公开(公告)号：US10014237B2

公开(公告)日：2018-07-03

申请号：US15535122

申请日：2015-12-14

申请人： KYOCERA Corporation

发明人： Shinichi Kooriyama ,  Narutoshi Ogawa ,  Masashi Konagai ,  Kensou Ochiai ,  Noritaka Niino

IPC分类号： H01L23/15 ,  H01L33/64 ,  H01L51/52 ,  H01L23/373 ,  H01L21/48

CPC分类号： H01L23/3735 ,  H01L21/4857 ,  H01L23/12 ,  H01L23/13 ,  H01L23/15 ,  H01L23/373 ,  H01L23/3736 ,  H01L33/641 ,  H01L51/529 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/0002 ,  H05K1/02 ,  H01L2924/00014

摘要： A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating sheet made of metal and joined to a second principal surface of the insulating substrate, the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet is at least 3.75 times the thickness of the metal circuit sheet. The size of metal grains contained in the heat dissipating sheet is smaller than the size of metal grains contained in the metal circuit sheet, and decreases with increasing distance from the second principal surface of the insulating substrate.

公开(公告)号：US10037928B2

公开(公告)日：2018-07-31

申请号：US15537684

申请日：2016-01-23

申请人： KYOCERA Corporation

发明人： Narutoshi Ogawa ,  Kensou Ochiai ,  Noritaka Niino ,  Shinichi Kooriyama ,  Masashi Konagai

IPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/14 ,  H01L23/473

CPC分类号： H01L23/367 ,  C04B37/026 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/74 ,  C04B2237/86 ,  C04B2237/88 ,  H01L23/12 ,  H01L23/142 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49833 ,  H05K1/05 ,  H05K7/20 ,  H05K7/209

摘要： A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.