-
1.发明申请公开(公告)号：US20120241211A1
公开(公告)日：2012-09-27
申请号：US13419253
申请日：2012-03-13
CPC分类号： H03H9/6483 , H01L2224/16 , H01L2224/73204 , H03H9/1064 , Y10T29/49124
摘要： An electronic component includes: a substrate; a functional portion provided on the substrate; an interconnection line provided on the substrate and electrically connected to the functional portion; a metal wall provided on the substrate so as to surround the functional portion and the interconnection line; and a seal portion that contacts the metal wall and covers the functional portion and the interconnection line so as to define a cavity above the functional portion, the seal portion being made of liquid polymer.
摘要翻译： 电子部件包括：基板; 设置在所述基板上的功能部; 布线，设置在所述基板上并与所述功能部电连接; 金属壁，设置在所述基板上，以围绕所述功能部分和所述互连线; 以及密封部分，其与所述金属壁接触并且覆盖所述功能部分和所述互连线以便在所述功能部分上方限定空腔，所述密封部分由液体聚合物制成。
-
公开(公告)号：US20120297595A1
公开(公告)日：2012-11-29
申请号：US13480253
申请日：2012-05-24
IPC分类号： H01L41/00
CPC分类号： H01L41/338 , H01L21/568 , H01L24/97 , H01L2224/04105 , H01L2224/11 , H01L2224/12105 , H01L2224/96 , H01L2924/18162 , H03H3/08 , H03H9/0576
摘要： A method for manufacturing an acoustic wave device includes: adhering wafer-shaped first and second piezoelectric substrates to a front face of a first and second adhesive sheet respectively and dividing the first and the second piezoelectric substrates into rectangles; adhering a third and fourth adhesive sheet to the first and second piezoelectric substrates respectively and moving at least one divided portions of the first and second piezoelectric substrates selectively to the third and fourth adhesive sheet respectively; moving the first piezoelectric substrate on the first adhesive sheet to the fourth adhesive sheet; and moving the second piezoelectric substrate on the second adhesive sheet to the third adhesive sheet.
摘要翻译： 声波装置的制造方法包括：将晶片状的第一和第二压电基板分别粘合到第一和第二粘合片的正面，并将第一和第二压电基片分成矩形; 将第三和第四粘合片分别粘附到第一和第二压电基片上，并将第一和第二压电基片的至少一个分割部分分别选择性地移动到第三和第四粘合片; 将第一粘合片上的第一压电基板移动到第四粘合片; 并将第二粘合片上的第二压电基板移动到第三粘合片。
-
搜索结果
2 条记录 (耗时 0.019 秒)
