公开(公告)号：US20200310016A1

公开(公告)日：2020-10-01

申请号：US16684016

申请日：2019-11-14

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young BYUN ,  So Hye CHO ,  Seung Yong LEE ,  Kwang-deok CHOI ,  In Uk BAEK ,  Yun Hee KIM

IPC: G02B5/28 ,  C23C14/08 ,  C23C14/06 ,  C23C14/00

Abstract: Provided is a coloring pattern structure. The coloring pattern structure includes: a substrate; a light-transmitting dielectric layer formed on at least one surface of the substrate; and a composite material layer disposed on an upper surface of the light-transmitting dielectric layer and formed of a metal and a first material not having a thermodynamic solid solubility in the metal, wherein the metal included in the composite material layer has a pattern coated only on portions of the upper surface of the light-transmitting dielectric layer, and the first material is coated on the remaining area where the metal is not coated.

公开(公告)号：US20230018835A1

公开(公告)日：2023-01-19

申请号：US17858391

申请日：2022-07-06

Applicant: Korea Institute of Science and Technology

Inventor： Ji Young BYUN ,  MD ABDUR RAHMAN ,  So Hye CHO ,  Seung Yong LEE ,  Hyungduk KO ,  Sung Lim CHOI ,  Dong Kyu KIM ,  Kwang-deok CHOI ,  Inuk BAEK ,  Yun Hee KIM

IPC: G02B5/28

Abstract: Provided is a high-durability coloring metal member. The high-durability coloring metal member includes a metal substrate, a dielectric layer provided on the metal substrate, and an oxynitride compound layer provided on the dielectric layer. The metal member is capable of expressing vivid and various colors with a color protection layer applied on the surface of the metal member.

公开(公告)号：US20220132676A1

公开(公告)日：2022-04-28

申请号：US17511572

申请日：2021-10-27

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young BYUN ,  Kwang-deok CHOI ,  Honguk CHEON

IPC: H05K3/38 ,  H05K3/10 ,  H05K3/06 ,  C25D5/48 ,  C23C28/02 ,  C23C18/31 ,  C23C18/18 ,  C25D5/34 ,  C23F1/02 ,  C23F17/00

Abstract: Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).