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1.
公开(公告)号:US20180282866A1
公开(公告)日:2018-10-04
申请号:US15763378
申请日:2014-05-02
Inventor: Bo-Keun PARK , Taek-Mo CHUNG , Chang-Gyoun KIM , Dong-Ju JEON , Eun-Ae JUNG
IPC: C23C16/455 , C23C16/18 , C07F15/00
Abstract: The present invention relates to a ruthenium precursor represented by Chemical Formula 1, and the ruthenium precursor has the advantages of having improved thermal stability and volatility and not having to use oxygen when depositing a thin film, and thus is capable of forming a high-quality ruthenium thin film.
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2.
公开(公告)号:US20180334471A1
公开(公告)日:2018-11-22
申请号:US15775347
申请日:2016-10-11
Inventor: Bo Keun PARK , Taek-Mo CHUNG , Dong Ju JEON , Jeong Hwan HAN , Ji Hyeun NAM , Chang Gyoun KIM , Eun Ae JUNG
IPC: C07F7/22 , C07F5/00 , C23C16/455 , C23C16/40
CPC classification number: C07F7/2224 , C07F5/00 , C07F7/22 , C23C16/06 , C23C16/407 , C23C16/455 , C23C16/45525 , H01L21/02 , H01L21/205
Abstract: The present invention relates to a novel metal precursor having improved thermal stability and volatility and can provide: a method for readily manufacturing a good quality metal oxide thin film at an excellent growth rate at low temperature by using the metal precursor; and a thin film manufactured by using the same.
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