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公开(公告)号:US10273379B2
公开(公告)日:2019-04-30
申请号:US14765628
申请日:2014-02-07
Applicant: KURARAY CO., LTD.
Inventor: Ryoichi Sasaki , Kentaro Yoshida , Mamoru Omoda , Masakazu Nakaya , Hiroyuki Ogi
IPC: C09D143/02 , C08F230/02 , B32B27/34 , B32B27/32 , B32B15/08 , B32B15/20 , B32B27/28 , B32B27/06 , B32B27/10 , B32B27/08 , B32B27/36 , G02B1/14 , B05D7/00
Abstract: A multilayer structure disclosed is a multilayer structure including at least one base (X), at least one layer (Y), and at least one layer (Z). The layer (Y) contains an aluminum atom. The layer (Z) contains a polymer (E) having a plurality of phosphorus atoms. The polymer (E) is a polymer of at least one monomer including a vinylphosphonic acid compound. The multilayer structure includes at least one pair of the layer (Y) and the layer (Z) that are contiguously stacked. The layer (Z) is formed by applying a coating liquid (V) which is a solution of the polymer (E) having a plurality of phosphorus atoms. The multilayer structure disclosed is excellent in gas barrier properties, and can maintain the gas barrier properties at a high level even when subjected to physical stresses such as deformation and impact.
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公开(公告)号:US11214696B2
公开(公告)日:2022-01-04
申请号:US16302422
申请日:2017-05-17
Applicant: KURARAY CO., LTD.
Inventor: Ryoichi Sasaki , Yasushi Morihara , Masahiko Ota , Masakazu Nakaya , Hiroyuki Ogi
IPC: C09D7/63 , B32B9/00 , C09D7/61 , A61J1/10 , B32B9/04 , B32B9/06 , B65D65/40 , B65D65/42 , B65D81/20
Abstract: The present invention relates to a multilayer structure including a base (X) and a layer (Y), wherein the layer (Y) includes an aluminum-containing compound (A) and a phosphorus compound (BH) in which a phosphorus atom having at least one hydroxy group and a polar group are bonded via an alkylene chain having 3 to 20 carbon atoms or a polyoxyalkylene chain based on an alkylene having 3 to 20 carbon atoms, and the aluminum-containing compound (A) is a compound (Ab) including a reaction product (D) of an aluminum-containing metal oxide (Aa) and an inorganic phosphorus compound (BI).
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公开(公告)号:US11692106B2
公开(公告)日:2023-07-04
申请号:US17538031
申请日:2021-11-30
Applicant: KURARAY CO., LTD.
Inventor: Ryoichi Sasaki , Yasushi Morihara , Masahiko Ota , Masakazu Nakaya , Hiroyuki Ogi
IPC: C09D7/63 , C09D7/61 , B32B9/00 , A61J1/10 , B32B9/04 , B32B9/06 , B65D65/40 , B65D65/42 , B65D81/20
CPC classification number: C09D7/63 , A61J1/10 , B32B9/00 , B32B9/045 , B32B9/06 , B65D65/40 , B65D65/42 , B65D81/2023 , C09D7/61 , B32B2307/724 , B32B2307/726 , B32B2439/70
Abstract: The present invention relates to a multilayer structure including a base (X) and a layer (Y), wherein
the layer (Y) includes an aluminum-containing compound (A) and a phosphorus compound (BH) in which a phosphorus atom having at least one hydroxy group and a polar group are bonded via an alkylene chain having 3 to 20 carbon atoms or a polyoxyalkylene chain based on an alkylene having 3 to 20 carbon atoms, and
the aluminum-containing compound (A) is a compound (Ab) including a reaction product (D) of an aluminum-containing metal oxide (Aa) and an inorganic phosphorus compound (BI).-
公开(公告)号:US10265935B2
公开(公告)日:2019-04-23
申请号:US14765957
申请日:2014-02-07
Applicant: KURARAY CO., LTD.
Inventor: Ryoichi Sasaki , Kentaro Yoshida , Mamoru Omoda , Masakazu Nakaya , Hiroyuki Ogi
IPC: B32B27/34 , B32B27/32 , B32B15/08 , B32B15/20 , B32B27/28 , B32B27/06 , B32B27/10 , B32B27/08 , B32B27/36 , C09D143/02 , B32B27/30 , C08F230/02
Abstract: A product provided includes a packaging material, and the packaging material includes a multilayer structure. The multilayer structure includes at least one base (X), at least one layer (Y), and at least one layer (Z). The layer (Y) contains an aluminum atom. The layer (Z) contains a polymer (E) containing a monomer unit having a phosphorus atom. The multilayer structure includes at least one pair of the layer (Y) and the layer (Z) that are contiguously stacked. This product is excellent in gas barrier properties, and adapted to maintain the gas barrier properties at a high level even when subjected to physical stresses such as deformation and impact.
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