The present invention further relates to a method of manufacturing such a minimally invasive medical instrument (100).