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43 条记录 (耗时 0.026 秒)

    Housing for an optoelectronic component
    1.
    发明授权
    Housing for an optoelectronic component 有权
    光电元件外壳

    公开(公告)号：US08558271B2

    公开(公告)日：2013-10-15

    申请号：US13120348

    申请日：2009-08-31

    申请人： Karlheinz Arndt

    发明人： Karlheinz Arndt

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A housing for an optoelectronic component comprises a housing body and first and second electrical terminal strips. The first and second terminal strips extend in part inside the housing body and are guided out of the housing body at a first side face. Outside the housing body the two terminal strips are bent in such a way that they comprise a first portion extending at an angle to the first side face, and a second portion (11d, 12d) extending along and spaced from the first side face. A method for producing such a housing is also described.

    摘要翻译： 用于光电子部件的壳体包括壳体和第一和第二电端子条。 第一和第二端子条部分地延伸在壳体内部并且在第一侧面处被引导出壳体主体。 在壳体外部，两个端子条以这样的方式弯曲，使得它们包括与第一侧面成一定角度延伸的第一部分，以及沿着第一侧面并与第一侧面间隔开的第二部分（11d，12d）。 还描述了一种用于制造这种壳体的方法。

    Housing for an Optoelectronic Component
    4.
    发明申请
    Housing for an Optoelectronic Component 有权
    光电元件住房

    公开(公告)号：US20110303944A1

    公开(公告)日：2011-12-15

    申请号：US13120348

    申请日：2009-08-31

    申请人： Karlheinz Arndt

    发明人： Karlheinz Arndt

    IPC分类号： H01L33/48 ,  B29C45/14 ,  H05K5/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A housing (1) for an optoelectronic component is indicated. The housing (1) comprises a housing body (2) and first and second electrical terminal strips (11, 12), which extend in part inside the housing body (2) and are guided out of the housing body (2) at a first side face (4a). Outside the housing body (2) the two terminal strips (11, 12) are bent in such a way that they comprise a first portion (11c, 12c), which extends at an angle to the first side face (4a), and a second portion (11d, 12d), which extends with spacing (D) along the first side face (4a). A method for producing such a housing (1) is also indicated.

    摘要翻译： 指示用于光电子部件的壳体（1）。 壳体（1）包括壳体（2）和第一和第二电端子条（11,12），其部分地在壳体（2）内部延伸并且在第一和第二端部被引导出壳体（2） 侧面（4a）。 在壳体（2）的外部，两个端子条（11,12）以这样的方式弯曲，使得它们包括与第一侧面（4a）成一定角度延伸的第一部分（11c，12c） 第二部分（11d，12d），沿着第一侧面（4a）以间隔（D）延伸。 还示出了用于制造这种壳体（1）的方法。

    Conductor frame for an electronic component and method for the production thereof
    6.
    发明授权
    Conductor frame for an electronic component and method for the production thereof 有权
    电子部件用导体框架及其制造方法

    公开(公告)号：US07550827B2

    公开(公告)日：2009-06-23

    申请号：US11576054

    申请日：2005-08-08

    申请人： Karlheinz Arndt ,  Huey Ling Rena Lim ,  Georg Bogner ,  Stefan Gruber ,  Markus Schneider

    发明人： Karlheinz Arndt ,  Huey Ling Rena Lim ,  Georg Bogner ,  Stefan Gruber ,  Markus Schneider

    IPC分类号： H01L23/495 ,  H01L33/00

    CPC分类号： H01L23/49541 ,  H01L23/495 ,  H01L23/49562 ,  H01L2924/0002 ,  Y10T29/49174 ,  H01L2924/00

    摘要： Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

    摘要翻译： 公开了一种用于至少一个电子部件的引线框架，包括至少两个电引线元件，每个电引线元件包括至少一个电引线接线片和至少一个保持接线片。 在所述至少一个保持突片和所述引线元件之间设置有限定所述保持突片和所述引线元件的相邻区域之间的平行偏移的刻痕。 在引线元件和电引线接线片之间限定了额外的平行偏移，使得保持接线片和电引线接头位于共同的平面内。 该分数使得能够容易地移除保持片，而不需要在引线元件和保持片之间存在不利的冲压间隙。

    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component
    9.
    发明授权
    Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
    发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座

    公开(公告)号：US07427806B2

    公开(公告)日：2008-09-23

    申请号：US11179028

    申请日：2005-07-18

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

    IPC分类号： H01L23/20

    CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

    摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。