公开(公告)号：US06848819B1

公开(公告)日：2005-02-01

申请号：US10009656

申请日：2000-05-12

申请人： KarlHeinz Arndt ,  Guenter Waitl ,  Georg Bogner

发明人： KarlHeinz Arndt ,  Guenter Waitl ,  Georg Bogner

IPC分类号： F21V19/00 ,  F21S8/00 ,  F21S8/04 ,  F21S8/10 ,  F21V29/00 ,  F21V29/74 ,  F21V31/03 ,  F21W101/12 ,  F21W101/14 ,  F21Y115/10 ,  G09F13/22 ,  G09F21/04 ,  H01L33/64 ,  H05K3/00 ,  F21V21/00

CPC分类号： F21V29/004 ,  F21S10/06 ,  F21S43/14 ,  F21S45/47 ,  F21V29/74 ,  F21W2111/00 ,  F21Y2115/10 ,  G09F13/22 ,  G09F21/04 ,  H01L33/64 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED array surface-mounted on a circuit board and applied to a cooling member, such that any generated heat is optimally eliminated. The cooling member can be in any desired shape so that motor vehicle lights, such as blinkers, can be adapted to the outside contour of the vehicle. For a rotating light, the circuit board can be applied around a cooling member fashioned as a hollow cylindrical member which is adapted to rotate.

摘要翻译： 一种LED阵列，其表面安装在电路板上并被施加到冷却构件上，使得任何产生的热量被最佳地消除。 冷却构件可以是任何期望的形状，使得诸如指示灯的机动车辆灯可以适应车辆的外部轮廓。 对于旋转的光，电路板可以围绕适于旋转的中空圆柱形构件的冷却构件施加。