Non-volatile semiconductor memory device and process for fabricating the same
    2.
    发明授权
    Non-volatile semiconductor memory device and process for fabricating the same 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US06885060B2

    公开(公告)日:2005-04-26

    申请号:US10101191

    申请日:2002-03-19

    摘要: A non-volatile semiconductor memory device comprising a first conductive semiconductor having steps on a surface thereof, a second conductive semiconductor region formed on an upper portion and a bottom portion of each of the steps and being separated in a direction perpendicular to the main surface of the first conductive semiconductor to function as a source or a drain, a gate dielectric film containing therein charge storage means which is spatially discrete and being formed on the first conductive semiconductor so as to coat at least a sidewall of each of the steps, and a gate electrode formed on the gate dielectric film. Accordingly, there are provided a non-volatile semiconductor memory device which suffers almost no deterioration in the properties and can perform the operation of recording of 2 bits per unit memory device even when the size of the semiconductor memory device in the semiconductor substrate is scaled down, and a process for fabricating the non-volatile semiconductor memory device.

    摘要翻译: 一种非易失性半导体存储器件,包括在其表面上具有台阶的第一导电半导体区,形成在每个台阶的上部和底部上的第二导电半导体区域,并且沿垂直于主表面的方向分离 用作源极或漏极的第一导电半导体,其中包含电荷存储装置的栅极电介质膜,空间上离散并形成在第一导电半导体上,以便涂覆至少每一个步骤的侧壁,以及 栅电极形成在栅极电介质膜上。 因此,提供了几乎不会劣化的性能的非易失性半导体存储器件,并且即使当半导体衬底中的半导体存储器件的尺寸缩小时也可以执行每单位存储器件的2位的记录操作 ,以及用于制造非易失性半导体存储器件的工艺。

    Non-volatile semiconductor memory device and process for fabricating the same

    公开(公告)号:US07049655B2

    公开(公告)日:2006-05-23

    申请号:US11093376

    申请日:2005-03-30

    IPC分类号: H01L29/788

    摘要: A non-volatile semiconductor memory device comprising a first conductive semiconductor having steps on a surface thereof, a second conductive semiconductor region formed on an upper portion and a bottom portion of each of the steps and being separated in a direction perpendicular to the main surface of the first conductive semiconductor to function as a source or a drain, a gate dielectric film containing therein charge storage means which is spatially discrete and being formed on the first conductive semiconductor so as to coat at least a sidewall of each of the steps, and a gate electrode formed on the gate dielectric film. Accordingly, there are provided a non-volatile semiconductor memory device which suffers almost no deterioration in the properties and can perform the operation of recording of 2 bits per unit memory device even when the size of the semiconductor memory device in the semiconductor substrate is scaled down, and a process for fabricating the non-volatile semiconductor memory device.

    Non-volatile semiconductor memory device and process for fabricating the same

    公开(公告)号:US07034356B2

    公开(公告)日:2006-04-25

    申请号:US11094680

    申请日:2005-03-30

    IPC分类号: H01L23/788

    摘要: A non-volatile semiconductor memory device comprising a first conductive semiconductor having steps on a surface thereof, a second conductive semiconductor region formed on an upper portion and a bottom portion of each of the steps and being separated in a direction perpendicular to the main surface of the first conductive semiconductor to function as a source or a drain, a gate dielectric film containing therein charge storage means which is spatially discrete and being formed on the first conductive semiconductor so as to coat at least a sidewall of each of the steps, and a gate electrode formed on the gate dielectric film. Accordingly, there are provided a non-volatile semiconductor memory device which suffers almost no deterioration in the properties and can perform the operation of recording of 2 bits per unit memory device even when the size of the semiconductor memory device in the semiconductor substrate is scaled down, and a process for fabricating the non-volatile semiconductor memory device.

    Non-volatile semiconductor memory device and process for fabricating the same

    公开(公告)号:US20050167735A1

    公开(公告)日:2005-08-04

    申请号:US11093376

    申请日:2005-03-30

    摘要: A non-volatile semiconductor memory device comprising a first conductive semiconductor having steps on a surface thereof, a second conductive semiconductor region formed on an upper portion and a bottom portion of each of the steps and being separated in a direction perpendicular to the main surface of the first conductive semiconductor to function as a source or a drain, a gate dielectric film containing therein charge storage means which is spatially discrete and being formed on the first conductive semiconductor so as to coat at least a sidewall of each of the steps, and a gate electrode formed on the gate dielectric film. Accordingly, there are provided a non-volatile semiconductor memory device which suffers almost no deterioration in the properties and can perform the operation of recording of 2 bits per unit memory device even when the size of the semiconductor memory device in the semiconductor substrate is scaled down, and a process for fabricating the non-volatile semiconductor memory device.

    Non-volatile semiconductor memory device and process for fabricating the same

    公开(公告)号:US07074675B2

    公开(公告)日:2006-07-11

    申请号:US11043671

    申请日:2005-01-26

    IPC分类号: H01L21/336 H01L21/8247

    摘要: A non-volatile semiconductor memory device comprising a first conductive semiconductor having steps on a surface thereof, a second conductive semiconductor region formed on an upper portion and a bottom portion of each of the steps and being separated in a direction perpendicular to the main surface of the first conductive semiconductor to function as a source or a drain, a gate dielectric film containing therein charge storage means which is spatially discrete and being formed on the first conductive semiconductor so as to coat at least a sidewall of each of the steps, and a gate electrode formed on the gate dielectric film. Accordingly, there are provided a non-volatile semiconductor memory device which suffers almost no deterioration in the properties and can perform the operation of recording of 2 bits per unit memory device even when the size of the semiconductor memory device in the semiconductor substrate is scaled down, and a process for fabricating the non-volatile semiconductor memory device.

    Non-volatile semiconductor memory device and process for fabricating the same

    公开(公告)号:US07057233B2

    公开(公告)日:2006-06-06

    申请号:US11093377

    申请日:2005-03-30

    IPC分类号: H01L29/788

    摘要: A non-volatile semiconductor memory device comprising a first conductive semiconductor having steps on a surface thereof, a second conductive semiconductor region formed on an upper portion and a bottom portion of each of the steps and being separated in a direction perpendicular to the main surface of the first conductive semiconductor to function as a source or a drain, a gate dielectric film containing therein charge storage means which is spatially discrete and being formed on the first conductive semiconductor so as to coat at least a sidewall of each of the steps, and a gate electrode formed on the gate dielectric film. Accordingly, there are provided a non-volatile semiconductor memory device which suffers almost no deterioration in the properties and can perform the operation of recording of 2 bits per unit memory device even when the size of the semiconductor memory device in the semiconductor substrate is scaled down, and a process for fabricating the non-volatile semiconductor memory device.