PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
    2.
    发明申请
    PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS 审中-公开
    等离子体处理方法和等离子体处理装置

    公开(公告)号:US20080242086A1

    公开(公告)日:2008-10-02

    申请号:US12057518

    申请日:2008-03-28

    IPC分类号: H01L21/44

    摘要: A plasma processing method, for performing a plasma process on a target substrate by generating a plasma between an upper electrode and a lower electrode facing each other by means of applying a radio frequency power therebetween, includes applying a DC voltage of a positive or negative polarity to an inner electrode of an electrostatic chuck on the lower electrode to attract and hold the target substrate thereon; and changing the positive or negative polarity of the DC voltage applied to the inner electrode of the electrostatic chuck to an opposite polarity thereto between a time when the application of the radio frequency power from the radio frequency power supply is started to perform the plasma process of the target substrate and a time when the plasma process is completed.

    摘要翻译: 一种等离子体处理方法,用于通过在上部电极和下部电极之间通过在其间施加射频电力而产生等离子体,从而在目标基板上进行等离子体处理,包括:施加正极性或负极性的直流电压 连接到下电极上的静电卡盘的内电极,以在其上吸引和保持目标基板; 并且在开始施加来自射频电源的射频功率之间的时刻开始施加到静电卡盘的内部电极的直流电压的正极性或负极性与其相反的极性,以进行等离子体处理 目标衬底和等离子体处理完成的时间。