摘要:
A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (σ/Ra) of 0.2 or less, and the rough surface of the film has (σ/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (σ) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.
摘要翻译:通过以下连续步骤制造厚度为10微米或更小的薄膜电容器薄膜:混合并制备由热塑性树脂组合物构成的成形材料; 通过T型模头将成形材料熔融并挤出成膜; 在薄膜之间夹紧和冷却具有用于形成粗糙表面的粗糙表面的压力辊和冷却辊之间,其中冷却辊的粗糙表面具有0.2以下的粗糙表面,并且粗糙表面 (&sgr。/ Ra)为0.2以下,其中(Ra)是由JIS B 0601 2001中规定的方法定义的算术平均粗糙度,(&sgr。)是标准偏差; 并将冷却的膜卷绕到卷绕单元中的卷绕管上。
摘要:
A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (σ/Ra) of 0.2 or less, and the rough surface of the film has (σ/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (σ) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.
摘要翻译:通过以下连续步骤制造厚度为10微米或更小的薄膜电容器薄膜:混合并制备由热塑性树脂组合物构成的成形材料; 通过T型模头将成形材料熔融并挤出成膜; 在薄膜之间夹紧和冷却具有用于形成粗糙表面的粗糙表面的压力辊和冷却辊之间,其中冷却辊的粗糙表面具有0.2以下的粗糙表面,并且粗糙表面 (&sgr。/ Ra)为0.2以下,其中(Ra)是由JIS B 0601 2001中规定的方法定义的算术平均粗糙度,(&sgr。)是标准偏差; 并将冷却的膜卷绕到卷绕单元中的卷绕管上。
摘要:
A film for film capacitors having a thickness of 10 microns or less, wherein the film has surface properties of (Ra) of 0.2 microns or less, (Rz/Ra) of 10 or less and a dynamic friction coefficient of 1.5 or less, where (Ra) is an arithmetic average roughness and (Rz) is a maximum height defined both by the method specified in JIS B 0601 2001. The film can be manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film; and rolling up the cooled film onto a winding tube in a winding unit.
摘要:
The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T dice 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.5 to 6 times or less as large as an average thickness of the film 2 for a film capacitor, which is provided between the extruding equipment 10 and the T dice 20; and a thickness of the film 2 for a film capacitor is controlled to 10 μm or less.
摘要:
When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.
摘要:
When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.
摘要:
A compound of the formula (I): wherein R1 is hydrogen, halogen, carbamoyl, cyano, formyl, or lower alkyl optionally substituted with halogen, amino or a protected amino; R2 is hydrogen, halogen, cyano or lower alkoxy; R3 is phenyl or pyridyl, each of which is substituted with lower alkoxy; and R4 is lower alkoxy; provided that either R1 or R2 is hydrogen, then the other is other than hydrogen, or its salts, which are useful as a medicament.
摘要翻译:式(I)的化合物:其中R 1是氢,卤素,氨基甲酰基,氰基,甲酰基或任选被卤素,氨基或被保护的氨基取代的低级烷基; R 2是氢,卤素,氰基或低级烷氧基; R 3是苯基或吡啶基,各自被低级烷氧基取代; R 4是低级烷氧基; 条件是R 1或R 2 2都是氢,则另一个不是用作药物的氢或其盐。
摘要:
This invention relates to piperazine derivatives of the formula: wherein each symbol is as defined in the description, and its pharmaceutically acceptable salt, to processes for preparation thereof, to pharmaceutical composition comprising the same, and to a use of the same for treating or preventing Tachykinin-mediated diseases in human being or animals.
摘要:
This invention relates to piperazine derivatives of the formula: wherein each symbol is as defined in the description, and its pharmaceutically acceptable salt, to processes for preparation thereof, to pharmaceutical composition comprising the same, and to a use of the same for treating or preventing Tachykinin-mediated diseases in human being or animals.
摘要:
A quinazolinone derivatives having poly (adenosine 5′-diphospho-ribose) polymerase (PARP) inhibitory activity represented by the formula (I): wherein R1 is substituted cyclic amino groups or optionally substituted amino group, R2 is substituent, n means an integer of 0 to 4, and L1 is (1) cyclo (lower) alkylene, (2) cyclo (lower) alkenylene, (3) diradical of saturated- or unsaturated monocyclic group with one or more nitrogen atom(s), which is obtained after removal of one hydrogen atom from said monocyclic group, or (4) —N(R3)—L2— (wherein R3 is hydrogen or lower alkyl, and L2 is lower alkylene or lower alkenylene), or its prodrug, or a salt thereof.